JP3355726B2 - Boiling cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boiling cooling device for cooling a heating element such as a semiconductor element which has generated heat.

[0002]

2. Description of the Related Art FIG. 10 is a view showing a conventional boiling cooling device disclosed in Japanese Patent Application Laid-Open No. 56-147457.
In this figure, the element case 1 and the heat exchanger 2 are connected by heat transport pipes 3A and 3B, and the operation is as follows. That is, when the semiconductor element 4A generates heat and causes the cooling medium 8 to boil, the cooling medium 8 rises as vapor and moves to the heat exchanger 2 via the heat transport pipe 3A. Heat exchanger 2
Is distributed to the fin tube 2A, condensed by external cooling, reaches the heat transport tube 3B, and returns to the element case 1 again. The semiconductor element is cooled by such a cycle.

[0003]

However, in the boiling cooling apparatus as shown in FIG. 10, the liquid level of the refrigerant changes due to environmental conditions such as vibration and inclination of the mounting surface. There is a possibility that a state where no liquid refrigerant exists on the surface may occur. In such a case, it becomes difficult for the refrigerant to absorb the heat generated by the heating element, and the refrigerant is less likely to be vaporized. Then, the cooling capacity is instantaneously reduced, and in the worst case, an overheating failure may occur. It is conceivable to increase the amount of the refrigerant as one means for preventing the exposure of such a heating element.
As a result, there is a problem that the weight and cost increase.

The present invention has been made in view of the above problems, and provides a vaporized refrigerant passage member above a liquid surface of a refrigerant and a partition plate in a refrigerant container, thereby enabling a heating element and a heat generation without increasing the amount of refrigerant. Prevents exposure of parts that receive heat from the body,
An object of the present invention is to obtain a boiling cooling device having a constantly stable cooling capacity.

[0005]

In order to achieve the above object , according to the first aspect of the present invention, there is provided a method for use in an electric circuit or the like.
A heating element that generates heat by being driven;
A liquid that absorbs heat generated by a heating element and evaporates with the heat
Refrigerant, a refrigerant container for enclosing the refrigerant, and the refrigerant container.
The vaporized refrigerant in the vessel is cooled and liquefied, and the refrigerant
A radiator for returning to the lower part, and a vibration
Liquid level control means for suppressing fluctuations in the liquid level of the refrigerant due to movement, etc.
Wherein the liquid level control means selectively passes the gaseous phase refrigerant.
Technical means characterized by being a semipermeable membrane
To use. Further, according to the second aspect of the present invention,
For example, it is used in electric circuits, etc., and generates heat when driven.
A heating element that is generated and absorbs heat generated by the heating element,
Encloses a liquid refrigerant that evaporates due to heat and the refrigerant
Cooling a refrigerant container and the vaporized refrigerant in the refrigerant container
A radiator that liquefies and returns to the lower part of the refrigerant container;
Attached to the container, the liquid level of the refrigerant changes due to vibration or the like.
Liquid level control means for suppressing movement, wherein the liquid level control means
It is arranged above the liquid level of the refrigerant, and some of them overlap each other.
It consists of a plurality of partition plates stacked vertically
The technical means is characterized by the following.

[0006]

According to the first aspect of the present invention, the heating element is normally driven in an electric circuit or the like, thereby generating heat. The heat generated in the heating element is absorbed by the refrigerant and causes the refrigerant to boil and evaporate. The generated vapor of the refrigerant passes through the liquid level control means by the thermosiphon effect, rises in the refrigerant container, condenses on the side surface of the refrigerant container, transmits heat to the heat radiation part, is cooled and liquefies again. The liquefied refrigerant drips right below by gravity, passes through the liquid level control means, and returns to the lower part of the refrigerant container.
Therefore, the heat generated by the heating element is released to the atmosphere through the refrigerant and the heat radiating portion. When the boiling cooling device is tilted or subjected to vibration, the liquid level control means suppresses the change in the liquid level of the refrigerant and the deviation of the refrigerant to a certain level or less.

