JPH04147657A - Cooling mechanism for electronic component - Google Patents
Cooling mechanism for electronic componentInfo
- Publication number
- JPH04147657A JPH04147657A JP2272842A JP27284290A JPH04147657A JP H04147657 A JPH04147657 A JP H04147657A JP 2272842 A JP2272842 A JP 2272842A JP 27284290 A JP27284290 A JP 27284290A JP H04147657 A JPH04147657 A JP H04147657A
- Authority
- JP
- Japan
- Prior art keywords
- pump
- cooling medium
- liquid refrigerant
- liquid cooling
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 34
- 239000007788 liquid Substances 0.000 claims abstract description 48
- 239000003507 refrigerant Substances 0.000 claims description 49
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 230000006837 decompression Effects 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000009835 boiling Methods 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 3
- 239000002826 coolant Substances 0.000 abstract 9
- 206010047700 Vomiting Diseases 0.000 abstract 1
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000010365 information processing Effects 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B23/00—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect
- F25B23/006—Machines, plants or systems, with a single mode of operation not covered by groups F25B1/00 - F25B21/00, e.g. using selective radiation effect boiling cooling systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2339/00—Details of evaporators; Details of condensers
- F25B2339/02—Details of evaporators
- F25B2339/021—Evaporators in which refrigerant is sprayed on a surface to be cooled
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
技術分野
本発明は電子部品冷却機構に関し、特に情報処理装置な
どに使用される集積回路の冷却構造に関する。TECHNICAL FIELD The present invention relates to an electronic component cooling mechanism, and more particularly to a cooling structure for an integrated circuit used in an information processing device or the like.
従来技術
近年、情報処理装置などに使用される電子回路において
は、益々高集積化する傾向にあり、それにともなって電
子回路が消費する電力も大きくなってきており、電子回
路に使用されるＬＳＩ（大規模集積回路）などの素子の
発熱量も増加してきている。BACKGROUND ART In recent years, electronic circuits used in information processing devices and the like have tended to become more and more highly integrated, and as a result, the power consumed by electronic circuits has also increased. The amount of heat generated by elements such as large-scale integrated circuits is also increasing.
素子の温度が上昇すると、素子の性能が十分に発揮され
ないばかりか、信頼性の面からも大きな問題となる。If the temperature of the device increases, not only will the device's performance not be fully demonstrated, but it will also pose a serious problem in terms of reliability.
よって、素子から発生した熱をいかに効率よく装置外に
排出するかが、その装置の性能を左右することになる。Therefore, the performance of the device is determined by how efficiently the heat generated from the elements is discharged to the outside of the device.
この素子を冷却する方法としては、素子にフィンなどの
ヒートシンクを取付けて自然放熱を促す自然空冷や、フ
ァンなどを使用して空気を強制的に衝突させて冷却する
強制空冷などの方法がある。Methods for cooling this element include natural air cooling, which involves attaching heat sinks such as fins to the element to promote natural heat dissipation, and forced air cooling, which uses a fan or the like to force air to collide with each other to cool the element.
また、近年では液体による冷却も行われており、その液
体冷却の方法としては、冷却水を素子から離れたところ
に流して素子を液体で間接的に冷却する方法や、化学的
に不活性で、電気絶縁性の大きい液体（例えばフッ素系
の不活性液体など）に素子を直接浸漬して冷却する方法
などがある。In recent years, liquid cooling has also been used; liquid cooling methods include cooling the element indirectly by flowing cooling water away from the element, and cooling the element using a chemically inert liquid. There is a method of cooling the device by directly immersing it in a highly electrically insulating liquid (for example, a fluorine-based inert liquid).
このような従来の電子回路の冷却方法では、最近の素子
の発熱密度が非常に大きくなっているので、上記の冷却
方法では冷却能力が不十分となるという問題がある。Such conventional cooling methods for electronic circuits have a problem in that the cooling capacity of the above-mentioned cooling methods is insufficient because the heat generation density of recent elements has become extremely large.
特に、冷却効率の比較的良好な沸騰冷却を用いても、冷
却する素子周辺で気化した冷媒蒸気が素子周辺と冷媒と
の間に膜を作ってしまうという膜沸騰を起こしてしまい
、冷却装置の冷却能力が極めて悪くなるという問題があ
る。In particular, even if boiling cooling, which has relatively good cooling efficiency, is used, film boiling occurs, where the refrigerant vapor that evaporates around the elements to be cooled forms a film between the elements and the refrigerant. There is a problem in that the cooling capacity becomes extremely poor.
