JPS6154654A - Liquid cooling device - Google Patents
Liquid cooling deviceInfo
- Publication number
- JPS6154654A JPS6154654A JP17670884A JP17670884A JPS6154654A JP S6154654 A JPS6154654 A JP S6154654A JP 17670884 A JP17670884 A JP 17670884A JP 17670884 A JP17670884 A JP 17670884A JP S6154654 A JPS6154654 A JP S6154654A
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- liquid
- pipe
- cooling liquid
- boiling point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は半導体素子の液冷装置に係り、特に半導体素子
の冷却効率を向上し得る液冷装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a liquid cooling device for semiconductor devices, and more particularly to a liquid cooling device that can improve the cooling efficiency of semiconductor devices.
従来の技術
］ンピュータや電子機器は動作すると熱を発生する。こ
のＬうな熱はファン等を用いた主に空冷によって冷却さ
れているｏしかしながら最近では空冷より冷却効率の高
い液体による冷却方法が考えられている。この工うなコ
ンピュータや電子機器を液体で冷却する装置として浸漬
液冷モジュールがよく知られている。[Background Art] Computers and electronic devices generate heat when they operate. This heat is mainly cooled by air cooling using a fan or the like. However, recently, cooling methods using liquid, which have higher cooling efficiency than air cooling, have been considered. Immersion liquid cooling modules are well known as devices for cooling computers and electronic equipment with liquid.
浸漬液冷は半導体素子等を例えばフルオロカーボン等の
冷媒液体に浸漬し、作動時に半導体素子が発生した熱を
放熱するために冷媒液体が沸騰して奪う気化熱を作用し
ている。Immersion liquid cooling involves immersing a semiconductor element, etc., in a refrigerant liquid such as fluorocarbon, and in order to radiate the heat generated by the semiconductor element during operation, the refrigerant liquid boils and takes away the heat of vaporization.
発明が解決しようとする問題点
上記浸漬液冷では例えば大きな回路基板全冷却する場合
、上方に配設された半導体素子は下方の半導体素子から
発生した気泡の影響で冷却能力が低下する。ｔｙｃ液冷
容器上方の凝縮器に全ての放熱を頼ると外部から液冷容
器内に例えば空気等の不純物ガスが混入し冷却能力が低
下する。本発明はこの工うな問題点を解決するためのも
のである０問題点を解決するための手段
上記問題点は本発明に１れば半導体素子を冷却用液体に
直接浸漬することによって冷却する液冷装置において；
該冷却用液体を通る冷却パイプを設け、該冷却用液体の
沸点よりも低い沸点を有する液体を該冷却パイプ中に循
環させたことを特徴とする液冷装置によって解決される
０
作用
本発明によれば冷却用液体中に低沸点液体を入れて循環
させているので冷却用液体中に発生した気泡が効率より
凝縮、消去せしめられる。Problems to be Solved by the Invention With the above-mentioned immersion liquid cooling, for example, when a large circuit board is completely cooled, the cooling ability of the semiconductor elements disposed above is reduced due to the influence of air bubbles generated from the semiconductor elements below. If all of the heat is radiated from the condenser above the TYC liquid-cooled container, impurity gas such as air will enter the liquid-cooled container from the outside, reducing the cooling capacity. The present invention is intended to solve this difficult problem.0Means for solving the problemThe above problem can be solved by the present invention. In a cooling device; The present invention is solved by a liquid cooling device characterized in that a cooling pipe is provided through which the cooling liquid passes, and a liquid having a boiling point lower than the boiling point of the cooling liquid is circulated through the cooling pipe. According to the present invention, since a low boiling point liquid is placed in the cooling liquid and circulated, air bubbles generated in the cooling liquid can be efficiently condensed and eliminated.
実施例
以下、本発明の実施例を図面に基づいて説明する０
第１図は本発明に係る液冷装置の一実施例を示す模式図
である。Embodiments Hereinafter, embodiments of the present invention will be described based on the drawings. FIG. 1 is a schematic diagram showing an embodiment of a liquid cooling device according to the present invention.
第１図おいて、容器ｌ内に冷却用液体として５０℃の沸
点を示すフルオロカーボン２が収容されており、該フル
オロカーボン２内に半導体素子であるＬＳＩ５を多数塔
載した回路基板４が浸漬されている。回路基板４に近接
して水平方向に帆桁する部分を有するパイプ５がフルオ
ロカーボン２内を走り且つ容器１上方に設けられた冷却
水６内を通るように連続パイプとして設けられている。In FIG. 1, a fluorocarbon 2 having a boiling point of 50° C. is housed as a cooling liquid in a container l, and a circuit board 4 on which a number of LSIs 5, which are semiconductor devices, are mounted is immersed in the fluorocarbon 2. There is. A pipe 5 having a horizontally sailing portion adjacent to the circuit board 4 is provided as a continuous pipe so as to run within the fluorocarbon 2 and pass through the cooling water 6 provided above the container 1.
