CN101645430B - Chip cooling device - Google Patents
Chip cooling device Download PDFInfo
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- CN101645430B CN101645430B CN2009101022045A CN200910102204A CN101645430B CN 101645430 B CN101645430 B CN 101645430B CN 2009101022045 A CN2009101022045 A CN 2009101022045A CN 200910102204 A CN200910102204 A CN 200910102204A CN 101645430 B CN101645430 B CN 101645430B
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- 238000001816 cooling Methods 0.000 title claims abstract description 100
- 239000012809 cooling fluid Substances 0.000 claims description 42
- 239000012530 fluid Substances 0.000 claims description 37
- 239000002826 coolant Substances 0.000 claims description 32
- 238000009833 condensation Methods 0.000 claims description 20
- 230000005494 condensation Effects 0.000 claims description 20
- 238000005086 pumping Methods 0.000 claims description 19
- 230000000295 complement effect Effects 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 239000000110 cooling liquid Substances 0.000 abstract 5
- 230000017525 heat dissipation Effects 0.000 abstract 1
- 239000007788 liquid Substances 0.000 description 24
- 238000009835 boiling Methods 0.000 description 12
- 230000000694 effects Effects 0.000 description 12
- 238000005516 engineering process Methods 0.000 description 9
- 230000004907 flux Effects 0.000 description 7
- 238000012546 transfer Methods 0.000 description 7
- 239000010408 film Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 239000007921 spray Substances 0.000 description 4
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
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- 230000007246 mechanism Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
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- 230000005855 radiation Effects 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
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Abstract
The invention discloses a chip cooling device which comprises a cooling room positioned at the bottom of the device and matched with the chip, a cooling liquid pond stored with cooling liquid, a first micro channel, a first micro pump, a second micro channel, a micro nozzle, a third micro channel, a second micro pump, a fourth micro channel, a condenser and a micropore, wherein one end of the first micro pump is communicated with the cooling liquid pond by the first micro channel and the other end is communicated with the micro nozzle by the second micro channel; the micro nozzle is arranged above the cooling room and communicated with the cooling room; one end of the second micro pump is communicated with the cooling room by the third micro channel and the other end is communicated with the condenser by the fourth micro channel; the condenser is positioned above the cooling liquid pond and a condensing channel is arranged in the interior of the condenser; and a radiating fin is arranged on the top of the condensing channel which is communicated with the cooling liquid pond by the micropore. The chip cooling device has small volume, high heat dissipation efficiency, very high controllability and working flexibility and can meet the cooling requirements of the chip in different working conditions.
Description
Technical field
The present invention relates to a kind of chip cooling device, relate in particular to a kind of fine liquid drop spray chip cooling device that is used for the employing micro electro mechanical system (MEMS) technology of high density high-power chip cooling.
Background technology
Present chip cooling device external fin and the fans of adopting more, these two kinds of chip cooling devices all are the heats that removes chip by the convective heat transfer of air, by contrast, fan heat sink efficient as Forced Convection Heat Transfer is higher, with the used fan heat sink of computer CPU is example, under the rotating speed of fan blade up to 4000r/min, can avoid the temperature of CPU too high substantially, but this system noise is very big, and heat-sinking capability has reached the limit that cross-ventilation conducts heat.Fast development along with microelectric technique, the factors such as number of pins reduction that the integrated functionality of single-chip is more complicated, clock frequency improves fast, encapsulate attenuation, the pin-pitch of encapsulation reduces, encapsulates cause single-chip constantly to high-power and miniaturization development, and traditional type of cooling has not satisfied the heat radiation requirement of single-chip and chipset.When the operating frequency of chip reaches 800MHz when above, maximum power can reach 100W, and the mean heat flux between shell and heat abstractor can reach 7.1W/cm
2More than, when system uses a large amount of high-power chip, use the controlled temperature of fin or fan can only be about 100 ℃, and guarantee that usually the temperature of chip operate as normal is about 60 ℃.