発明の目的
本発明は上記のような従来のものの問題点を除去すべく
なされたもので、沸騰冷却の効率を上げることかでき、
冷却能力を大きくすることができる電子部品冷却機構の
提供を目的とする。Purpose of the Invention The present invention has been made to eliminate the problems of the conventional methods as described above, and is capable of increasing the efficiency of boiling cooling.
The purpose of the present invention is to provide an electronic component cooling mechanism that can increase cooling capacity.
発明の構成
本発明による電子部品冷却機構は、電子部品を搭載する
パッケージと、前記電子部品を冷却するためのヒートシ
ンクと、前記パッケージを搭載する印刷基板と、前記パ
ッケージと前記ヒートシンクと前記印刷基板とを密封す
る密封ケースとを有する電子部品冷却機構であって、前
記密封ケース内を減圧する減圧手段と、前記ヒートシン
クに液体冷媒を噴射する噴射ノズルと、前記噴射ノズル
により前記ヒートシンクに噴射された前記液体冷媒を循
環させて前記噴射ノズルから噴射させる循環手段とを設
けたことを特徴とする。Structure of the Invention An electronic component cooling mechanism according to the present invention includes a package for mounting an electronic component, a heat sink for cooling the electronic component, a printed circuit board for mounting the package, the package, the heat sink, and the printed circuit board. An electronic component cooling mechanism having a sealed case for sealing the sealed case, a pressure reducing means for reducing the pressure inside the sealed case, an injection nozzle for injecting a liquid refrigerant onto the heat sink, and a liquid refrigerant injected onto the heat sink by the injection nozzle. The apparatus is characterized by further comprising a circulation means for circulating liquid refrigerant and injecting it from the injection nozzle.
実施例 次に、本発明について図面を参照して説明する。Example Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例を示す構成図である。FIG. 1 is a block diagram showing an embodiment of the present invention.
図において、回路基板１は基板枠４に保持され、この回
路基板１に搭載された集積回路２ａ〜２ｃにはヒートシ
ンク３ａ〜３ｃが夫々取付けられている。In the figure, a circuit board 1 is held by a board frame 4, and heat sinks 3a to 3c are attached to integrated circuits 2a to 2c mounted on the circuit board 1, respectively.
また、回路基板１および基板枠４にはねし５ａ。Further, the circuit board 1 and the board frame 4 are provided with screws 5a.
５ｂによりチャンハフが固定されており、回路基板１と
チャンバ７との接触面にはＯリング６が取付けられてい
るので、回路基板１とチャンバ７とにより囲まれた内部
空間は気密状態となっている。5b, and an O-ring 6 is attached to the contact surface between the circuit board 1 and the chamber 7, so that the internal space surrounded by the circuit board 1 and the chamber 7 is airtight. There is.
この内部空間には集積回路２８〜２Ｃに取付けられたヒ
ートシンク３８〜３Ｃに夫々対向するようにノズル８８
〜８ｃが設けられており、ノズル８ａ〜８Ｃは配管１６
によりポンプ１５に接続されている。In this internal space, nozzles 88 are arranged so as to face the heat sinks 38 to 3C attached to the integrated circuits 28 to 2C, respectively.
~8c are provided, and the nozzles 8a~8C are connected to the piping 16.
It is connected to the pump 15 by.
また、チャンバ７には吸引口１０と冷媒出口１１とが設
けられ、吸引口１０にはポンプ１２が接続され、冷媒出
口１１にはポンプ１８が接続されている。Further, the chamber 7 is provided with a suction port 10 and a refrigerant outlet 11, a pump 12 is connected to the suction port 10, and a pump 18 is connected to the refrigerant outlet 11.
ポンプ１２は凝縮器１３を介して熱交換器１４に接続さ
れ、ポンプ１８は熱交換器１４に接続され、熱交換器１
４はポンプ１５に接続されている。Pump 12 is connected to heat exchanger 14 via condenser 13, pump 18 is connected to heat exchanger 14, and heat exchanger 1
4 is connected to the pump 15.
