JP3539016B2 - Boiling cooling device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling apparatus for cooling equipment.

[0002]

2. Description of the Related Art For example, a semiconductor or the like incorporated in a control device mounted on an electric vehicle generates heat, so that a cooling means for cooling the semiconductor is required. For this reason, a boiling cooling device is used for cooling a semiconductor or the like.

[0003] As one of the boiling cooling devices, there is a panel type condenser shown in FIG. As shown in the figure, a tank 1 as an evaporator is filled with a refrigerant 2, while a plurality of panels 3 as a condenser are arranged above the tank 1, and the upper part of the panel 3 and the upper part of the tank 1 are connected to a steam pipe 4. And the lower part of the panel 3 and the lower part of the tank 1 are airtightly connected via a liquid pipe 5. The semiconductor 6 as a heating element is immersed in the coolant 2.

[0004] When the heat generated by the semiconductor 6 is taken by the refrigerant 2 and the temperature of the refrigerant 2 rises, the refrigerant 2 evaporates into vapor. The vaporized refrigerant 2 rises to the upper part of the panel 3 through the vapor pipe 4, and when the refrigerant 2 descends inside the panel 3, it is deprived of heat by the air-cooled panel 3 and liquefied. The liquefied refrigerant 2 flows into the tank 1 from the lower part of the panel 3 via the liquid pipe 5. By circulating the refrigerant 2 as described above,
The semiconductor 6 is continuously cooled.

[0005]

However, even if the refrigerant is sufficiently degassed, a very small amount of non-condensable gas is mixed in the refrigerant, and the temperature of the refrigerant decreases, and the pressure in the steam pipe 4 becomes 3 kpa.
Below this, the pushing force is weakened, and as shown in FIG. 7, the non-condensable gas 7 fills the upper part of the panel 3 and a state in which the refrigerant does not circulate occurs. Therefore, the semiconductor cannot be cooled smoothly.

[0006] Therefore, an object of the present invention is to provide a boiling cooling device that solves the above problem.

[0007]

SUMMARY OF THE INVENTION In order to achieve the above object, the structure of the present invention is such that when non-condensable gas stagnates in the upper part of the steam pipe and the upper part of the panel and the refrigerant vapor does not circulate, the lower part of the panel is formed. A bypass pipe is provided by connecting the lower part of the panel and the steam pipe so that the refrigerant vapor enters the panel and is cooled and liquefied by being cooled. Flows, but a non-return means is provided in the bypass pipe so that the liquefied refrigerant does not flow into the vapor pipe.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail based on an embodiment shown in the drawings. In this embodiment, since a part of the conventional boiling cooling apparatus is improved, the same parts as those in the related art are denoted by the same reference numerals, and description thereof will be omitted. Only different parts will be described.

(A) Embodiment 1 FIG. 1 shows the configuration of a boiling cooling apparatus according to the present invention. As shown in the figure, the lower part of the panel 3 and the steam pipe 4 are connected to the bypass pipe 12 so that the vapor of the refrigerant 2 that has been sent only to the upper part of the panel 3 can be sent upward from the lower part of the panel 3. Connected through.

Then, the vapor of the refrigerant 2 moves from the vapor pipe 4 toward the lower part of the panel 3, but the liquid refrigerant 2 liquefied in the panel 3 does not flow toward the vapor pipe 4. A stopping means is provided in the bypass pipe 12.
In this embodiment, a partition plate 8 shown in FIG. The partition plate 8 is connected to the bypass pipe 1.
The refrigerant 2, which is liquefied in the lower part of the bypass pipe 2, is formed in a substantially semicircular arc shape that closes a substantially lower half of the bypass pipe 12 so that the vapor of the refrigerant 2 flows in the upper part of the bypass pipe 12. ing.

Next, the operation of the boiling cooling device will be described. In a normal state, as shown in FIG. 1, the vapor of the refrigerant 2 rises straight in the vapor pipe 4 and hardly flows into the bypass pipe 12. As in the conventional case, the coolant 2 circulates on a regular route, and the semiconductor 6 is cooled.

When the temperature of the refrigerant 2 decreases and the pressure in the steam pipe 4 decreases, the non-condensable gas 7 accumulates at the upper part of the panel 3 and stays there as shown in FIG. Then, the refrigerant 2 cannot rise in the steam pipe 4 because of being hindered by the non-condensable gas 7.
4 flows from the lower part of the panel 3 to the upper part through the upper part of the partition plate 8 in the bypass pipe 12 as shown in FIG. 4, is cooled in the panel 3, becomes a liquid, and flows down along the same route as in the related art. Return to 1. In the liquid pipe 5 extending in the horizontal direction, the liquefied refrigerant 2 passes through the bypass pipe 12 to the vapor pipe 4.
However, since the partition plate 8 exists, it does not flow toward the steam pipe 4. Thus, even if the non-condensable gas stagnates on the upper part of the panel 3, the refrigerant 2 circulates.