This shows, the thermal control problem of high density high-power chip is more and more outstanding, and at some photoelectricity communication apparatus, in nuclear, electrical control equipment or the like the field, equally also be faced with the thermal control problem that a lot of urgent needs solve, the key that addresses this problem is to seek a kind of thermotransport mode efficiently at the high density thermal source in the different chips.Because the convective heat transfer efficient of liquid is higher than gas, a kind of immersion liquid cooling apparatus has appearred at present, upper surface by chip directly contacts with fin, the another side of fin is under water, liquid externally circulates under the effect of pump, thus with the heat delivery of chip to atmospheric environment, though this device has better cooling effect, but take than large space, influence the integrated and encapsulation of postorder of chip.
Summary of the invention
The objective of the invention is to solve the deficiency that above-mentioned existing chip cooling device exists, provide a kind of radiating efficiency high chip cooling device.
The technical solution used in the present invention is: chip cooling device mainly comprises coolant reservoirs, first fluid channel, first Micropump, second fluid channel, micro-nozzle, cooling chamber, the 3rd fluid channel, second Micropump, the 4th fluid channel, condenser and micropore, and described coolant reservoirs stores cooling fluid; One end of first Micropump is connected with coolant reservoirs by first fluid channel, and the other end of first Micropump is connected with micro-nozzle by second fluid channel; Described cooling chamber is positioned at the bottom of described chip cooling device and is complementary with described chip; Described micro-nozzle is located at the top of cooling chamber and is connected with cooling chamber; One end of second Micropump is connected with cooling chamber by the 3rd fluid channel, and the other end of second Micropump is connected with condenser by the 4th fluid channel; Described condenser is positioned at the top of coolant reservoirs, and the inside of condenser is provided with the condensation runner, and the top of condensation runner is provided with fin, and described condensation runner is connected by micropore with coolant reservoirs.
Further, be provided with the elasticity pumping diaphragm in first Micropump of the present invention.
Further, be provided with the elasticity pumping diaphragm in second Micropump of the present invention.
Further, micro-nozzle of the present invention is for pressing the micro-nozzle array that the rectangular array mode is evenly arranged.
Further, micropore of the present invention is for pressing the microwell array that the rectangular array mode is evenly arranged.
During use, chip cooling device of the present invention is installed on the surface of chip,, makes the upper surface of micro-nozzle simultaneously over against chip even also this chip places in the cooling chamber.Because cooling chamber and chip are complementary, therefore after placing chip in the cooling chamber, by chip cooling chamber and atmosphere outside are isolated, and make the relative atmosphere outside of cooling chamber have good sealing property.Chip cooling device is as follows to the cyclic process that chip cools off: the cooling fluid in the coolant reservoirs is under the driving of first Micropump, flow into micro-nozzle via first fluid channel and second fluid channel, and spray into cooling chamber from micro-nozzle with the form of little droplet form cooling fluid, since cooling chamber be positioned at chip upper surface directly over, little drop cooling fluid is directly impacted the upper surface at euthermic chip; By effective control to the first Micropump pumping diaphragm vibration amplitude and frequency, make the little drop cooling fluid that ejects form the film of one deck suitable thickness at chip upper surface, in quality and the energy delivery directly finished on the solid liquid interface between the liquid gas, make the contact heat resistance at interface reach minimum, obtain very high critical heat flux density value, and do not have an influence of boiling initial lag effect, like this, the surface temperature of chip can remain near the saturation temperature value of cooling fluid under system pressure, and the uniformity of temperature profile of chip hot surface; Cooling fluid is seethed with excitement at chip upper surface, the heat that absorbs chip in cooling chamber changes gaseous state into by liquid state, the gaseous state cooling fluid is under the driving of second Micropump, flow into condenser via the 3rd fluid channel and the 4th fluid channel, by effective control to the second Micropump pumping diaphragm vibration amplitude and frequency, flow into condenser in time with the gaseous state cooling fluid that produces in the assurance cooling chamber, thereby guarantee the smooth and easy of the interior cool cycles of enclosure space; Be provided with the condensation runner of annular in the inside of condenser, and the equally distributed wing shape of condenser overhead fin contacts with atmospheric environment, can guarantee that the gaseous state cooling fluid fully dispels the heat in the condensation runner; Because the boiling point of cooling fluid is lower than the atmospheric environment temperature, gaseous state cooling fluid release heat in the condensation runner condenses into liquid coolant, liquid coolant forms drop and flows back to coolant reservoirs via the micropore of the condensation runner below of annular, finishes the cool cycles in the enclosure space.
