JPH0319145B2 - - Google Patents
Info
- Publication number
- JPH0319145B2 JPH0319145B2 JP59064639A JP6463984A JPH0319145B2 JP H0319145 B2 JPH0319145 B2 JP H0319145B2 JP 59064639 A JP59064639 A JP 59064639A JP 6463984 A JP6463984 A JP 6463984A JP H0319145 B2 JPH0319145 B2 JP H0319145B2
- Authority
- JP
- Japan
- Prior art keywords
- guide
- prepreg
- stacked
- sheet materials
- prepregs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H3/00—Separating articles from piles
- B65H3/46—Supplementary devices or measures to assist separation or prevent double feed
- B65H3/50—Elements, e.g. fingers, plates, rollers, inserted or traversed between articles to be separated and remainder of the pile
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Sheets, Magazines, And Separation Thereof (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6463984A JPS60204537A (ja) | 1984-03-30 | 1984-03-30 | シ−ト材料を取り出す方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6463984A JPS60204537A (ja) | 1984-03-30 | 1984-03-30 | シ−ト材料を取り出す方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60204537A JPS60204537A (ja) | 1985-10-16 |
| JPH0319145B2 true JPH0319145B2 (enExample) | 1991-03-14 |
Family
ID=13264037
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6463984A Granted JPS60204537A (ja) | 1984-03-30 | 1984-03-30 | シ−ト材料を取り出す方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60204537A (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02255436A (ja) * | 1989-07-31 | 1990-10-16 | Maruishi Seisakusho:Kk | 紙送出装置 |
| JP2500208Y2 (ja) * | 1990-03-26 | 1996-06-05 | 日立化成工業株式会社 | プリプレグの取出し装置 |
| US5556505A (en) * | 1994-07-05 | 1996-09-17 | Ford Motor Company | Windshield assembly system |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147741U (enExample) * | 1974-10-08 | 1976-04-09 | ||
| JPS5213738U (enExample) * | 1975-07-16 | 1977-01-31 | ||
| JPS5716054A (en) * | 1980-07-03 | 1982-01-27 | Kuraray Co Ltd | Mica powder-filled molding resin composition |
-
1984
- 1984-03-30 JP JP6463984A patent/JPS60204537A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60204537A (ja) | 1985-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |