JPH03188269A - Device for melting vapor depositing material of vapor deposition device - Google Patents

Device for melting vapor depositing material of vapor deposition device

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Publication number
JPH03188269A
JPH03188269A JP32663589A JP32663589A JPH03188269A JP H03188269 A JPH03188269 A JP H03188269A JP 32663589 A JP32663589 A JP 32663589A JP 32663589 A JP32663589 A JP 32663589A JP H03188269 A JPH03188269 A JP H03188269A
Authority
JP
Japan
Prior art keywords
vapor deposition
crucible
deposition material
energy beam
evaporation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32663589A
Other languages
Japanese (ja)
Inventor
Masao Ueda
雅夫 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinmaywa Industries Ltd
Original Assignee
Shin Meiva Industry Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Meiva Industry Ltd filed Critical Shin Meiva Industry Ltd
Priority to JP32663589A priority Critical patent/JPH03188269A/en
Publication of JPH03188269A publication Critical patent/JPH03188269A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To uniformly melt a material for vapor deposition and to enhance the quality of vapor deposition by disposing an image pickup device so as to diametrically face a crucible and controlling the irradiation mechanism of an energy beam by the output obtd. by computer processing of images. CONSTITUTION:A television camera 10 is disposed to face a photographing window 7 above the ceiling of a vapor deposition chamber 1 diametrically facing the crucible 2. A granular material 3 to be evaporated is put into the crucible 2. The video signal of the television camera 10 is inputted to a computer and is binarized to obtain image data. An irradiation pattern is determined from this data. Position and posture commands are then emitted to the controller of an irradiation mechanism 4 for an electron beam. The initial state of the material for vapor deposition and the melting state during the course of the evaporation are recognized as the image data according to these states and only the non-melted part is irradiated with the electron beam and, therefore, the evaporation is uniform and the vapor deposition is uniform and good in quality as well.

Description

【発明の詳細な説明】 (産業上の利用分野) この発明は、成膜などに使用される蒸着装置における蒸
着材料の溶解を制御する装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Industrial Application Field) The present invention relates to a device for controlling the dissolution of a vapor deposition material in a vapor deposition apparatus used for film formation or the like.

(従来の技術) 半導体デバイ・スだけでなく、眼鏡やカメラレンズの反
射防止膜など製品表面に薄膜を形成することが広(行わ
れており、薄膜の形成方法にもいろいろなものがある。
(Prior Art) Thin films are widely formed on the surfaces of products such as anti-reflection coatings for glasses and camera lenses, as well as semiconductor devices, and there are various methods for forming thin films.

薄膜の形成方法は大まかにいって物理的方法と化学的方
法に分かれるが、物理的方法には、蒸着材料を熱蒸発さ
せて対象品に蒸着させるものがあり、加熱方法にもいろ
いろのものがある。
Methods for forming thin films can roughly be divided into physical methods and chemical methods. Physical methods involve thermally evaporating the deposition material and depositing it on the target product, and there are various heating methods. be.

このうち電子ビームを照射して加熱するものは、Ill
 aやMOなど高融点材料の蒸着に向いているが、電子
ビームが蒸着材料に均一に照射されないと、蒸着材料の
溶解が一様でな(なるため、蒸着にむらができることに
なる。一般にこの種装置において使用される蒸着材料は
、粉末状、粒子状またはベレット状のものであり、第3
図(11)、(b)のようなるつぼに入れて電子ビーム
を照射する。ところで、電子ビームは蒸着材料表面に一
様に照射されるべきであるため、照射位置または照射範
囲を確保するためビーム照射機構の位置・姿勢が制御さ
れるだけでなく、ビーム自体の広がりもある程度調整で
きるようになっている。しかしながら、照射範囲をるつ
ぼの開口部に一致させているだけでは、粉末状、粒子状
の蒸着材料では、周囲から溶解部へのくずれ落ちが一様
でないため蒸発量が不均一なることがある。また、ペレ
ット状の蒸着材料では、るつぼの開口とは異なった形状
のものがあるため、電子ビーム照射範囲をるつぼの開口
部全面にセットした場合、不要の部分に電子ビームを照
A+し、 工1しq−nζ艷×1 電じ )・ 千にカ
゛と し・ツて!IItA僅圓I Iキー;敦う ヒ、
3k)しr−を刈l−―と)−ζ7メC−5iとy=射
されない部分ができ、蒸発が一様でな(なるため、蒸着
にむらができることもある。
Among these, those that heat by irradiating an electron beam are
It is suitable for vapor deposition of high melting point materials such as a and MO, but if the electron beam is not uniformly irradiated onto the vapor deposition material, the vapor deposition material will not dissolve uniformly (this will result in uneven vapor deposition. The evaporation material used in the seeding device is in the form of powder, particles or pellets;
It is placed in a crucible as shown in Figures (11) and (b) and irradiated with an electron beam. By the way, since the electron beam should uniformly irradiate the surface of the evaporation material, not only the position and orientation of the beam irradiation mechanism is controlled to ensure the irradiation position or irradiation range, but also the spread of the beam itself must be controlled to a certain extent. It is adjustable. However, if the irradiation range is simply made to match the opening of the crucible, the amount of evaporation may become non-uniform in the case of powdered or particulate vapor deposition material because the material falls down from the surrounding area to the melting zone unevenly. In addition, some pellet-shaped evaporation materials have a shape different from the opening of the crucible, so if the electron beam irradiation range is set to cover the entire opening of the crucible, the electron beam will be irradiated A+ on unnecessary parts and the process will be completed. 1 q-nζ艷×1 电子)・A thousand times! IItA Shoen I I key; Atsushi Hi;
3k) Then r- is cut l--)-ζ7MeC-5i and y=There are areas where the irradiation is not performed, and the evaporation is uneven, which may result in uneven evaporation.

そこで、蒸着を始める前に、電子ビームの照射範囲を確
定してお(べきはもちろんのこと、蒸着材料の溶解状態
を見て、電子ビームの照射位置を変えたり、ビーム幅乞
広げたり、または照射範囲を変えたりするわけであるが
、視認窓を通して蒸発中の蒸着材料の溶解状態を視認す
ることは極めて困難であるため、蒸着開始前に蒸着材料
の初期形状を確認し、溶解状態の視認は蒸着を停止した
ときに行われる。このため電子ビーム照射は、蒸着材料
の形状や溶解状態にびったつ適合したものではな(なり
、蒸着を不均一なものにするばかり。駄 でな(、蒸着材料や照射エネルギを無艷に消費すること
もある。そして、こうした問題は、電子ビーム照射に限
るものではな(、エネルギビーム照射による溶解に共通
している。
Therefore, before starting evaporation, it is necessary to determine the irradiation range of the electron beam (of course, it is necessary to check the melting state of the evaporation material and change the irradiation position of the electron beam, widen the beam width, or Although the irradiation range may be changed, it is extremely difficult to visually check the melted state of the vapor deposition material during evaporation through the viewing window, so it is necessary to confirm the initial shape of the vapor deposition material before starting the vapor deposition and visually check the melted state. is carried out when the vapor deposition is stopped.For this reason, the electron beam irradiation does not perfectly match the shape and melting state of the vapor deposition material (this will only make the vapor deposition non-uniform. In some cases, the evaporation material and irradiation energy are wasted.These problems are not limited to electron beam irradiation (they are common to melting by energy beam irradiation).

(解決しようとする課題) この発明は、こうした点に着目したものであって、エネ
ルギビーム蒸着を用いた蒸着装置において、蒸着材料の
溶解の均一化を適確に行うことによって蒸着を高品質化
することを課題とする。
(Problems to be Solved) This invention focuses on these points, and improves the quality of vapor deposition by accurately uniformizing the melting of the vapor deposition material in a vapor deposition apparatus using energy beam vapor deposition. The task is to do so.

(問題点を解決するだめの手段と作用)この発明では、
蒸着材料表面容するるつぼと正対して、蒸着室にシャッ
タ付窓を設け、この窓に撮像装置乞臨ませる。そして、
撮像装置の出力は画像処理と照射範囲決定のためのプロ
グラムを格納したコンピュータへ人力させ、コンピュー
タの出力は、エネルギビーム照射機構の制御装置へ入力
される。
(Means and effects for solving the problem) In this invention,
A window with a shutter is provided in the evaporation chamber directly facing the crucible containing the surface of the evaporation material, and an imaging device is made to look through this window. and,
The output of the imaging device is manually input to a computer that stores programs for image processing and irradiation range determination, and the output of the computer is input to the control device of the energy beam irradiation mechanism.

シャッタを開き、エネルギビームを照射すべき蒸着材料
面を撮影し、映像信号をコンピュータへ送るとともにシ
ャッタを閉じる。撮影は、蒸着中に行うこともできるが
、蒸着中に行うと蒸着材料が窓に付着して窓の透明度が
失われ、以後の撮影に支障をきたしたつ、蒸発中はエネ
ルギビーム照射面を撮影しに(いということもあるので
、撮影は蒸発の前後や予熱中に行われるのが普通である
The shutter is opened, the surface of the vapor deposition material to be irradiated with the energy beam is photographed, the video signal is sent to the computer, and the shutter is closed. Photography can also be done during vapor deposition, but if done during vapor deposition, the vapor deposition material will adhere to the window and the transparency of the window will be lost, which will hinder subsequent photography. Since there are times when it is necessary to take photographs, photographs are usually taken before and after evaporation or during preheating.

コンピュータへ入力された映像信号は画像処理され、蒸
着材料が溶解前のものであれば、その初期形状が画像デ
ータとして認識され、溶解途中のものであれば、溶解し
ていないところの形状が認識される。いずれにしても、
エネルギビームを照射すべき範囲が認識されるので、こ
の範囲を照射するためビーム照射機構の位置、姿勢指令
が出力される。
The video signal input to the computer is image-processed, and if the vapor deposition material is before melting, its initial shape is recognized as image data, and if it is in the process of being melted, the shape of the undissolved part is recognized. be done. In any case,
Since the range to be irradiated with the energy beam is recognized, position and attitude commands for the beam irradiation mechanism are output to irradiate this range.

(実施例) 電子ビーム照射により蒸着物質を蒸発させ、基板に蒸着
を行う一態様の実施例について第1図〜第8図を用いて
説明する。
(Example) An example of one embodiment in which a deposition material is evaporated by electron beam irradiation and deposited on a substrate will be described with reference to FIGS. 1 to 8.

真空密閉の蒸着室1の底部に、るつぼ2を配置して粒状
の蒸着材料3を入れてあり、蒸着室1の中段側方には、
蒸着材料3に向って電子ビーム照射機構4を配置しであ
る。この照射機構4は、その位置および姿勢を制御する
ための制御装置5を接続しである。蒸着上部は中央部を
除いて図示しない基板装着部を設けてあり、それに基板
6を装着しである。また、蒸着室天井面の中央には、撮
影窓7を設けてその内側を低い円筒状の囲い8で囲い、
その中央に開閉式シャッタ9を装着してある。そして、
蒸着室天井の上方に、テレビカメラ10を撮影窓7に臨
ませて配置しである。更にテレビカメラ10の影像信号
出力を、コンピュータ11の人力に接続しである。
A crucible 2 is placed at the bottom of a vacuum-sealed vapor deposition chamber 1 and granular vapor deposition material 3 is placed therein, and on the middle side of the vapor deposition chamber 1,
An electron beam irradiation mechanism 4 is arranged facing the vapor deposition material 3. This irradiation mechanism 4 is connected to a control device 5 for controlling its position and orientation. The upper part of the vapor deposition part is provided with a substrate mounting part (not shown) except for the central part, and the substrate 6 is mounted thereon. In addition, a photographing window 7 is provided in the center of the ceiling surface of the vapor deposition chamber, and the inside thereof is surrounded by a low cylindrical enclosure 8.
An opening/closing shutter 9 is installed in the center. and,
A television camera 10 is placed above the ceiling of the deposition chamber so as to face a photographing window 7. Furthermore, the image signal output of the television camera 10 is connected to the human power of the computer 11.

この装置で蒸着を実行するにあたり、るつぼ2には、第
3図(a)のように粒状蒸着材料3を入れてその表面を
ならしである。蒸着開始に先立ちシャッタ9を開け、撮
影すると第3図(a)に相当した映像信号がコンピュー
タ11に入力する。
When carrying out vapor deposition using this apparatus, a granular vapor deposition material 3 is placed in a crucible 2 as shown in FIG. 3(a), and its surface is leveled. Prior to the start of vapor deposition, the shutter 9 is opened and an image is taken, and a video signal corresponding to that shown in FIG. 3(a) is input to the computer 11.

