JPH0320900B2 - - Google Patents

Info

Publication number
JPH0320900B2
JPH0320900B2 JP3358282A JP3358282A JPH0320900B2 JP H0320900 B2 JPH0320900 B2 JP H0320900B2 JP 3358282 A JP3358282 A JP 3358282A JP 3358282 A JP3358282 A JP 3358282A JP H0320900 B2 JPH0320900 B2 JP H0320900B2
Authority
JP
Japan
Prior art keywords
wire
thin metal
tension
metal wire
path
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3358282A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58151038A (ja
Inventor
Hitoshi Fujimoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP57033582A priority Critical patent/JPS58151038A/ja
Publication of JPS58151038A publication Critical patent/JPS58151038A/ja
Publication of JPH0320900B2 publication Critical patent/JPH0320900B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/01551
    • H10W72/07141
    • H10W72/07168
    • H10W72/07502
    • H10W72/07511
    • H10W72/552

Landscapes

  • Wire Bonding (AREA)
JP57033582A 1982-03-02 1982-03-02 ワイヤボンデイング装置 Granted JPS58151038A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57033582A JPS58151038A (ja) 1982-03-02 1982-03-02 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57033582A JPS58151038A (ja) 1982-03-02 1982-03-02 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS58151038A JPS58151038A (ja) 1983-09-08
JPH0320900B2 true JPH0320900B2 (cg-RX-API-DMAC10.html) 1991-03-20

Family

ID=12390514

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57033582A Granted JPS58151038A (ja) 1982-03-02 1982-03-02 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS58151038A (cg-RX-API-DMAC10.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5984533A (ja) * 1982-11-08 1984-05-16 Hitachi Tokyo Electronics Co Ltd ワイヤ供給機構
JPH0254947A (ja) * 1988-08-19 1990-02-23 Hitachi Ltd 半導体装置の組立方法およびそれに用いる装置
TWI875367B (zh) * 2023-12-11 2025-03-01 矽品精密工業股份有限公司 防繞錯線裝置、銲線機及其偵測系統

Also Published As

Publication number Publication date
JPS58151038A (ja) 1983-09-08

Similar Documents

Publication Publication Date Title
US6581283B2 (en) Method for forming pin-form wires and the like
CN102054718B (zh) 用于导线键合机的自动导线进给系统
HK28596A (en) Wire bonding
US5285949A (en) Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method
US4019669A (en) Wire bonding apparatus
JPH0320900B2 (cg-RX-API-DMAC10.html)
JPH0225044A (ja) ワイヤーボンダーの酸化防止システム
JP2617541B2 (ja) ワイヤーボンディング装置
JP3478510B2 (ja) ワイヤボンディング装置
US7360675B2 (en) Wire bonder for ball bonding insulated wire and method of using same
KR100273237B1 (ko) 반도체패키지의와이어본딩공정용와이어공급장치
JPS61229776A (ja) 細線の送給装置
JPS58162463A (ja) 金属細線自動送り装置
JPH03253045A (ja) ワイヤボンディング装置
JPS63289825A (ja) 半導体製造装置
JPS6217856B2 (cg-RX-API-DMAC10.html)
JPH0248122A (ja) ワイヤ放電加工装置
JPS5968937A (ja) ワイヤボンダ−におけるワイヤテンシヨン方法
KR0166819B1 (ko) 와이어 본딩머신의 와이어 공급장치
JPS6298628A (ja) 案内装置
JPS6325936A (ja) ワイヤボンデイング装置
JPS61208835A (ja) ワイヤボンデイング装置
JPS62220235A (ja) 伸線方法
JPS6141231Y2 (cg-RX-API-DMAC10.html)
JPS5823932B2 (ja) ワイヤボンデイングソウチ