When the amount of the circulated refrigerant increases, the liquefied refrigerant 2
Crosses the upper surface of the partition plate 8 in the bypass pipe 12 and
To prevent the steam in the steam pipe 4 from flowing into the bypass pipe 12. That is, in the configuration in which the vapor of the refrigerant 2 enters the panel 3 only from the bypass pipe 12 without the vapor pipe 4, the limit of the circulation amount is lower than when the vapor flows into the panel 3 only from the vapor pipe 4. . Therefore, when the circulation amount of the refrigerant 2 is small, the vapor of the refrigerant 2 enters the panel 3 through the bypass pipe 12, and when it is large, enters the panel 3 through the vapor pipe 4. It has become something.

When the temperature of the refrigerant 2 increases from the state shown in FIG. 4, the pressure in the tank 1 also increases sequentially.
As shown in FIG. 5, the vapor of the refrigerant 2 sequentially pushes out the non-condensed gas 7, and normal circulation is performed as shown in FIG.

(B) Second Embodiment Next, a second embodiment of the boiling cooling device according to the present invention will be described.
In this embodiment, a check valve 9 shown in FIG. 3 is provided as a check means. That is, the substantially ring-shaped support plate 10 is fixed in the bypass pipe 12, and the upper portion of the check valve 9 is attached to the support plate 10 via the hinge 11 from the panel 3 side so as to be openable and closable.

When the vapor of the refrigerant 2 presses the check valve 9 from the left side of FIG. 3A, the check valve 9 opens, and the check valve 9 opens to allow the vapor to flow into the panel 3. Even if the liquid of the refrigerant 2 pushes the check valve 9 from the right side of 3 (a), the check valve 9 hits the support plate 10 and does not open, so that the liquid of the refrigerant 2 does not flow into the steam pipe 4.

The other configuration and operation are the same as those of the first embodiment, and the description is omitted.

[0018]

As can be seen from the above description, according to the boiling cooling apparatus of the present invention, the non-compressed gas is supplied to the panel when the refrigerant is at a low temperature because the non-return means for flowing the steam only to the steam pipe and the lower part of the panel are provided. Even when the refrigerant stagnates in the upper part, the vapor of the refrigerant flows into the panel from the lower part of the panel through the bypass pipe and is liquefied. Therefore, there is no case where the circulation of the refrigerant is stopped and the cooling of the heating element is interrupted, and the cooling is performed continuously.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing Embodiment 1 of a boiling cooling device according to the present invention.

FIGS. 2A and 2B are enlarged views of a portion A in FIG. 1, wherein FIG. 2A is a front view and FIG.

3 (a) is a front view and FIG. 3 (b) is a right side view of the check means according to Embodiment 2 of the boiling cooling device according to the present invention.

FIG. 4 is an operation explanatory view of Embodiment 1 of the boiling cooling device according to the present invention.

FIG. 5 is an operation explanatory view of Embodiment 1 of the boiling cooling device according to the present invention.

FIG. 6 is a configuration diagram of a conventional boiling cooling device.

FIG. 7 is a diagram illustrating the operation of a conventional boiling cooling device.

[Explanation of symbols]

1 ... Tank 2 ... refrigerant 3. Panel 4 ... Steam pipe 5. Liquid pipe 6 ... Semiconductor 8 ... Partition plate 9 ... check valve 12 ... Bypass pipe

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-57-204156 (JP, A) JP-A-59-103318 (JP, A) JP-A-57-91544 (JP, A) JP-A 61-204 231373 (JP, A) JP-A-56-104456 (JP, A) JP-A-64-20742 (JP, U) JP-A-54-183631 (JP, U) (58) Fields investigated (Int. ⁷ , DB name) H05K 7/20

Claims (1)

(57) [Claims] 1. A panel having a hollow portion is disposed above a tank for storing a liquid refrigerant in which a heating element is immersed, and an upper portion of the tank and an upper portion of the panel are air-tightly connected via a steam pipe, In a boiling cooling device in which the lower part and the inside of the tank are air-tightly connected via a liquid pipe, the lower part of the panel is air-tightly connected to a steam pipe via a bypass pipe, and refrigerant vapor flows from the steam pipe to the panel through the bypass pipe. A boiling cooling device comprising a non-return means for preventing a liquefied refrigerant flowing toward a lower portion from flowing toward a steam pipe from a lower portion of a panel.