JPH03165986A - Turret punch press - Google Patents

Abstract

PURPOSE:To eliminate the need to adjust the focusing position of a condenser lens according to the change of a thickness of a workpiece and to simplify constitution of a laser beam machining head by providing a sucking device on the position of an upper turret corresponding to the laser beam machining head. CONSTITUTION:In order to perform laser beam machining on the tabular workpiece W, upper and lower turrets 5 and 11 are rotated and positioned on the machining region and then, the rear surface of the workpiece W is irradiated with a laser beam from the laser beam machining head 15 and laser beam machining is performed while generated gas being sucked by the sucking device 41. At that time, the rear surface of the workpiece W is always coincident with the supporting surface of a table and it is not changed by the thickness of the workpiece W. Accordingly, since any adjustment is not necessary after the focusing position of the condenser lens of the laser beam machining head 15 fitted to the lower turret 11 is coincident with the rear surface of the workpiece W, for instance, the constitution of the laser beam machining head 15 can be simplified.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Industrial Application Field) The present invention relates to a turret punch press for punching a plate-shaped workpiece, and more specifically to a turret punch press equipped with a laser processing function. Regarding turret punch press.

(Conventional technology) A laser processing head is attached to a turret punch press,
Multi-tasking machines capable of performing both punching and laser processing have been developed and put into practice. Conventionally, a configuration in which a laser processing head is attached to a turret punch press is a configuration in which the laser processing head is attached to the upper frame or upper turret of the turret punch press, and the laser processing head is attached to the upper frame or upper turret of the turret punch press, and laser processing is performed from above on a plate-shaped workpiece. This configuration is common.

(Problem to be solved by the invention) Conventionally, when performing laser processing on a plate-shaped workpiece using a multi-tasking machine that is a turret punch press with a laser processing function added, it is common to perform laser processing from above the workpiece. The focus position of the condensing lens provided in the laser processing head is usually set at the top surface of the workpiece or at a position slightly below the top surface.

Therefore, in the past, it was necessary to adjust the focal position of the condensing lens in the laser processing head every time the thickness of the workbead changed, which caused the problem that the configuration of the laser processing head became complicated.

Additionally, during laser processing, in order to effectively utilize the assist gas, the nozzle on the laser processing head must be placed close to the top surface of the workpiece, and when punching the workpiece, it must be raised to a high position so as not to get in the way. There is a problem in that the configuration becomes complicated because the laser processing head must be moved up and down.

[Structure of the Invention] (Means for Solving the Problems) In order to solve the conventional problems as described above, the present invention provides an upper turret with a plurality of punches and a lower turret with a plurality of dies corresponding to the punches. The turret punch press is equipped with a rotatable turret, a laser processing head for processing the workpiece from below is attached to the lower turret, and a suction device is installed at the position of the upper turret corresponding to the laser processing head. It is something that has been established.

(Function) With the above configuration, in order to perform laser processing on a plate-shaped workpiece, after rotationally positioning the upper and lower sag/soto in the processing area, a laser beam is irradiated from the laser processing nozzle to the lower surface of the workpiece. At the same time, laser processing is performed while the generated gas is sucked by a suction device.・When performing laser processing on a workpiece as described above,
The bottom surface of the workpiece is always aligned with the support surface of the table and does not change depending on the thickness of the workbead. After matching the lower surface of the piece, no adjustment is required, so the configuration of the laser processing head can be further simplified. Furthermore, since the laser processing head is mounted on the lower turret, it does not get in the way during punching processing.

(Example) Referring to FIG. 1, an upper frame 3 of a turret punch press 1 has a fan-shaped or disc-shaped upper turret 5 supporting a large number of punches (not shown) connected via an upper rotating shaft 7. It is rotatably supported. Further, a lower turret 11 supporting a large number of dies (not shown) is rotatably supported on the lower frame 9 via a lower rotating shaft 13 .

In order to perform laser processing on a plate-shaped workpiece W from below, a mounting hole 11H formed in the lower turret 11 is provided.
A laser processing head 15 is attached to the. The laser processing head 15 includes a nozzle 17 for ejecting assist gas supplied from an assist gas supply pipe (not shown) to the processing position of the workpiece W, and a condensing lens 19 for condensing the laser beam. This nozzle 17 and condensing lens 19 are mounted on a holder block 21.
is supported by

The holder block 21 is vertically movably inserted into the mounting hole 11H, and a buffer W23 such as an air tube is interposed between the holder block 21 and the stepped portion 11S of the mounting hole 11H. It is equipped. Further, a cylindrical positioning holder 25 whose lower end is shaped like a tapered portion 25T is attached to the mounting hole 11H so as to be vertically adjustable. A tapered portion 21T is formed.

