JPH0743566A - Optical package - Google Patents

Abstract

PURPOSE:To make it possible to facilitate production stages, to connect an optical fiber with low loss and high accuracy and to further surely and perfectly hermetically seal the fiber by packing an adhesive member which turns into an elastic material when solidified into a groove for the optical fiber and joining groove to integrate a packaging body and a cover, thereby fixing the optical fiber to the groove for the optical fiber. CONSTITUTION:The optical fiber B is placed on the groove 3 for the optical fiber of the packaging body 1 in alignment to a desired position. The adhesive member 6 which turns into the elastic material when solidified is packed into the groove 5 for joining an the groove 3 for the optical fiber. The cover 2 is mated with the packaging body 1 so as to cover the packaging body from above and the packaging body and the cover 2 are joined. The adhesive member 6 which turns the elastic material when solidified turns into the elastic material 7 which integrates the packaging body 1 and the cover 2. Simultaneously, the optical fiber B is temporally fixed in the groove 3 for the optical fiber and thereafter the part not packed by the elastic material 7 of the groove 3 for the optical fiber is packed by an adhesive 8, by which the optical fiber B is fixed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electric system circuit formed on one surface, electrically coupled to the electric system circuit on the other surface, and converting an optical signal into an electric signal or an electric signal into an optical signal. The present invention relates to an optical package for connecting an optical integrated circuit chip on which an optical element for converting into a signal is formed and an optical fiber.

[0002]

2. Description of the Related Art A conventional optical package, as shown in the schematic perspective view of FIG. 3, includes a mounting body 11 having a groove 13 for mounting an optical fiber and a lead pin 14 connected to an optical integrated circuit chip. As a method of fixing the optical fiber to the mounting body 11, which comprises a lid body 12 that covers the upper surface of the mounting body 11, an optical integrated circuit chip is mounted, and the groove 13 and the surface of the optical fiber are metalized to form the groove 13 in the groove 13. After mounting the optical fiber, a method of soldering and fixing in the groove 13 or a method of integrating the mounting body 11 and the lid body 12 with low melting point glass or resin as an adhesive at the same time in the groove 13 There is also a method of fixing the optical fiber (see Japanese Utility Model Laid-Open No. 61-176512).

[0003]

However, the conventional groove 1 is used.
3 and the surface of the optical fiber are metalized, and the method of mounting the optical fiber in the groove 13 and then fixing by soldering in the groove 13 requires metallization on the surface of the optical fiber. In order to prevent oxidation and deterioration of the optical integrated circuit chip, it is necessary to mix a fluid containing no hydrogen or oxygen into the inside of the optical package to completely seal the optical fiber. It is necessary to use the one with the diameter stored in the groove 1
There is a problem in that the optical fiber cannot be positioned with high accuracy due to a slight movable state within 3 and variations in the metal layer itself after placement or unevenness in the metal layer during soldering. It was

Further, in the conventional method of fixing the optical fiber in the groove 13 at the same time when the mounting body 11 and the lid body 12 are integrated by using a low melting point glass or resin as an adhesive, the adhesive is fused. Therefore, the optical integrated circuit chip has poor heat resistance and is damaged after ten and a few seconds at about 200 ° C. to fix the optical integrated circuit chip to the mounting body 11. There was a problem that the solder used was peeled off. Further, when an epoxy resin is used, there is a problem that a gas that oxidizes and deteriorates the optical integrated circuit chip at the time of fixing is generated and the gas enters the inside of the optical package.

[0005]

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and provides an optical package including a mounting body for mounting an optical integrated circuit chip and a lid body for covering the upper surface of the mounting body. An optical fiber groove on which the optical fiber is mounted on the mounting body, and a bonding groove that intersects with the optical fiber groove on the joint surface of the mounting body with the lid body. An optical package in which the adhesive member is filled in the groove for optical fiber and the groove for joining, the mounting body and the lid are integrated, and the optical fiber is fixed in the groove for optical fiber.

[0006]

According to the present invention, the mounting body is provided with the optical fiber groove and the joining groove and is filled with an adhesive member that becomes an elastic body when solidified, so that the mounting body and the lid are secured by the elastic body having a certain volume. The body and the body are integrated, and at the same time, the optical fiber is fixed in the groove for the optical fiber.

[0007]

EXAMPLES Examples of the present invention will be described below. Figure 1
As shown in the perspective schematic view of (a) and the partial schematic cross-sectional view of (b), the optical package includes a mounting body 1 on which the optical integrated circuit chip A is mounted, and a lid body 2 which covers the mounting body 1 from the upper surface. . The mounting body 1 has an optical fiber groove 3 for fixing the optical fiber B, a lead pin 4 for connecting an electric signal of the optical integrated circuit chip A to the outside, and an optical fiber groove 3 on the joint surface with the lid 2. The joining grooves 5 are provided so as to intersect with each other.

