JPH0318330B2 - - Google Patents

Info

Publication number
JPH0318330B2
JPH0318330B2 JP8619681A JP8619681A JPH0318330B2 JP H0318330 B2 JPH0318330 B2 JP H0318330B2 JP 8619681 A JP8619681 A JP 8619681A JP 8619681 A JP8619681 A JP 8619681A JP H0318330 B2 JPH0318330 B2 JP H0318330B2
Authority
JP
Japan
Prior art keywords
silicon single
single crystal
semiconductor device
defects
defect density
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP8619681A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57201032A (en
Inventor
Toshuki Kotani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP8619681A priority Critical patent/JPS57201032A/ja
Publication of JPS57201032A publication Critical patent/JPS57201032A/ja
Publication of JPH0318330B2 publication Critical patent/JPH0318330B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Recrystallisation Techniques (AREA)
JP8619681A 1981-06-04 1981-06-04 Silicon single crystal semiconductor device Granted JPS57201032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8619681A JPS57201032A (en) 1981-06-04 1981-06-04 Silicon single crystal semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8619681A JPS57201032A (en) 1981-06-04 1981-06-04 Silicon single crystal semiconductor device

Publications (2)

Publication Number Publication Date
JPS57201032A JPS57201032A (en) 1982-12-09
JPH0318330B2 true JPH0318330B2 (enrdf_load_stackoverflow) 1991-03-12

Family

ID=13880021

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8619681A Granted JPS57201032A (en) 1981-06-04 1981-06-04 Silicon single crystal semiconductor device

Country Status (1)

Country Link
JP (1) JPS57201032A (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6031231A (ja) * 1983-07-29 1985-02-18 Toshiba Corp 半導体基体の製造方法
US4851358A (en) * 1988-02-11 1989-07-25 Dns Electronic Materials, Inc. Semiconductor wafer fabrication with improved control of internal gettering sites using rapid thermal annealing
US4868133A (en) * 1988-02-11 1989-09-19 Dns Electronic Materials, Inc. Semiconductor wafer fabrication with improved control of internal gettering sites using RTA

Also Published As

Publication number Publication date
JPS57201032A (en) 1982-12-09

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