集積回路２ａ〜２ｃを冷却するための液体冷媒は一定圧
力でポンプ１５から吐出され、配管１６を介して各ノズ
ル８８〜８ｃから各集積回路２ａ〜２ｃのヒートシンク
３ａ〜３ｃに噴射され、ヒトシンク３ａ〜３ｃに衝突す
ることにより集積回路２８〜２ｃを冷却する。The liquid refrigerant for cooling the integrated circuits 2a to 2c is discharged from the pump 15 at a constant pressure, and is injected from each nozzle 88 to 8c via the piping 16 to the heat sinks 3a to 3c of the integrated circuits 2a to 2c, and the heat sink 3a -3c cools the integrated circuits 28-2c.
このとき、チャンバ７の内部空間はポンプ１２により液
体冷媒が沸騰しやすい気圧に減圧されているため、ヒー
トシンク３ａ〜３ｃに衝突した液体冷媒は核沸騰を発生
させて集積回路２ａ〜２ｃをさらに冷却する。At this time, since the internal space of the chamber 7 is depressurized by the pump 12 to a pressure at which the liquid refrigerant easily boils, the liquid refrigerant colliding with the heat sinks 3a to 3c causes nucleate boiling to further cool the integrated circuits 2a to 2c. do.
この核沸騰により気化した冷媒蒸気１７は吸弓口１０か
らポンプ１２により吸引され、凝縮器１３に送られて液
化される。Refrigerant vapor 17 vaporized by this nucleate boiling is sucked through the suction port 10 by the pump 12, sent to the condenser 13, and liquefied.
液化された液体冷媒は熱交換器１４に送られてさらに冷
却され、ポンプ１５によって各ノズル８８〜８ｃからヒ
ートシンク３ａ〜３ｃに再度噴射される。The liquefied liquid refrigerant is sent to the heat exchanger 14 to be further cooled, and is again injected by the pump 15 from each nozzle 88 to 8c to the heat sinks 3a to 3c.
一方、ヒートシンク３８〜３ｃて気化しなかった液体冷
媒はチャンバ７内の冷媒だまり９に蓄積され、ポンプ１
８により冷媒出口１１がら取出されて熱交換器１４に送
られる。On the other hand, the liquid refrigerant that has not been vaporized by the heat sinks 38 to 3c is accumulated in the refrigerant reservoir 9 in the chamber 7, and the pump 1
8, the refrigerant is taken out from the refrigerant outlet 11 and sent to the heat exchanger 14.
熱交換器１４てはポンプ１８により冷媒だまり９から送
られてきた液体冷媒が凝縮器１３から送られてきた液体
冷媒とともにさらに冷却され、ポンプ１５によって各ノ
ズル８ａ〜８ｃからヒートシンク３ａ〜３Ｃに再度噴射
される。In the heat exchanger 14, the liquid refrigerant sent from the refrigerant reservoir 9 by the pump 18 is further cooled together with the liquid refrigerant sent from the condenser 13, and the pump 15 sends the liquid refrigerant from each nozzle 8a to 8c to the heat sinks 3a to 3C again. Injected.
液体冷媒を上記のように循環させ、液体冷媒をヒートシ
ンク３８〜３ｃに衝突させることにより膜沸騰の発生を
防くことができるとともに、チャンバ７内を液体冷媒か
沸騰しやすい気圧に減圧することによりヒートシンク３
ａ〜３ｃての核沸騰を促進することができるので、液体
冷媒のヒートシンク３ａ〜３ｃへの衝突とヒートシンク
３ａ〜３ｃでの核沸騰とにより集積回路２８〜２ｃをよ
り冷却することができる。By circulating the liquid refrigerant as described above and causing the liquid refrigerant to collide with the heat sinks 38 to 3c, film boiling can be prevented from occurring, and by reducing the pressure in the chamber 7 to a pressure at which the liquid refrigerant is likely to boil. heat sink 3
Since the nucleate boiling of all of the heat sinks 3a to 3c can be promoted, the integrated circuits 28 to 2c can be further cooled by the collision of the liquid refrigerant with the heat sinks 3a to 3c and the nucleate boiling in the heat sinks 3a to 3c.
第２図は本発明の他の実施例を示す構成図である。図に
おいて、本発明の他の実施例は回路基板１を水平にし、
チャンバ７内に蓄積された液体冷媒１９中に集積回路２
８〜２ｄおよびヒートシンク３ａ〜３ｄを浸漬させた以
外は、本発明の一実施例と同様の構成となっており、同
一部品には同一符号を付しである。また、それら同一部
品の動作も本発明の一実施例と同様である。FIG. 2 is a block diagram showing another embodiment of the present invention. In the figure, another embodiment of the invention has a circuit board 1 horizontally,
Integrated circuit 2 in liquid refrigerant 19 accumulated in chamber 7
The structure is similar to that of the embodiment of the present invention except that the heat sinks 8 to 2d and the heat sinks 3a to 3d are immersed, and the same parts are given the same reference numerals. Further, the operations of these same parts are also similar to those in the embodiment of the present invention.