コンピュータ11は画像処理と照射パターン決定のため
のプログラムを格納させたものであるから、この映像信
号を2値化し、第4図のような画像データを得る。そし
て、第6図のようにこの円弧画像の内側を照射パターン
として決定し、この範囲内を矢印で示す経路で電子ビー
ムを照射させるように、照射機構の制御装置へ位置及び
姿勢指令を出す。
Since the computer 11 stores programs for image processing and irradiation pattern determination, it binarizes this video signal to obtain image data as shown in FIG. Then, as shown in FIG. 6, the inside of this arc image is determined as the irradiation pattern, and position and orientation commands are issued to the control device of the irradiation mechanism so that the electron beam is irradiated within this range along the path indicated by the arrow.

こうした指令に基づいて電子ビームを照射し、蒸着乞行
い、適宜ロットの基板に薄膜形式を行なったところで、
蒸着材料3の溶解状況を見ると、溶解に伴う蒸着材料粒
子の(ずれ落ち状態のばらつきにより、第7図のような
溶解状態であったとする。そこで、前述同様の順序で、
蒸着材料を撮影し、第8図のように照射パターンを決定
し、次のロフトの蒸着を行う。
Based on these instructions, we irradiated the electron beam, performed vapor deposition, and formed a thin film on the appropriate lot of substrates.
Looking at the melting state of the vapor deposition material 3, it is assumed that the melting state is as shown in FIG. 7 due to variations in the state of shearing of the vapor deposition material particles accompanying the melting.Therefore, in the same order as described above,
The evaporation material is photographed, an irradiation pattern is determined as shown in FIG. 8, and the next loft is deposited.

このように、蒸着材料の初期状態や蒸発途中における溶
解状態に応じて画像データとして認識し、溶解していな
い部分にのみ電子ビームを照射するので、蒸発にむらが
な(、蒸着も均一で質のよいものになる。また、照射エ
ネルギの浪費やるつぼの損傷もな(なる。
In this way, the initial state of the evaporation material and the melting state during evaporation are recognized as image data, and the electron beam is irradiated only to the undissolved parts, so that the evaporation is uneven (and the evaporation is uniform and of high quality). Also, there is no wastage of irradiation energy and no damage to the crucible.

他の実施例として、蒸着材料は粒状のものに限ることな
(、粉末状のものや錠剤状のものであっても、前述同様
に適用でき、レーザービームなと他のエネルギビームに
適用できる。エネルギビームを走査させる経路の設は方
は、照射範囲の形状に合わせて適宜決めてよ(、照射範
囲の形状も適宜簡単な形状の近似的なものに置き替えて
よい。
As another example, the vapor deposition material is not limited to a granular material (although it may be a powdered material or a tablet material), it can be applied in the same manner as described above, and it can be applied to other energy beams such as a laser beam. The path to be scanned by the energy beam should be determined as appropriate depending on the shape of the irradiation range (the shape of the irradiation range may also be replaced with a simpler approximation as appropriate).

また、もう一つの態様の実施例としては前述実施例にお
いて撮像装置をテレビカメラに代えて、光ファイバの先
端奢るつぼと正対させ、他の一端を適宜経路で蒸着室外
に導き固体撮像素子に接続したものがある。
In addition, as an embodiment of another aspect, the imaging device in the above embodiment is replaced with a television camera, and the tip of the optical fiber is directly opposed to the crucible, and the other end is guided outside the vapor deposition chamber through an appropriate route to the solid-state imaging device. There is something connected.

(効果) 以上のとおり、この発明によれば、蒸着材料の溶解に応
じて照射範囲を決定し、その範囲にエネルギビームを照
射して蒸着を行うので、蒸着にむらはな(、均一で質の
よい蒸着膜形成ができる。
(Effects) As described above, according to the present invention, the irradiation range is determined according to the melting of the vapor deposition material, and the energy beam is irradiated to that range to perform vapor deposition. A good vapor deposition film can be formed.

【図面の簡単な説明】[Brief explanation of drawings]

図面は、この発明の実施例を示すものであって、第1図
は概略構造図、第2図はブロック図、第3図は平面図、
第4図はフロー図、第5図、第6図、第7図および第8
図は平面図である。 図面におい℃、1は蒸着室、2はるつぼ、3は蒸着材料
、4は電子ビーム照射機構、9はシャッタ、10はテレ
ビカメラ、11はコンピュータである。
The drawings show an embodiment of the present invention, in which FIG. 1 is a schematic structural diagram, FIG. 2 is a block diagram, and FIG. 3 is a plan view.
Figure 4 is a flow diagram, Figures 5, 6, 7 and 8.
The figure is a plan view. In the drawing, 1 is a vapor deposition chamber, 2 is a crucible, 3 is a vapor deposition material, 4 is an electron beam irradiation mechanism, 9 is a shutter, 10 is a television camera, and 11 is a computer.