In sum, with respect to the existing chip cooling device, chip cooling device of the present invention has the following advantages:
1. chip cooling device of the present invention is integrated in chip surface to Micropump as the drive source of cooling fluid, what make that cooling device takes up room is reduced to for may, utilize body micro fabrication and surperficial micro fabrication in the micro electro mechanical system (MEMS) technology, the layering etching, remove sacrifice layer, again by reversible anode linkage technology, layer by layer cooling device is encapsulated in the surface of electronic device chip, realize effectively coupling and efficient coupling, reduced to take up room, reduced to chip follow-up integrated and the encapsulation negative effect.
2. chip cooling device of the present invention adopts the interior circulation type of cooling of sealing, control the shaping and the injection of little drop by first Micropump, realize the recycling of gas by second Micropump, the whole circulation process does not need manual intervention, and have very high controllability and work flexibility, to satisfy the cooling requirement of chip under different operating modes.
3. chip cooling device of the present invention impacts the chip hot surface by little droplet form cooling fluid, form film, obtain very high critical heat flux density value, and utilize the gasification of high-temperature region liquid and in the two-phase heat conduction technology of low-temperature space condensation of gas, be the latent heat of phase change characteristic of cooling fluid, realize temperature control the high density high-power chip.Compare traditional free-convection heat transfer, Forced Convection Heat Transfer and the immersion type of cooling, utilizing the Transformation Mechanism cooling of liquid is the higher type of cooling of a kind of efficient, and the little jet surface boiling cooling that wherein the present invention relates to has more up to (500～600) W/cm
2The critical heat flux density value, this can satisfy fully cooling requirement of existing high density high-power chip, in addition can solve interior chip of a very long time in future develop the thermal control problem that must face.
Description of drawings
Fig. 1 is the part cross-sectional schematic of one embodiment of the present invention;
Fig. 2 is a fundamental diagram of the present invention;
Wherein:
1. coolant reservoirs, 12. first fluid channel, 2. first Micropump, 21. first Micropump pumping diaphragms, 23. second fluid channel, 3. micro-nozzle, the little droplet form cooling fluid of 3a., 4. cooling chamber, 4a. film, 46. the 3rd fluid channel, 6. second Micropump, 61. second Micropump pumping diaphragms, 67. the 4th fluid channel, 7. condenser, 71. condensation runners, 72. wing shape fin, 8. micropore, 8a. drop, 9. chip.
Embodiment
Below in conjunction with accompanying drawing chip cooling device of the present invention is described.
See also Fig. 1, Fig. 2, wherein the arrow among Fig. 2
Represent the flow direction of liquid coolant, arrow
Represent the flow direction of gaseous state cooling fluid.Chip cooling device of the present invention mainly comprises coolant reservoirs 1, first fluid channel 12, first Micropump 2, second fluid channel 23, micro-nozzle 3, cooling chamber 4, the 3rd fluid channel 46, second Micropump 6, the 4th fluid channel 67, condenser 7, micropore 8.Coolant reservoirs 1 stores the cooling fluid (not shown).Cooling fluid requires to have good thermophysical property, electric property, and chip is had rust inhibition, fail safe and stability.Thermophysical property comprises suitable boiling temperature, the higher latent heat of vaporization and specific heat, and density is bigger, and viscosity is less.Its mid-boiling point requires can keep between the maximum temperature of operate as normal in room temperature and chip, and boiling point is at 40 ℃～60 ℃ usually.Electric property mainly refers to insulating properties and compatibility, and general requirement is unlikely life-span and the performance that influences chip.That fail safe and stability mainly refer to is nontoxic, nonirritant, do not fire, water insoluble, be difficult for decomposition, free from environmental pollution etc.Chang Yong fluorocarbon can satisfy above-mentioned requirements well in the market, and for example in the present embodiment, the cooling fluid of using is the FC-72 in the fluorocarbon, and the boiling point that FC-72 depresses at a standard atmosphere is 56.6 ℃.