[0007]

According to the first and second aspects of the present invention, even when the boiling cooling device is tilted or subjected to vibration, the liquid level control means reduces the change in the liquid level of the refrigerant and the deviation of the refrigerant to a certain level or less. suppress. This eliminates the problem that the liquid refrigerant does not exist on the surface of the heating element or the high-temperature portion at the lower part of the refrigerant container, and it is possible to prevent a decrease in cooling capacity. Further, since it is not necessary to increase the amount of the refrigerant, it is possible to solve the problem of increasing the size of the refrigerant container, thereby increasing the weight and cost.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings.
I do. First, using a reference example, the boiling used in the present invention
The schematic configuration and operation of the cooling device will be described. FIG. 1A is a diagram illustrating a boiling cooling device according to a reference example of the present invention, and FIG. 1B is a diagram illustrating a case where a laminated metal mesh 14 is used as a vaporized refrigerant passage member that is liquid level control means. .
Schematically, the heating element 13 is placed in the refrigerant container 102,
A sufficient amount of the refrigerant 12 is filled in the refrigerant container 102 so that the heating element 13 is immersed. Further, a laminated metal net 14 as a liquid level control means is formed above the liquid level of the refrigerant.

In such a configuration, the heating element 13 is normally driven in an electric circuit or the like, thereby generating heat. The heat generated in the heating element 13 is absorbed by the refrigerant 12 and causes the refrigerant 12 to boil and evaporate. Generated refrigerant 12
Vapor rises in the refrigerant container 102 through the laminated metal net 14 by the thermosiphon effect, adheres to the side surface of the refrigerant container 102, transfers heat to the heat radiation part 101, is cooled, and liquefies again. The liquefied refrigerant 12 drips right below due to gravity, passes through the laminated metal mesh 14 and returns to the lower part of the refrigerant container 102.

When the boiling cooling device 10 is subjected to vibration, the liquid level of the refrigerant 12 changes, and in some cases, the heating element 1
3 prevents the liquid refrigerant 12 from being present on the surface of the heat sink 3, so that the heat generated by the heating element 13 is continuously absorbed by the refrigerant 12. For this purpose, a laminated metal mesh 14 is formed above the liquid level of the refrigerant 12. Thereby, even when the boiling cooling device 10 is subjected to vibration, the fluctuation of the liquid level of the refrigerant 12 can be suppressed to a certain level or less. Therefore, the amount of the refrigerant 12 can be minimized, and the refrigerant,
Stable cooling performance can be obtained without increasing weight and cost.

Next, an embodiment of the present invention will be described.
In the embodiment described below, the liquid level suppressing means is
It functions the same as the reference example described above. In addition,
The same components are denoted by the same reference numerals. In the first embodiment
Are arranged so as to partially overlap each other as shown in FIG.
The plurality of partition plates 44 are used as liquid level control means. So
This prevents the refrigerant from jumping directly to the top during vibration,
And a passage having a passage through which the gas-phase refrigerant can easily pass.
Can be made.

FIG. 5 shows a second embodiment of the present invention.
It is a figure showing a boiling cooling device of an example. In this figure, the liquid level control means is constituted by a semi-permeable membrane 54 for selectively passing only the gas phase. On the side surface of the boiling cooling device 50, a liquid-phase refrigerant collected on the semi-permeable membrane 54 is filled with a refrigerant container 50.
2, a return pipe 55 is formed.

In such a configuration, the heat generated in the heating element 53 is normally absorbed by the refrigerant 52,
2 is vaporized by boiling. The generated vapor of the refrigerant 52 passes through the semi-permeable membrane 54 by the thermosiphon effect and passes through the refrigerant container 5.
02, condenses on the side surface of the refrigerant container 502 and transmits heat to the heat radiating portion 501 to be cooled and liquefied again. The liquefied refrigerant 52 drips right below due to gravity and reaches the semipermeable membrane 54. Since the semipermeable membrane 54 does not allow the liquid-phase refrigerant to pass through, the semipermeable membrane 54
Is reached by the return pipe 55 and returned to the refrigerant container 502.