集積回路２ａ〜２ｄを冷却するための液体冷媒は一定圧
力でポンプ１５から吐出され、配管１６を介して各ノズ
ル８ａ〜８ｄから液体冷媒１９中に浸漬された各集積回
路２８〜２ｄのヒートシンク３８〜３ｄに噴射され、ヒ
ートシンク３８〜３ｄに衝突することにより集積回路２
８〜２ｄを冷却する。A liquid refrigerant for cooling the integrated circuits 2a to 2d is discharged from a pump 15 at a constant pressure, and a heat sink 38 of each integrated circuit 28 to 2d is immersed in the liquid refrigerant 19 from each nozzle 8a to 8d via piping 16. ~3d and collides with the heat sinks 38~3d, thereby damaging the integrated circuit 2.
Cool 8-2d.
このとき、チャンバ７の内部空間はポンプ１２により液
体冷媒が沸騰しやすい気圧に減圧されているため、ヒー
トシンク３８〜３ｄに衝突した液体冷媒は核沸騰を発生
させて集積回路２ａ〜２ｄをさらに冷却する。At this time, since the internal space of the chamber 7 is depressurized by the pump 12 to a pressure at which the liquid refrigerant easily boils, the liquid refrigerant colliding with the heat sinks 38 to 3d generates nucleate boiling to further cool the integrated circuits 2a to 2d. do.
この核沸騰により気化した冷媒蒸気１７は吸引口１０か
らポンプ１２により吸引され、凝縮器１３に送られて液
化される。Refrigerant vapor 17 vaporized by this nucleate boiling is sucked through the suction port 10 by the pump 12, sent to the condenser 13, and liquefied.
液化された液体冷媒は熱交換器１４に送られてさらに冷
却され、ポンプ１５によって各ノズル８８〜８ｄからヒ
ートシンク３ａ〜３ｄに再度噴射される。The liquefied liquid refrigerant is sent to the heat exchanger 14 to be further cooled, and is again injected by the pump 15 from each nozzle 88 to 8d to the heat sinks 3a to 3d.
一方、集積回路２ａ〜２ｄおよびヒートシンク３ａ〜３
ｄが浸漬された液体冷媒１９はポンプ１８により冷媒出
口１１から取出されて熱交換器１４に送られる。On the other hand, integrated circuits 2a to 2d and heat sinks 3a to 3
The liquid refrigerant 19 in which the liquid refrigerant d is immersed is taken out from the refrigerant outlet 11 by the pump 18 and sent to the heat exchanger 14.
熱交換器１４ではポンプ１８により冷媒出口１１から取
出されて送られてきた液体冷媒が凝縮器１３から送られ
てきた液体冷媒とともにさらに冷却され、ポンプ１５に
よって各ノズル８８〜８ｄからヒートシンク３８〜３ｄ
に再度噴射される。In the heat exchanger 14, the liquid refrigerant taken out from the refrigerant outlet 11 and sent by the pump 18 is further cooled together with the liquid refrigerant sent from the condenser 13.
is injected again.
液体冷媒を上記のように循環させ、液体冷媒をヒートシ
ンク３８〜３ｄに衝突させることにより膜沸騰の発生を
防ぐことができるとともに、チャンバ７内を液体冷媒か
沸騰しゃすい気圧に減圧することによりヒートシンク３
８〜３ｄでの核沸騰を促進することができるので、液体
冷媒のヒートシンク３８〜３ｄへの衝突とヒートシンク
３ａ〜３ｄての核沸騰と集積回路２２〜２ｄおよびヒー
トシンク３８〜３ｄの液体冷媒中への浸漬とにより集積
回路２８〜２ｄをより冷却することができる。By circulating the liquid refrigerant as described above and causing the liquid refrigerant to collide with the heat sinks 38 to 3d, film boiling can be prevented from occurring, and by reducing the pressure in the chamber 7 to a pressure at which the liquid refrigerant does not boil, the heat sink 3
Since nucleate boiling at 8-3d can be promoted, the liquid refrigerant impinges on the heat sinks 38-3d, nucleate boils on the heat sinks 3a-3d, and enters the liquid refrigerant in the integrated circuits 22-2d and heat sinks 38-3d. The integrated circuits 28 to 2d can be further cooled by immersion.