In the present embodiment, first Micropump 2 is the Valveless liquid Micropump, have one can double vibrations the elasticity pumping diaphragm, the i.e. first Micropump pumping diaphragm 21, one end of first Micropump 2 is connected with coolant reservoirs 1 by first fluid channel 12, the other end is connected with micro-nozzle 3 by second fluid channel 23, under the double vibrations effect of the first Micropump pumping diaphragm 21, cooling fluid in the coolant reservoirs 1 is via first fluid channel 12 and second fluid channel 23, flow into micro-nozzle 3, and eject from micro-nozzle 3 with the form of little droplet form cooling fluid 3a, promptly be ejected in the cooling chamber 4 that is connected with micro-nozzle 3.In the present embodiment, micro-nozzle 3 can have a plurality of, and the top that is arranged in cooling chamber 4 with the form of rectangular array equably can guarantee to spray the uniformity of little droplet form cooling fluid 3a so better to form the micro-nozzle array.Certainly, the micro-nozzle 3 of chip cooling device of the present invention also can be arranged not according to the rectangular array mode, and arrange in other suitable modes.Cooling chamber 4 is positioned at the bottom of chip cooling device, and cooling chamber 4 is complementary at its size and chip 9 that position of chip 9 is installed, so that after placing chip 9 in the cooling chamber 4, can cooling chamber 4 and atmosphere outside be isolated by chip 9, and make cooling chamber 4 relative atmosphere outside have good sealing property.If with micro-nozzle 3 be located at cooling chamber 4 directly over, can guarantee that then micro-nozzle 3 can be over against the upper surface of chip 9, thereby make the little droplet form cooling fluid 3a that ejects from micro-nozzle 3 impact upper surface effectively at chip 9.Little droplet form cooling fluid 3a forms thin film 4a at the upper surface of chip 9, and boiling in cooling chamber 4, becomes gaseous state the heat of chip 9 is taken away.
In the present embodiment, second Micropump 6 is a valveless gas Micropump, have one can double vibrations the elasticity pumping diaphragm, the i.e. second Micropump pumping diaphragm 61, one end of second Micropump 6 is connected with cooling chamber 4 by the 3rd fluid channel 46, and the other end is connected with condenser 7 by the 4th fluid channel 67, under the double vibrations effect of the second Micropump pumping diaphragm 61, the gaseous state cooling fluid of cooling chamber 4 flows into condenser 7 via the 3rd fluid channel 46 and the 4th fluid channel 67.Condenser 7 is positioned at the top of coolant reservoirs 1, the inside of condenser 7 is provided with the condensation runner 71 of annular, the top of condensation runner 71 is provided with equally distributed wing shape fin 72, to guarantee the fully heat radiation in the condensation runner 71 of condenser 7 inside of gaseous state cooling fluid, condensation runner 71 is connected with coolant reservoirs 1 by the micropore 8 of its below, the gaseous state cooling fluid condenses into liquid coolant in condensation runner 71, reject heat to atmospheric environment, liquid coolant forms drop 8a and flows back to coolant reservoirs 1 by micropore 8.Micropore 8 can have a plurality of, and the top that is arranged in coolant reservoirs 1 with the form of rectangular array equably can better guarantee like this that to form microwell array drop 8a flows back to coolant reservoirs 1 in time, to guarantee the smooth and easy of cool cycles in the enclosure space.Certainly, the micropore 8 of chip cooling device of the present invention also can be arranged not according to the rectangular array mode, and arrange in other suitable modes.