In this embodiment, since the semi-permeable membrane 54 for selectively passing only the gas phase is used for the liquid level control means, the liquid level change due to the inclination as well as the liquid level change due to the vibration is prevented. be able to. Therefore, also in this embodiment, the refrigerant 5
2, the amount of refrigerant, weight,
A stable cooling performance can be obtained without increasing the cost.

FIG . 6 is a diagram showing a boiling cooling device according to another reference example of the present invention . Schematically, a plurality of heating elements 63 are contained in the refrigerant container 602, and the refrigerant container 6
A sufficient amount of the refrigerant 62 for immersing the heating element 63 in the heating element 63 is sealed therein. As the liquid level control means, a laminated wire mesh 643 and a surface partition plate 641 are provided above the liquid level of the refrigerant.
The refrigerant container 602 is provided with a refrigerant container partition plate 642 so as to individually partition the heating elements 63. Note that the laminated wire mesh 643, the surface partition plate 641, and the refrigerant container partition plate 642 may be used separately.

In such a configuration, since the heating elements 63 are individually partitioned by the refrigerant container partitioning plates 642, there is no difference in the amount of the refrigerant 62 for each of the heating elements 63 even if the heating elements 63 are slightly inclined. ing. Surface partition plate 6
With 41, a partial change in the liquid level can be suppressed even in a region surrounded by the refrigerant container partition plate 642.
Furthermore, the laminated metal mesh 643 formed above the liquid level of the refrigerant can suppress a change in the liquid level due to the vibration of the boiling cooling device.

[0017] Therefore the amount of cold medium 62 can be suppressed to the minimum necessary and, without increasing the refrigerant, weight, cost,
Stable cooling performance can be obtained .

[0018]

FIG . 8 is a diagram showing a boiling cooling device according to another reference example of the present invention . Schematically, a plurality of heating elements 83 are contained in the refrigerant container 802, and the refrigerant container 8
A sufficient amount of refrigerant 82 is filled in the heating element 83 so that the heating element 83 is immersed therein. As the liquid level control means, a surface partition plate 841 is provided above the liquid level of the refrigerant, and a refrigerant container 802 is provided.
Is provided with a refrigerant container partition plate 842 so as to individually partition the heating elements 83.

In such a configuration, since the heating elements 83 are individually partitioned by the refrigerant container partition plate 842, there is no difference in the amount of the refrigerant 82 for each heating element 83 even if the heating elements 83 are slightly inclined. ing. Also, the surface partition plate 8
With 41, a partial change in the liquid level can be suppressed even in a region surrounded by the refrigerant container partition plate 842.
Therefore, also in the present embodiment, the amount of the refrigerant 82 can be suppressed to the necessary minimum, and a low- cost, effective cooling performance against inclination can be obtained.

Although the cooling tank partition plates 642 and 842 separate the heating elements 63 and 83 individually in the above-described reference example , this is not always necessary, and two heating elements 63 and 83 are provided in one section. The above may be included . FIG. 9 is a diagram illustrating a boiling cooling device according to another reference example of the present invention. Schematically, the refrigerant 92 is sealed in the refrigerant container 902, and as the liquid level control means, a laminated metal mesh 941 is provided above the liquid surface of the refrigerant, and the refrigerant container 902 is individually disposed in the refrigerant container 902. Refrigerant container partition plate 94
2 are configured. A plurality of heating elements 93 are formed below the refrigerant container 902. The heating element 93
May be outside the refrigerant container 902.

Even in such a configuration, even if the boiling cooling device 90 is slightly tilted, a difference in the amount of the refrigerant 92 in the region surrounded by the refrigerant container partition plate 942 does not occur.
Further, the laminated metal mesh 941 formed above the liquid level of the refrigerant 92 can suppress a change in the liquid level due to the vibration of the boiling cooling device. Therefore, also in the present embodiment, the amount of the refrigerant 92 can be suppressed to a necessary minimum, the manufacturing method is simple, and stable cooling performance at low cost can be obtained.

