JPH031891Y2 - - Google Patents
Info
- Publication number
- JPH031891Y2 JPH031891Y2 JP1985150203U JP15020385U JPH031891Y2 JP H031891 Y2 JPH031891 Y2 JP H031891Y2 JP 1985150203 U JP1985150203 U JP 1985150203U JP 15020385 U JP15020385 U JP 15020385U JP H031891 Y2 JPH031891 Y2 JP H031891Y2
- Authority
- JP
- Japan
- Prior art keywords
- ceramic substrate
- metal
- metal pin
- ceramic
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000919 ceramic Substances 0.000 claims description 93
- 229910052751 metal Inorganic materials 0.000 claims description 91
- 239000002184 metal Substances 0.000 claims description 91
- 239000000758 substrate Substances 0.000 claims description 79
- 238000009429 electrical wiring Methods 0.000 description 6
- 238000005219 brazing Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000011230 binding agent Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 4
- 229910052721 tungsten Inorganic materials 0.000 description 4
- 239000010937 tungsten Substances 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- PCEXQRKSUSSDFT-UHFFFAOYSA-N [Mn].[Mo] Chemical compound [Mn].[Mo] PCEXQRKSUSSDFT-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910017709 Ni Co Inorganic materials 0.000 description 1
- 229910003267 Ni-Co Inorganic materials 0.000 description 1
- 229910003262 Ni‐Co Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Multi-Conductor Connections (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985150203U JPH031891Y2 (US20020167097A1-20021114-C00005.png) | 1985-09-30 | 1985-09-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985150203U JPH031891Y2 (US20020167097A1-20021114-C00005.png) | 1985-09-30 | 1985-09-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6258864U JPS6258864U (US20020167097A1-20021114-C00005.png) | 1987-04-11 |
| JPH031891Y2 true JPH031891Y2 (US20020167097A1-20021114-C00005.png) | 1991-01-21 |
Family
ID=31066130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985150203U Expired JPH031891Y2 (US20020167097A1-20021114-C00005.png) | 1985-09-30 | 1985-09-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031891Y2 (US20020167097A1-20021114-C00005.png) |
-
1985
- 1985-09-30 JP JP1985150203U patent/JPH031891Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6258864U (US20020167097A1-20021114-C00005.png) | 1987-04-11 |
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