With the above configuration, when air is supplied into the air tube of the shock absorber 23, the holder block 21 is raised, the tapered part 21T of the holder block 21 engages with the tapered part 25T of the positioning holder 25, and the holder block 21 is raised.
The axial center of the mounting hole 11H is aligned with the axial center of the mounting hole 11H.

When the holder block 21 is positioned as described above, the tip of the nozzle 17 is extremely close to the lower surface of the workpiece W, and the focal point of the condenser lens 19 is aligned with the lower surface of the workpiece W. Slightly higher than the state or lower surface.

When the air is properly discharged from the air tube, the holder block 21 is lowered by its own weight and is supported by the air tube in a state where vibration transmission from the lower turret 11 is cut off.

In order to guide the laser beam to the laser processing head 15, the holder block 21 is equipped with a hollow waveguide in the form of, for example, a thin flexible nickel pipe whose inner surface is coated with a germanium thin film to increase the reflectance of the laser beam. One end of a laser beam transmission member 27 made of an optical fiber or the like is supported. This laser beam transmission member 2
7 passes through the axis of the lower rotating shaft 13 through a groove 11G formed on the lower surface of the lower turret 11, and the other end of this laser beam transmission member 27 is connected to a second laser beam connected to a laser oscillator 29. It is arranged to face the end surface of the beam transmission member 31 and is configured to receive the laser beam oscillated from the laser beam oscillator 29 .

With the above configuration, the laser beam oscillated by the laser oscillator 29 is guided to the laser processing head 15 via the laser beam transmission member 31.27, is focused by the condensing lens 19, and is irradiated onto the workpiece W from below. It happens.

A suction nozzle 33 is provided on the upper turret 5 facing the laser processing head 15 in order to suck gas etc. generated during laser processing.
A duct 35 is installed in the suction hole 7H formed at the axis of the upper rotating shaft 7.
It is connected via. The upper end of the upper rotating shaft 7 is
It is connected to three suction ducts via a rotary joint 37,
This suction duct 39 is connected to a suitable suction drive device 41 such as a blower. Therefore, gas generated during laser processing is sucked through the suction nozzle 33.

Note that the configuration for connecting the duct 35 to the suction drive device 41 is not limited to the configuration in which the suction hole 7H is formed in the upper rotating shaft 7 as described above, and for example, the following configuration can also be used. That is, when one end of the duct 35 is directed upward as shown by the imaginary line in FIG. One end of the duct 35 is configured to face downwardly the ends of three suction ducts provided on the upper frame 3. For example, the end portions of the suction ducts 39 are moved up and down by the operation of an air cylinder or the like, and the three end portions of the suction ducts are connected to one end portion of the duct 35 by lowering them. With such a configuration, suction can be performed more efficiently than with the suction hole 7H.

As already understood from the above description, according to this embodiment, the workpiece W is Laser processing can be performed from the bottom.

FIG. 2 shows a second embodiment. In this embodiment, a spring is used instead of an air tube as a shock absorber 23 to constantly hold the holder block 21 in the laser processing head 15 in a fixed position. It is structured as follows. Further, a laser beam transmission member 31 connected to two laser oscillators is directly guided to the processing area, and the laser beam is directly transmitted from the laser beam transmission member 31 to the condenser lens 19. This configuration can also produce the same effects as the above-mentioned embodiments.

[Effects of the Invention] As can be understood from the above description of the present embodiment, in this invention, a laser processing head is attached to the lower turret of a turret punch press, and a workpiece is laser processed from below. Because of this structure, the focal position of the condensing lens provided in the laser processing head can be fixed at the bottom surface of the workpiece or at a position slightly higher than the bottom surface, and the focal point of the condensing lens can be adjusted according to changes in the thickness of the workpiece. There is no need to adjust the position, and the configuration of the laser processing head can be further simplified. Further, there is no need to move the laser processing head up and down, and the overall configuration can be simplified.

[Brief explanation of the drawing]

The drawings show embodiments of the present invention; FIG. 1 is a schematic explanatory diagram of the first embodiment, and FIG. 2 is an explanatory diagram showing the second embodiment. 5... Upper turret 11... Lower turret 15... Laser processing head 33... Suction nozzle 27... Laser beam transmission member

Claims (1)

[Claims] The turret punch press is made up of a rotatable upper turret with multiple punches and a lower turret with multiple dies corresponding to the punches, and the lower turret is equipped with a laser processing head that processes the workpiece from below. A turret punch press characterized in that a suction device is attached and provided at a position of the upper turret corresponding to the laser processing head.