このように、液体冷媒をノズル８ａ〜８ｄがら噴射させ
て集積回路２ａ〜２ｄ上のヒートシンク３８〜３ｄに衝
突させて集積回路２８〜２ｄを冷却するとともに、チャ
ンバ７の内部空間をポンプ１２により減圧して液体冷媒
の核沸騰を促進するようにすることによって、液体冷媒
のヒートシンク３８〜３ｄへの衝突により膜沸騰の発生
を防ぐことができるので、沸騰冷却の効率を上げること
ができ、冷却能力を従来よりも大幅に大きくすることが
できる。In this way, the liquid refrigerant is injected from the nozzles 8a to 8d and collides with the heat sinks 38 to 3d on the integrated circuits 2a to 2d to cool the integrated circuits 28 to 2d, and the internal space of the chamber 7 is depressurized by the pump 12. By promoting nucleate boiling of the liquid refrigerant, it is possible to prevent the occurrence of film boiling due to the collision of the liquid refrigerant with the heat sinks 38 to 3d, thereby increasing the efficiency of boiling cooling and increasing the cooling capacity. can be made significantly larger than before.
発明の詳細
な説明したように本発明によれば、密封ケース内を液体
冷媒か沸騰しゃすい気圧に減圧し、噴射ノズルにより液
体冷媒を電子部品に取付けられたヒートシンクに噴射す
るようにすることによって、沸騰冷却の効率を上げるこ
とができ、冷却能力を大きくすることができるという効
果がある。DETAILED DESCRIPTION OF THE INVENTION According to the present invention, the pressure inside the sealed case is reduced to a pressure at which the liquid refrigerant boils, and the liquid refrigerant is injected to the heat sink attached to the electronic component using the injection nozzle. This has the effect of increasing the efficiency of boiling cooling and increasing the cooling capacity.
第１図は本発明の一実施例を示す構成図、第２図は本発
明の他の実施例を示す構成図である。
主要部分の符号の説明
１・・・・回路基板
２ａ〜２ｄ・・・・・・集積回路
１２゜
３８〜３ｄ・・・・・ヒートシンク
７・・・・ チャンバ
８ａ〜８ｄ・・・・・ノズル
１５．１８・・・・・ポンプ
１３・・・・・凝縮器
１４・・・・・熱交換器FIG. 1 is a block diagram showing one embodiment of the present invention, and FIG. 2 is a block diagram showing another embodiment of the present invention. Explanation of symbols of main parts 1...Circuit board 2a-2d...Integrated circuit 12°38-3d...Heat sink 7...Chamber 8a-8d...Nozzle 15.18... Pump 13... Condenser 14... Heat exchanger
Claims (1)
を冷却するためのヒートシンクと、前記パッケージを搭
載する印刷基板と、前記パッケージと前記ヒートシンク
と前記印刷基板とを密封する密封ケースとを有する電子
部品冷却機構であって、前記密封ケース内を減圧する減
圧手段と、前記ヒートシンクに液体冷媒を噴射する噴射
ノズルと、前記噴射ノズルにより前記ヒートシンクに噴
射された前記液体冷媒を循環させて前記噴射ノズルから
噴射させる循環手段とを設けたことを特徴とする電子部
品冷却機構。(1) An electronic device having a package on which an electronic component is mounted, a heat sink for cooling the electronic component, a printed circuit board on which the package is mounted, and a sealed case that seals the package, the heat sink, and the printed circuit board. The component cooling mechanism includes a decompression means for reducing the pressure inside the sealed case, an injection nozzle for injecting a liquid refrigerant onto the heat sink, and circulating the liquid refrigerant injected to the heat sink by the injection nozzle to the injection nozzle. An electronic component cooling mechanism characterized by being provided with a circulation means for injecting water from the air.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2272842A JP2550770B2 (en) | 1990-10-11 | 1990-10-11 | Electronic component cooling mechanism |
| CA002053055A CA2053055C (en) | 1990-10-11 | 1991-10-09 | Liquid cooling system for lsi packages |
| EP19910309381 EP0480750A3 (en) | 1990-10-11 | 1991-10-11 | Liquid cooling system for lsi packages |
| EP97114551A EP0817263A3 (en) | 1990-10-11 | 1991-10-11 | Liquid cooling system for LSI packages |
| US08/155,546 US5522452A (en) | 1990-10-11 | 1993-11-22 | Liquid cooling system for LSI packages |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2272842A JP2550770B2 (en) | 1990-10-11 | 1990-10-11 | Electronic component cooling mechanism |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04147657A true JPH04147657A (en) | 1992-05-21 |
| JP2550770B2 JP2550770B2 (en) | 1996-11-06 |