Claims (1)

【特許請求の範囲】 エネルギビームによって蒸着材料を加熱蒸発させ、蒸着
膜を形成させるための蒸着装置の蒸着室の下部に、蒸着
材料を収容するるつぼを配置し、このるつぼに向ってエ
ネルギビームを照射するエネルギビーム照射機構を設け
た溶解装置において前記るつぼと正対する位置に撮像装
置を臨ませ、画像処理およびこの画像処理によって得ら
れる画像データから前記エネルギビームの照射範囲を決
定するプログラムを格納したコンピュータに、前記撮像
装置の映像信号出力を入力し、このコンピュータからの
位置・姿勢制御信号出力を前記エネルギビーム照射機構
の制御装置に入力してなる蒸着材料溶解装置。 (2)請求項第1項記載の蒸着材料溶解装置において、
前記撮像装置は、前記るつぼと正対する位置にシャッタ
付きの撮影窓を配置し、この撮影窓に正対するよう臨ま
せてなるもの。 (3)請求項第1項記載の蒸着材料溶解装置において、
前記撮像装置は、前記るつぼと正対する位置に光ファイ
バの一端を配置し、この光ファイバの他の一端は適宜位
置にある固体撮像素子に接続してなるもの。
[Claims] A crucible containing the vapor deposition material is disposed at the bottom of the vapor deposition chamber of a vapor deposition apparatus for heating and vaporizing the vapor deposition material using an energy beam to form a vapor deposition film, and an energy beam is directed toward the crucible. In a melting apparatus equipped with an energy beam irradiation mechanism, an imaging device is placed in a position directly facing the crucible, and a program is stored therein for determining an irradiation range of the energy beam from image processing and image data obtained by the image processing. A vapor deposition material melting apparatus, which inputs a video signal output from the imaging device into a computer, and inputs a position/attitude control signal output from the computer into a control device for the energy beam irradiation mechanism. (2) In the vapor deposition material melting apparatus according to claim 1,
The imaging device has a photographing window with a shutter placed at a position directly facing the crucible, and is faced directly to the photographing window. (3) In the vapor deposition material melting apparatus according to claim 1,
The imaging device has one end of an optical fiber disposed at a position directly facing the crucible, and the other end of the optical fiber is connected to a solid-state imaging device located at an appropriate position.
JP32663589A 1989-12-15 1989-12-15 Device for melting vapor depositing material of vapor deposition device Pending JPH03188269A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32663589A JPH03188269A (en) 1989-12-15 1989-12-15 Device for melting vapor depositing material of vapor deposition device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32663589A JPH03188269A (en) 1989-12-15 1989-12-15 Device for melting vapor depositing material of vapor deposition device

Publications (1)

Publication Number Publication Date
JPH03188269A true JPH03188269A (en) 1991-08-16

Family

ID=18189993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32663589A Pending JPH03188269A (en) 1989-12-15 1989-12-15 Device for melting vapor depositing material of vapor deposition device

Country Status (1)

Country Link
JP (1) JPH03188269A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286937A (en) * 2001-03-26 2002-10-03 Furukawa Electric Co Ltd:The Dielectric film deposition method to optical fiber end face and dielectric film deposition system
JP2006050111A (en) * 2004-08-03 2006-02-16 Hoya Corp System of manufacturing lens
JP2007048648A (en) * 2005-08-11 2007-02-22 Nisshin Giken Kk Scanning method in electron source device and electron source device
JP2012207310A (en) * 2012-07-13 2012-10-25 Ulvac Japan Ltd Vapor deposition method of metal oxide film, and method for manufacturing plasma display panel

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002286937A (en) * 2001-03-26 2002-10-03 Furukawa Electric Co Ltd:The Dielectric film deposition method to optical fiber end face and dielectric film deposition system
JP2006050111A (en) * 2004-08-03 2006-02-16 Hoya Corp System of manufacturing lens
JP2007048648A (en) * 2005-08-11 2007-02-22 Nisshin Giken Kk Scanning method in electron source device and electron source device
JP2012207310A (en) * 2012-07-13 2012-10-25 Ulvac Japan Ltd Vapor deposition method of metal oxide film, and method for manufacturing plasma display panel

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