JPH0317222B2 - - Google Patents
Info
- Publication number
- JPH0317222B2 JPH0317222B2 JP17670884A JP17670884A JPH0317222B2 JP H0317222 B2 JPH0317222 B2 JP H0317222B2 JP 17670884 A JP17670884 A JP 17670884A JP 17670884 A JP17670884 A JP 17670884A JP H0317222 B2 JPH0317222 B2 JP H0317222B2
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- liquid
- fluorocarbon
- pipe
- refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001816 cooling Methods 0.000 claims description 28
- 239000007788 liquid Substances 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 10
- 239000000110 cooling liquid Substances 0.000 claims description 6
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 15
- 238000009835 boiling Methods 0.000 description 7
- 239000003507 refrigerant Substances 0.000 description 7
- 239000000498 cooling water Substances 0.000 description 4
- 238000007654 immersion Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 101100075513 Oryza sativa subsp. japonica LSI3 gene Proteins 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体素子の液冷装置に係り、特に半
導体素子の冷却効率を向上し得る液冷装置に関す
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a liquid cooling device for semiconductor devices, and more particularly to a liquid cooling device that can improve the cooling efficiency of semiconductor devices.
従来の技術
コンピユータや電子機器は動作すると熱を発生
する。このような熱はフアン等を用いた主に空冷
によつて冷却されている。しかしながら最近では
空冷より冷却効率の高い液体による冷却方法が考
えられている。このようなコンピユータや電子機
器を液体で冷却する装置として浸漬液冷モジユー
ルがよく知られている。BACKGROUND OF THE INVENTION Computers and electronic devices generate heat when they operate. Such heat is mainly cooled by air cooling using a fan or the like. However, recently, cooling methods using liquid, which have higher cooling efficiency than air cooling, have been considered. Immersion liquid cooling modules are well known as devices for cooling such computers and electronic devices with liquid.
浸漬液例は半導体素子等を例えばフルオロカー
ボン等の冷媒液体に浸漬し、作動時に半導体素子
が発生した熱を放熱するために冷媒液体が沸騰し
て奪う気化熱を作用している。 In an example of an immersion liquid, a semiconductor element or the like is immersed in a refrigerant liquid such as fluorocarbon, and the refrigerant liquid boils and takes away the heat of vaporization to radiate the heat generated by the semiconductor element during operation.
発明が解決しようとする問題点
上記浸漬液例では例えば大きな回路基板を冷却
する場合、上方に配設された半導体素子は下方の
半導体素子から発生した気泡の影響で冷却能力が
低下する。また液冷却容器上方の凝縮器に全ての
放熱を頼ると外部から液冷却容器内に例えば空気
等の不純物ガスが混入し冷却能力が低下する。本
発明はこのような問題点を解決するためのもので
ある。Problems to be Solved by the Invention In the above example of the immersion liquid, when cooling a large circuit board, for example, the cooling ability of semiconductor elements disposed above is reduced due to the influence of air bubbles generated from semiconductor elements below. Furthermore, if all heat radiation is relied on the condenser above the liquid cooling container, impurity gas such as air may enter the liquid cooling container from the outside, reducing the cooling capacity. The present invention is intended to solve these problems.
問題点を解決するための手段
上記問題点は本発明によれば半導体素子を冷却
用液体に直接浸漬することによつて冷却する液冷
装置において；
該冷却用液体を通る冷却パイプを設け、該冷却
用液体の沸点よりも低い沸点を有する液体を該冷
却パイプ中に循環させたことを特徴とする液冷装
置によつて解決される。Means for Solving the Problems According to the present invention, the above problems are solved in a liquid cooling device in which a semiconductor element is cooled by directly immersing it in a cooling liquid; The problem is solved by a liquid cooling device characterized in that a liquid having a boiling point lower than that of the cooling liquid is circulated through the cooling pipe.
作 用
本発明によれば冷却用液体中に低沸点液体を入
れて循環させているので冷却用液体中に発生した
気泡が効率より凝縮、消去せしめられる。Effects According to the present invention, since a low boiling point liquid is placed in the cooling liquid and circulated, bubbles generated in the cooling liquid can be efficiently condensed and eliminated.
実施例
以下、本発明の実施例を図面に基づいて説明す
る。Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings.
第１図は本発明に係る液冷装置の一実施例を示
す模式図である。 FIG. 1 is a schematic diagram showing an embodiment of a liquid cooling device according to the present invention.
第１図において、容器１内に冷却用液体として
50℃の沸点を示すフルオロカーボン２が収容され
ており、該フルオロカーボン２内に半導体素子で
あるLSI３を多数搭載した回路基板４が浸漬され
ている。回路基板４に近接して水平方向に蛇行す
る部分を有するパイプ５がフルオロカーボン２内
を走り且つ容器１上方に設けられた冷却水６内を
通るように連続パイプとして設けられている。該
パイプ５内壁には弁７が数箇所に設けられてい
る。更に該パイプ５内にはフルオロカーボン２を
冷却するための沸点が約30〜40℃の第２のフルオ
ロカーボン８が充填されている。 In Fig. 1, there is a cooling liquid in container 1.
A fluorocarbon 2 having a boiling point of 50° C. is contained therein, and a circuit board 4 on which a large number of LSIs 3, which are semiconductor elements, are mounted is immersed in the fluorocarbon 2. A pipe 5 having a horizontal meandering portion close to the circuit board 4 is provided as a continuous pipe so as to run inside the fluorocarbon 2 and pass through the cooling water 6 provided above the container 1. Valves 7 are provided at several locations on the inner wall of the pipe 5. Further, the pipe 5 is filled with a second fluorocarbon 8 having a boiling point of about 30 to 40°C for cooling the fluorocarbon 2.