該パイプ５内壁には弁７が数箇所に設けられている。更
に該パイプ５内にはフルオロカーボン２を冷却するため
の沸点が約３０〜４０℃の第２のフルオロカーボン８が
充填されている。Valves 7 are provided at several locations on the inner wall of the pipe 5. Further, the pipe 5 is filled with a second fluorocarbon 8 having a boiling point of about 30 to 40°C for cooling the fluorocarbon 2.
ＬＳＩ３Ｔｈ作動させると容器１内の冷媒であるフルオ
ロカーボン２は５０℃で沸騰し、多数の気泡９を発生し
てＬＳＩ３の熱を奪う。フルオロカーボン２より沸点の
低い第２のフルオロカーボン８は沸騰したフルオロカー
ボン２の熱を奪って沸騰しパイプ５内壁に設けた弁７の
作用に１って一定方向に対流を発生する。その結果矢印
Ａで示す工うにフルオシカーボン２はパイプ５内を循環
し。When the LSI 3Th is activated, the fluorocarbon 2, which is a refrigerant in the container 1, boils at 50° C., generates a large number of bubbles 9, and removes heat from the LSI 3. The second fluorocarbon 8, which has a lower boiling point than the fluorocarbon 2, absorbs the heat of the boiled fluorocarbon 2, boils, and generates convection in a certain direction due to the action of the valve 7 provided on the inner wall of the pipe 5. As a result, the fluorocarbon 2 circulates within the pipe 5 as indicated by arrow A.
冷却水６に工って凝縮、冷却される。The cooling water 6 is condensed and cooled.
直接ＬＳＩ３’ｔ−冷却する冷媒としては上記のフルオ
ロカーボンの他にフレオン等も用いられる。パイプ５内
に充填する冷媒の沸点はＬＳＩ２の直接の冷媒の沸点エ
リ２０〜３０℃程度低いのが好ましい。In addition to the above-mentioned fluorocarbons, freon and the like can also be used as the refrigerant for directly cooling the LSI 3't. The boiling point of the refrigerant filled in the pipe 5 is preferably about 20 to 30° C. lower than the boiling point of the refrigerant directly in the LSI 2.
パイプ５の形状は冷媒としてのフルオロカーボン２の熱
を効率１く奪うような形状が好ましい０なお冷却水６は
矢印Ｂで示すように流され冷却効率を向上させるのに寄
与せしめられている。It is preferable that the shape of the pipe 5 is such that it can efficiently remove heat from the fluorocarbon 2 as a refrigerant.The cooling water 6 is flowed as shown by the arrow B to contribute to improving the cooling efficiency.
発明の詳細
な説明した工うに、本発明によれば半導体素子の冷却効
率を高めることが可能である。As described in detail, according to the present invention, it is possible to improve the cooling efficiency of semiconductor devices.
第１図は本発明に係る液冷装置の一実施例を示す模式図
である。
ｌ・・・・・・容器、２・・・・・・フルオロカーボン
、３・・・・・・ＬＳＩ、４・・・・・・回路基板、５
・・・・・・ノ（イブ、６・・・・・・冷却水、７・・
・・・・弁、８・・・・・・第２のフルオシカーボン、
９・・・・・・気泡。FIG. 1 is a schematic diagram showing an embodiment of a liquid cooling device according to the present invention. l...Container, 2...Fluorocarbon, 3...LSI, 4...Circuit board, 5
・・・・・・ノ(Eve, 6... Cooling water, 7...
...Valve, 8...Second Fluocycarbon,
9... Bubbles.