As shown in Figure 1 and Figure 2, chip cooling device of the present invention is installed on the surface of chip 9 in use, and makes the upper surface of micro-nozzle 3 over against chip 9, in addition, need guarantee that also cooling chamber 4 relative atmosphere outside have good sealing property.Chip cooling device is as follows to the cyclic process that chip 9 cools off: under the double vibrations effect of the first Micropump pumping diaphragm 21, the cooling fluid that stores in the coolant reservoirs 1 flows into micro-nozzle 3, and under the fluid pressure effect that the first Micropump pumping diaphragm 21 produces, form little droplet form cooling fluid 3a by micro-nozzle 3, and spray cooling chamber 4, the final upper surface that impacts at euthermic chip 9 of this little droplet form cooling fluid 3a from micro-nozzle 3; By effective control to the first Micropump pumping diaphragm, 21 vibration amplitudes and frequency, make the little droplet form cooling fluid 3a that ejects form the film 4a of one deck suitable thickness at the upper surface of chip 9, thereby in quality and the energy delivery directly finished on the solid liquid interface between the liquid gas, make the contact heat resistance at interface reach minimum, obtain very high critical heat flux density value, and do not have an influence of boiling initial lag effect, the surface temperature of chip 9 can remain near the saturation temperature value of cooling fluid under system pressure like this, and the uniformity of temperature profile of chip 9 hot surfaces.Cooling fluid is in the upper surface boiling of chip 9, the heat that absorbs chip 9 in cooling chamber 4 changes gaseous state into by liquid state, under the gas pressure effect that the second Micropump pumping diaphragm 61 produces, the gaseous state cooling fluid flows into condenser 7, by effective control to the second Micropump pumping diaphragm, 61 vibration amplitudes and frequency, can guarantee that the gaseous state cooling fluid flows into condenser 7 in time, to guarantee the smooth and easy of whole cool cycles.The top of condenser 7 equally distributed wing shape fin 72 contacts with atmospheric environment, because the boiling point of cooling fluid FC-72 is 56.6 ℃, be higher than atmospheric environment temperature (being usually less than 40 ℃), the gaseous state cooling fluid condenses into liquid coolant in the condensation runner 71 of condenser 7 inside, and reject heat to atmospheric environment, the liquid coolant that condenses into is under deadweight and gas pressure effect, micropore 8 via condensation runner 71 belows of annular, form drop 8a and flow back to coolant reservoirs 1, finish the cool cycles in the enclosure space.
In sum, with respect to the existing chip cooling device, chip cooling device of the present invention has the following advantages:
1. chip cooling device of the present invention is first Micropump 2, second Micropump 6 is integrated in the surface of chip 9 respectively as the drive source of liquid coolant and gaseous state cooling fluid, what make that cooling device takes up room is reduced to for may, utilize body micro fabrication and surperficial micro fabrication in the micro electro mechanical system (MEMS) technology, the layering etching, remove sacrifice layer, again by reversible anode linkage technology, layer by layer cooling device is encapsulated in the surface of electronic device chip 9, realize effectively coupling and efficient coupling, reduced to take up room, reduced to chip follow-up integrated and the encapsulation negative effect.
2. chip cooling device of the present invention adopts the interior circulation type of cooling of sealing, shaping and injection by the little drop of first Micropump, 2 controls, realize the recycling of gas by second Micropump 6, the whole circulation process does not need manual intervention, and it is flexible to satisfy the cooling requirement of different capacity chip under different operating modes with work to have very high controllability.
3. chip cooling device of the present invention by little drop cold conditions but liquid 3a impact chip 9 hot surfaces, form film 4a, obtain very high critical heat flux density value, and utilize the gasification of high-temperature region liquid and in the two-phase heat conduction technology of low-temperature space condensation of gas, be the latent heat of phase change characteristic of cooling fluid, realize temperature control the high density high-power chip.Compare traditional free-convection heat transfer, Forced Convection Heat Transfer and the immersion type of cooling, utilizing the Transformation Mechanism cooling of liquid is the higher type of cooling of a kind of efficient, and the little jet surface boiling cooling that wherein the present invention relates to has more up to (500～600) W/cm
2The critical heat flux density value, this can satisfy fully cooling requirement of existing high density high-power chip, in addition can solve interior chip of a very long time in future develop the thermal control problem that must face.