LSI３を作動させると容器１内の冷媒であるフ
ルオロカーボン２は50℃で沸騰し、多数の気泡９
を発生してLSI３の熱を奪う。フルオロカーボン
２より沸点の低い第２のフルオロカーボン８は沸
騰したフルオロカーボン２の熱を奪つて沸騰しパ
イプ５内壁に設けた弁７の作用によつて一定方向
に対流を発生する。その結果矢印Ａで示すように
フルオロカーボン２はパイプ５内を循環し、冷却
水６によつて、凝縮、冷却される。 When the LSI 3 is activated, the fluorocarbon 2, which is the refrigerant in the container 1, boils at 50℃, producing many bubbles 9.
Generates heat from LSI3. The second fluorocarbon 8, which has a lower boiling point than the fluorocarbon 2, absorbs the heat of the boiled fluorocarbon 2, boils, and generates convection in a fixed direction by the action of the valve 7 provided on the inner wall of the pipe 5. As a result, the fluorocarbon 2 circulates within the pipe 5 as shown by arrow A, and is condensed and cooled by the cooling water 6.
直接LSI３を冷却する冷媒としては上記のフル
オロカーボンの他にフレオン等も用いられる。パ
イプ５内に充填する冷媒の沸点はLSI２の直接の
冷媒の沸点より20〜30℃程度低いのが好ましい。 As a refrigerant for directly cooling the LSI 3, in addition to the above-mentioned fluorocarbon, freon or the like may also be used. The boiling point of the refrigerant filled in the pipe 5 is preferably about 20 to 30°C lower than the boiling point of the refrigerant directly in the LSI 2.
パイプ５の形状は冷媒としてのフルオロカーボ
ン２の熱を効率よく奪うような形状が好ましい。
なお冷却水６は矢印Ｂで示すように流され冷却効
率を向上させるのに寄与せしめられている。 The shape of the pipe 5 is preferably such that it can efficiently remove heat from the fluorocarbon 2 as a refrigerant.
Note that the cooling water 6 is caused to flow as shown by arrow B, contributing to improving the cooling efficiency.
発明の効果
上記説明したように、本発明によれば半導体素
子の冷却効率を高めることが可能である。Effects of the Invention As explained above, according to the present invention, it is possible to improve the cooling efficiency of a semiconductor element.
第１図は本発明に係る液冷装置の一実施例を示
す模式図である。
１……容器、２……フルオロカーボン、３……
LSI、４……回路基板、５……パイプ、６……冷
却水、７……弁、８……第２のフルオロカーボ
ン、９……気泡。
FIG. 1 is a schematic diagram showing an embodiment of a liquid cooling device according to the present invention. 1... Container, 2... Fluorocarbon, 3...
LSI, 4...Circuit board, 5...Pipe, 6...Cooling water, 7...Valve, 8...Second fluorocarbon, 9...Bubble.
Claims (1)
によつて冷却する液冷装置において； 該冷却用液体を通る冷却パイプを設け、該冷却
用液体の沸点よりも低い沸点を有する液体を該冷
却パイプ中に循環させたことを特徴とする液冷装
置。 ２ 前記冷却パイプに弁を設けたことを特徴とす
る特許請求の範囲第１項記載の液冷装置。[Claims] 1. In a liquid cooling device that cools a semiconductor element by directly immersing it in a cooling liquid; A liquid cooling device, characterized in that a liquid containing the liquid is circulated through the cooling pipe. 2. The liquid cooling device according to claim 1, wherein the cooling pipe is provided with a valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17670884A JPS6154654A (en) | 1984-08-27 | 1984-08-27 | Liquid cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17670884A JPS6154654A (en) | 1984-08-27 | 1984-08-27 | Liquid cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6154654A JPS6154654A (en) | 1986-03-18 |
| JPH0317222B2 true JPH0317222B2 (en) | 1991-03-07 |
Family
ID=16018364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17670884A Granted JPS6154654A (en) | 1984-08-27 | 1984-08-27 | Liquid cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6154654A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4419646B2 (en) * | 2004-03-30 | 2010-02-24 | セイコーエプソン株式会社 | Optical apparatus and projector |
| EP1837612A1 (en) | 2004-12-22 | 2007-09-26 | Tokyo University of Science, Educational Foundation | Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof |
| US20090260783A1 (en) | 2006-03-06 | 2009-10-22 | Tokyo University Of Science Educational Foundation | Boil Cooling Method, Boil Cooling Apparatus, Flow Channel Structure and Applied Product Thereof |
| JPWO2016075838A1 (en) * | 2014-11-14 | 2017-10-19 | 株式会社ＥｘａＳｃａｌｅｒ | Electronic device cooling system and cooling method |
| EP3279764A4 (en) * | 2015-03-30 | 2018-12-05 | Exascaler Inc. | Electronic-device cooling system |
| JP6540230B2 (en) | 2015-05-26 | 2019-07-10 | 富士通株式会社 | substrate |
| US20180246550A1 (en) * | 2015-08-31 | 2018-08-30 | Exascaler Inc. | Cooling system for electronic device |
-
1984
- 1984-08-27 JP JP17670884A patent/JPS6154654A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6154654A (en) | 1986-03-18 |
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