Family
ID=17519537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2272842A Expired - Lifetime JP2550770B2 (en) | 1990-10-11 | 1990-10-11 | Electronic component cooling mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2550770B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5448108A (en) * | 1993-11-02 | 1995-09-05 | Hughes Aircraft Company | Cooling of semiconductor power modules by flushing with dielectric liquid |
| US5719444A (en) * | 1996-04-26 | 1998-02-17 | Tilton; Charles L. | Packaging and cooling system for power semi-conductor |
| EP1493983A1 (en) * | 2002-04-08 | 2005-01-05 | Sharp Kabushiki Kaisha | Loop-type thermosiphon and stirling refrigerator |
| WO2006075493A1 (en) * | 2004-12-22 | 2006-07-20 | Tokyo University Of Science Educational Foundation Administrative Organization | Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof |
| JP2007208155A (en) * | 2006-02-06 | 2007-08-16 | Hitachi Ltd | Cooling system for electronic equipment |
| JP2008543112A (en) * | 2005-06-07 | 2008-11-27 | ウォルベリン チューブ， インコーポレイテッド | Heat transfer surface for cooling electronic components |
| EP1860695A3 (en) * | 2006-05-24 | 2010-06-16 | Raytheon Company | System and method of jet impingement cooling with extended surfaces |
| JP2012531056A (en) * | 2009-06-25 | 2012-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Cooling device and manufacturing method thereof |
| US9383145B2 (en) | 2005-11-30 | 2016-07-05 | Raytheon Company | System and method of boiling heat transfer using self-induced coolant transport and impingements |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4141613B2 (en) | 2000-03-09 | 2008-08-27 | 富士通株式会社 | Closed cycle refrigerator and dry evaporator for closed cycle refrigerator |
-
1990
- 1990-10-11 JP JP2272842A patent/JP2550770B2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5448108A (en) * | 1993-11-02 | 1995-09-05 | Hughes Aircraft Company | Cooling of semiconductor power modules by flushing with dielectric liquid |
| US5719444A (en) * | 1996-04-26 | 1998-02-17 | Tilton; Charles L. | Packaging and cooling system for power semi-conductor |
| EP1493983A1 (en) * | 2002-04-08 | 2005-01-05 | Sharp Kabushiki Kaisha | Loop-type thermosiphon and stirling refrigerator |
| EP1493983A4 (en) * | 2002-04-08 | 2006-06-07 | Sharp Kk | Loop-type thermosiphon and stirling refrigerator |
| WO2006075493A1 (en) * | 2004-12-22 | 2006-07-20 | Tokyo University Of Science Educational Foundation Administrative Organization | Vapor cooling method, vapor cooling apparatus, and flow passage structure, and application thereof |
| US8061414B2 (en) | 2004-12-22 | 2011-11-22 | Tokyo University Of Science Educational Foundation Administrative Organization | Boil cooling method, boil cooling apparatus, flow channel structure, and applied technology field thereof |
| JP2008543112A (en) * | 2005-06-07 | 2008-11-27 | ウォルベリン チューブ， インコーポレイテッド | Heat transfer surface for cooling electronic components |
| US9383145B2 (en) | 2005-11-30 | 2016-07-05 | Raytheon Company | System and method of boiling heat transfer using self-induced coolant transport and impingements |
| JP2007208155A (en) * | 2006-02-06 | 2007-08-16 | Hitachi Ltd | Cooling system for electronic equipment |
| EP1860695A3 (en) * | 2006-05-24 | 2010-06-16 | Raytheon Company | System and method of jet impingement cooling with extended surfaces |
| JP2012531056A (en) * | 2009-06-25 | 2012-12-06 | インターナショナル・ビジネス・マシーンズ・コーポレーション | Cooling device and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2550770B2 (en) | 1996-11-06 |
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