In this embodiment, the boiling cooling device having a structure in which one end of the heat radiating portion is closed is used. However, in the present invention, the liquid level control means and the configuration are limited to the shapes and combinations shown in the above-described embodiments. It was not done. For example, a boiling cooling device having a structure in which a refrigerant is cooled by vaporizing and circulating through a heat radiating portion may be used, or a vaporized refrigerant passage member serving as a liquid level control unit may be replaced with those shown in FIGS. 1 to 8 . . As described above, the present invention can be implemented by arbitrarily changing its configuration, shape, and combination within a range not departing from the essence.

[Brief description of the drawings]

FIG. 1A is a diagram illustrating a boiling cooling device in a reference example . FIG. 2B is a diagram showing a laminated wire mesh as a liquid level control unit in FIG.

FIG. 2 is a diagram showing a fibrous wire net as an example of a liquid level control unit.

FIG. 3A is a view showing a porous partition plate as an example of a liquid level control unit. (B) is a figure which shows the porous partition plate which is an example of a liquid level control means.

FIG. 4 is a diagram illustrating a boiling cooling device according to a first embodiment of the present invention .

FIG. 5 is a diagram showing a boiling cooling device according to a second embodiment of the present invention.

FIG. 6 is a diagram showing a boiling cooling device according to another reference example of the present invention.

FIG. 7 is a diagram showing a boiling cooling device according to another reference example of the present invention.

FIG. 8 is a diagram showing a boiling cooling device according to another reference example of the present invention.

FIG. 9 is a diagram showing a boiling cooling device according to another reference example of the present invention.

FIG. 10 is a diagram showing a conventional boiling cooling device.

[Explanation of symbols]

10, 50, 60, 70, 80, 90 Boiling cooling device 101, 501, 601, 701, 801, 901
Radiator 102, 502, 602, 702, 802, 902
Refrigerant container 11, 51, 61, 71, 81, 91 Cooling fin 12, 52, 62, 72, 82, 92 Refrigerant 13, 53, 63, 73, 83, 93 Heating element 14 Laminated wire mesh 24 Fibrous wire mesh 341, 342 Porous partition plate 44 Partition plate 54 Semi-permeable membrane 55 Return pipe 641 Surface partition plate 642 Refrigerant container partition plate 643 Laminated wire mesh 74 Porous partition plate 841 Surface partition plate 842 Refrigerant container partition plate 941 Laminated wire mesh 942 Refrigerant container partition plate

Continuation of the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 23/34-23/473

Claims (4)

(57) [Claims] 1. A heating element that is used in an electric circuit or the like and generates heat when driven, a liquid refrigerant that absorbs heat generated by the heating element and is vaporized by the heat, and a refrigerant that seals the refrigerant. A container; a radiator for cooling and liquefying the vaporized refrigerant in the refrigerant container to return to a lower portion of the refrigerant container; and a liquid level control attached to the refrigerant container to suppress a fluctuation in the liquid level of the refrigerant due to vibration or the like. and means, the liquid level controlling means, the semi-selectively passing the gas-phase refrigerant
A boiling cooling device characterized by being a permeable membrane . 2. The method according to claim 1, which is used in an electric circuit, etc.
A heating element that generates more heat, and absorbs the heat generated by the heating element, and is vaporized by the heat.
Liquid refrigerant, a refrigerant container for enclosing the refrigerant, and cooling and liquefying the vaporized refrigerant in the refrigerant container.
A radiator that returns to the lower part of the refrigerant container, and which is attached to the refrigerant container,
Liquid level control means for suppressing fluctuations in the liquid level, wherein the liquid level control means is disposed above the liquid level of the refrigerant;
Are vertically stacked so that parts of them overlap each other
A boiling cooling device comprising a plurality of partition plates . 3. A return pipe is provided above the liquid level control means and returns a refrigerant which is cooled and liquefied by the heat radiating portion and accumulates on the liquid level control means to the refrigerant container. Or the boiling cooling device according to 2 . Wherein said liquid level control means, cooling apparatus according to any one of claims 1 to 3, characterized in that it includes means for dividing the coolant container into a plurality.