JPH0320069B2 - - Google Patents

Info

Publication number
JPH0320069B2
JPH0320069B2 JP28014884A JP28014884A JPH0320069B2 JP H0320069 B2 JPH0320069 B2 JP H0320069B2 JP 28014884 A JP28014884 A JP 28014884A JP 28014884 A JP28014884 A JP 28014884A JP H0320069 B2 JPH0320069 B2 JP H0320069B2
Authority
JP
Japan
Prior art keywords
cooling body
metal cooling
fixed
control means
power semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP28014884A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61159755A (ja
Inventor
Kenji Iimura
Tatsuo Yamazaki
Yoichi Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Power Semiconductor Device Ltd
Original Assignee
Hitachi Ltd
Hitachi Haramachi Electronics Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Haramachi Electronics Ltd filed Critical Hitachi Ltd
Priority to JP28014884A priority Critical patent/JPS61159755A/ja
Publication of JPS61159755A publication Critical patent/JPS61159755A/ja
Publication of JPH0320069B2 publication Critical patent/JPH0320069B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP28014884A 1984-12-29 1984-12-29 半導体装置 Granted JPS61159755A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28014884A JPS61159755A (ja) 1984-12-29 1984-12-29 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28014884A JPS61159755A (ja) 1984-12-29 1984-12-29 半導体装置

Publications (2)

Publication Number Publication Date
JPS61159755A JPS61159755A (ja) 1986-07-19
JPH0320069B2 true JPH0320069B2 (de) 1991-03-18

Family

ID=17620993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28014884A Granted JPS61159755A (ja) 1984-12-29 1984-12-29 半導体装置

Country Status (1)

Country Link
JP (1) JPS61159755A (de)

Also Published As

Publication number Publication date
JPS61159755A (ja) 1986-07-19

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