Claims (1)
て冷却する液冷装置において； 該冷却用液体を通る冷却パイプを設け、該冷却用液体の
沸点よりも低い沸点を有する液体を該冷却パイプ中に循
環させたことを特徴とする液冷装置。 ２、前記冷却パイプに弁を設けたことを特徴とする特許
請求の範囲第１項記載の液冷装置。[Claims] 1. In a liquid cooling device that cools a semiconductor element by directly immersing it in a cooling liquid; a cooling pipe passing through the cooling liquid is provided, and the cooling pipe has a boiling point lower than the boiling point of the cooling liquid. A liquid cooling device characterized in that a liquid is circulated through the cooling pipe. 2. The liquid cooling device according to claim 1, wherein the cooling pipe is provided with a valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17670884A JPS6154654A (en) | 1984-08-27 | 1984-08-27 | Liquid cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17670884A JPS6154654A (en) | 1984-08-27 | 1984-08-27 | Liquid cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6154654A true JPS6154654A (en) | 1986-03-18 |
| JPH0317222B2 JPH0317222B2 (en) | 1991-03-07 |
Family
ID=16018364
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17670884A Granted JPS6154654A (en) | 1984-08-27 | 1984-08-27 | Liquid cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6154654A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005284138A (en) * | 2004-03-30 | 2005-10-13 | Seiko Epson Corp | Optical device and projector |
| WO2007102498A1 (en) | 2006-03-06 | 2007-09-13 | Tokyo University Of Science Educational Foundation Administrative Organization | Method of ebullient cooling, ebullient cooling apparatus, flow channel structure and application product thereof |
| US8061414B2 (en) | 2004-12-22 | 2011-11-22 | Tokyo University Of Science Educational Foundation Administrative Organization | Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof |
| WO2016075838A1 (en) * | 2014-11-14 | 2016-05-19 | 株式会社ＥｘａＳｃａｌｅｒ | Cooling system and cooling method for electronic apparatus |
| WO2017037860A1 (en) * | 2015-08-31 | 2017-03-09 | 株式会社ＥｘａＳｃａｌｅｒ | Cooling system for electronic device |
| US9653380B2 (en) | 2015-05-26 | 2017-05-16 | Fujitsu Limited | Method for manufacturing component built-in substrate |
| US20180092243A1 (en) * | 2015-03-30 | 2018-03-29 | Exascaler Inc. | Electronic-device cooling system |
-
1984
- 1984-08-27 JP JP17670884A patent/JPS6154654A/en active Granted
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005284138A (en) * | 2004-03-30 | 2005-10-13 | Seiko Epson Corp | Optical device and projector |
| US8061414B2 (en) | 2004-12-22 | 2011-11-22 | Tokyo University Of Science Educational Foundation Administrative Organization | Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof |
| WO2007102498A1 (en) | 2006-03-06 | 2007-09-13 | Tokyo University Of Science Educational Foundation Administrative Organization | Method of ebullient cooling, ebullient cooling apparatus, flow channel structure and application product thereof |
| WO2016075838A1 (en) * | 2014-11-14 | 2016-05-19 | 株式会社ＥｘａＳｃａｌｅｒ | Cooling system and cooling method for electronic apparatus |
| JPWO2016075838A1 (en) * | 2014-11-14 | 2017-10-19 | 株式会社ＥｘａＳｃａｌｅｒ | Electronic device cooling system and cooling method |
| US20170332514A1 (en) * | 2014-11-14 | 2017-11-16 | Exascaler Inc. | Cooling system and cooling method for electronic equipment |
| US20180092243A1 (en) * | 2015-03-30 | 2018-03-29 | Exascaler Inc. | Electronic-device cooling system |
| US10123454B2 (en) * | 2015-03-30 | 2018-11-06 | Exascaler Inc. | Electronic-device cooling system |
| US9653380B2 (en) | 2015-05-26 | 2017-05-16 | Fujitsu Limited | Method for manufacturing component built-in substrate |
| WO2017037860A1 (en) * | 2015-08-31 | 2017-03-09 | 株式会社ＥｘａＳｃａｌｅｒ | Cooling system for electronic device |
| CN107924896A (en) * | 2015-08-31 | 2018-04-17 | 株式会社ＥｘａＳｃａｌｅｒ | The cooling system of electronic equipment |
| CN107924896B (en) * | 2015-08-31 | 2021-07-23 | 株式会社ＥｘａＳｃａｌｅｒ | Cooling system for electronic equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0317222B2 (en) | 1991-03-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US10888032B2 (en) | Apparatus for liquid immersion cooling, system for liquid immersion cooling, and method of cooling electronic device | |
| US6193905B1 (en) | Immersion cooling coolant | |
| US10517191B2 (en) | Liquid immersion server | |
| JP6278071B2 (en) | Electronic equipment immersion tank | |
| KR20100045376A (en) | Open flow cold plate for liquid cooled electronic packages | |
| JPWO2012025981A1 (en) | Cooling device, electronic device having cooling device, and cooling method of heating element | |
| US20070107441A1 (en) | Heat-dissipating unit and related liquid cooling module | |
| JPS6154654A (en) | Liquid cooling device | |
| JPH05335454A (en) | Cooler for electronic apparatus | |
| CN115696850A (en) | Fluid submersion type cooling system and method for cooling electronic system | |
| JPH04147657A (en) | Cooling mechanism for electronic component | |
| JPH02114597A (en) | Method of cooling electronic device | |
| JPS6285449A (en) | Cooling structure for semiconductor device | |
| CN115066157A (en) | Liquid cooling heat dissipation system and data center | |
| JP2874100B2 (en) | Electronic equipment cooling system | |
| CN219225465U (en) | Two-phase immersion cooling device and system | |
| JPS59232448A (en) | Liquid cooled container | |
| JP2828996B2 (en) | Semiconductor cooling equipment | |
| JPH0442931Y2 (en) | ||
| JPS6285448A (en) | Cooling structure for semiconductor device | |
| JPH0533015Y2 (en) | ||
| JP2013182439A (en) | Cooling system of electronic device | |
| JP2746938B2 (en) | Cooling device for power supply circuit board | |
| US20220381520A1 (en) | Heat dissipating device | |
| JPH03224256A (en) | Cooling equipment for electronic machinery and apparatus |