The above only is a preferred forms of the present invention, is not the present invention is done any pro forma restriction.Though the present invention discusses as above with most preferred embodiment, yet be not to limit the present invention, any those skilled in the art are not in breaking away from the technical solution of the present invention scope, can utilize the technology contents of above-mentioned announcement to make a little change or modify to realize the execution mode of equivalence, substitute fluorocarbon FC-72 such as the cooling fluid of selecting other type, and for example change the arrangement of micro-nozzle array, choose Micropump of other types or the like for another example.In every case be the content that does not break away from technical solution of the present invention, any simple modification, equivalent variations and modification according to technical spirit of the present invention is done above execution mode all still belong in the scope of technical solution of the present invention.
Claims (5)
1. chip cooling device, it is characterized in that: it comprises coolant reservoirs (1), first fluid channel (12), first Micropump (2), second fluid channel (23), micro-nozzle (3), cooling chamber (4), the 3rd fluid channel (46), second Micropump (6), the 4th fluid channel (67), condenser (7) and micropore (8), and described coolant reservoirs (1) stores cooling fluid; One end of first Micropump (2) is connected with coolant reservoirs (1) by first fluid channel (12), and the other end of first Micropump (2) is connected with micro-nozzle (3) by second fluid channel (23); Bottom and cooling chamber (4) that described cooling chamber (4) is positioned at described chip cooling device are complementary with described chip; Described micro-nozzle (3) is located at the top of cooling chamber (4) and is connected with cooling chamber (4); One end of second Micropump (6) is connected with cooling chamber (4) by the 3rd fluid channel (46), and the other end of second Micropump (6) is connected with condenser (7) by the 4th fluid channel (67); Described condenser (7) is positioned at the top of coolant reservoirs (1), and the inside of condenser (7) is provided with condensation runner (71), and the top of condensation runner (71) is provided with fin (72), and described condensation runner (71) is connected by micropore (8) with coolant reservoirs (1).
2. chip cooling device according to claim 1 is characterized in that: be provided with the elasticity pumping diaphragm in described first Micropump (2).
3. chip cooling device according to claim 1 is characterized in that: be provided with the elasticity pumping diaphragm in described second Micropump (6).
4. chip cooling device according to claim 1 is characterized in that: described micro-nozzle (3) is for pressing the micro-nozzle array that the rectangular array mode is evenly arranged.
5. chip cooling device according to claim 1 is characterized in that: described micropore (8) is for pressing the microwell array that the rectangular array mode is evenly arranged.
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| CN2009101022045A CN101645430B (en) | 2009-09-03 | 2009-09-03 | Chip cooling device |
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| CN2009101022045A CN101645430B (en) | 2009-09-03 | 2009-09-03 | Chip cooling device |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824826B (en) * | 2014-02-21 | 2017-01-04 | 电子科技大学 | A kind of fluid channel heat dissipating method |
| DE102015214928A1 (en) * | 2015-08-05 | 2017-02-09 | Siemens Aktiengesellschaft | Component module and power module |
| CN105540529B (en) * | 2015-12-04 | 2017-11-10 | 通富微电子股份有限公司 | Adaptive Temperature Controlling Chip micro-system |
| CN106409791B (en) * | 2016-11-29 | 2020-05-22 | 广东合一新材料研究院有限公司 | Liquid immersion type chip radiator |
| CN106871520B (en) * | 2017-02-13 | 2017-11-17 | 中国科学院合肥物质科学研究院 | A kind of efficient radiating apparatus based on array spraying |
| CN109637987B (en) * | 2018-11-15 | 2020-07-10 | 华中科技大学 | Immersed jet micro-jet direct liquid cooling heat dissipation device |
| CN110021571B (en) * | 2019-04-23 | 2022-04-29 | 扬州万方科技股份有限公司 | Radiator based on jet flow micro-channel |
| CN111965520A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111965519A (en) * | 2020-07-24 | 2020-11-20 | 武汉锐科光纤激光技术股份有限公司 | Chip testing equipment |
| CN111948513A (en) * | 2020-07-24 | 2020-11-17 | 武汉锐科光纤激光技术股份有限公司 | Chip temperature control equipment |
| CN113262829B (en) * | 2021-05-20 | 2022-07-08 | 华南师范大学 | Liquid drop path planning method and device of digital microfluidic chip |
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| JP2004256983A (en) * | 2003-02-05 | 2004-09-16 | Toray Ind Inc | Artificial leather comprising nano fiber |
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