When manufacturing an optical package, as shown in FIG.
As shown in the cross-sectional view of FIG.
As shown in the sectional view of (b), the bonding groove 5 and the optical fiber groove 3 are filled with an adhesive member 6 which becomes an elastic body when solidified,
As shown in the cross-sectional view of FIG. 2C, the mounting body 1 and the lid body 2 are joined together so as to cover the lid body 2 from above. Then, as shown in the cross-sectional view of FIG. 2D, the adhesive member 6 that becomes an elastic body when solidified becomes an elastic body 7, and the mounting body 1 and the lid body 2 are integrated, and at the same time, the optical fiber B is connected to the optical fiber B. After being temporarily fixed in the working groove 3, the portion of the optical fiber groove 3 which is not filled with the elastic body 7 is filled with the adhesive 8 to fix the optical fiber B.

In this way, the mounting body 1 and the lid body 2 are integrated,
Since the temporary fixing of the optical fiber B is performed by using the adhesive member that solidifies at room temperature, the manufacturing process is facilitated, and the optical integrated circuit chip A is not damaged and the solder is not peeled off due to high temperature. Further, the optical fiber B can be temporarily fixed by the adhesive member 6 which becomes an elastic body when it is solidified while being placed in the optical fiber groove 3, so that low-loss and high-precision connection can be performed. Further, the adhesive 8 to be filled later can more securely seal the optical package and fix the optical fiber B. When the elastic body 7 is generated, no gas is generated, so that the inside of the optical package is not affected. Further, since the elastic body 7 can secure a certain volume by the joining groove 5, the lid 2 is joined in a state of being subtly deformed by an external force when the mounting body 1 and the lid 2 are integrated. Even when a force that returns to the original state is generated after being integrated, the elastic body 7 can be stretched while being adhered to the mounting body 1 and the lid body 2 without being cut, and the mounting body 1 and the lid body 2 can be extended. Even if there is a gap between the two, the elastic body 7 can completely seal.

In this embodiment, one square groove is provided as the joining groove 5 on the joining surface with the lid body 2. However, after joining, it is completely sealed and the elastic body 7 has a preferable volume. Any shape and any number may be used as long as the width and depth are sufficient. The optical fiber groove 3 is
Any shape may be used as long as it can mount the optical fiber B. Then, as the adhesive member 6 which becomes an elastic body when solidified, one having a property of changing from a viscous substance to an elastic substance by a crosslinking reaction at room temperature may be used, such as silicon. Further, the adhesive 8 may be any adhesive as long as it fixes the optical fiber B.

[0011]

As described above, according to the optical package of the present invention, the optical fiber groove on which the optical fiber is mounted on the mounting body, and the optical fiber groove on the joint surface between the mounting body and the lid body. The optical fiber groove and the bonding groove are filled with an adhesive member that has an intersecting bonding groove, and becomes an elastic body when solidified, and the mounting body and the lid body are integrated, and the optical fiber is an optical fiber. By fixing in the fiber groove, the manufacturing process is easy, the optical integrated circuit chip is not damaged when the mounting body and the lid are integrated, the solder is not peeled off, and gas is not generated. In addition, the optical fiber can be connected with low loss and high accuracy, and when the lid is integrated under a slight fluctuation due to external force, or a gap is created between the mount and the lid. Even if there is a part that is completely sealed It is possible to provide a wear light package.

[Brief description of drawings]

1A and 1B are views showing an optical package of the present invention, FIG. 1A is a schematic perspective view, and FIG. 1B is a partially enlarged schematic sectional view.

FIG. 2 is a schematic sectional view showing a process of manufacturing the optical package of the present invention.

FIG. 3 is a schematic perspective view showing a conventional optical package.

[Explanation of symbols]

 1, 11: Mounted body 2, 12: Lid body 3: Optical fiber groove 4, 14: Lead pin 5: Joining groove 6: Adhesive member that becomes an elastic body when solidified 7: Elastic body 8: Adhesive 13: Groove A : Optical integrated circuit chip B: Optical fiber

Claims (1)

[Claims] 1. An optical package comprising a mounting body for mounting an optical integrated circuit chip and a lid for covering an upper surface of the mounting body, an optical fiber groove for mounting an optical fiber on the mounting body, and the mounting. A joint groove intersecting the optical fiber groove is provided on the joint surface of the body with the lid, and an adhesive member that becomes an elastic body when solidified is filled in the optical fiber groove and the joint groove to mount the package. An optical package in which a body and a lid are integrated and an optical fiber is fixed in an optical fiber groove.