JPH03165987A - Combined machine of laser beam and punch - Google Patents

Abstract

PURPOSE:To facilitate opening and closing of a work shooter and to simplify constitution of an optical path by connecting a laser beam machining head with a laser beam oscillator via a flexible waveguide member and proving a sucking device freely movably vertically on the upper side corresponding to the laser beam machining head. CONSTITUTION:When a workpiece W is irradiate with a laser beam from the laser beam machining head 39 to perform laser beam machining, the tabular workpiece W is in a state mounted on a table 25 and the bottom of the workpiece W is always located at the same height position with respect to the table 25. Since the laser beam machining head 39 is provided on the lower side than the table 25, a focus of a condenser lens 45 is always coincident with the bottom of the workpiece W regardless of the change of the thickness of the workpiece W and the adjustment of the focusing position becomes unnecessary by making the focusing position of the condenser54 lens 45 of the laser beam machining head 39 coincident with the top of the table. In addition, since the laser beam machining head is connected with the laser beam oscillator via the flexible waveguide member 43, opening and closing of the work shooter 35 can be easily carried out and the constitution of the optical path also can be simplified.

Description

[Detailed Description of the Invention] [Objective of the Invention] (Field of Industrial Application) The present invention is a laser/punch multifunction machine that is made by adding a laser processing function to a punch press that punches a plate-shaped workpiece. Regarding.

(Prior Art) A laser/punch combined processing machine has been developed which is capable of punching and laser processing a workpiece with a single machine by attaching a laser processing head to a punch press. Conventionally, a configuration in which a laser processing head is attached to a punch press is, for example, a configuration in which it is attached to a part of an upper turret or an upper frame of a turret punch press.

(Problems to be Solved by the Invention) When performing laser processing on a plate-shaped work bead, it is common to align the focal position of a condensing lens provided in a laser processing head with the surface of the work bead. conventionally,
Since the laser processing head is installed above the table that supports the workpiece, when the thickness of the workpiece changes, the height position of the top surface of the workpiece relative to the table surface changes, so the thickness of the workpiece changes. It was necessary to adjust the focal position of the condensing lens each time it changed.

Furthermore, when the laser processing head is placed close to the top surface of the table, it tends to get in the way when punching a workpiece, so the laser processing head needs to be moved up and down, making the structure complicated.

[Structure of the Invention] (Means for Solving the Problems) In order to solve the conventional problems as described above, the present invention provides a die holder, a fixed table, or a work shooter in a punch press that performs laser processing on the workpiece from below. A laser processing head is provided, the laser processing head is connected to a laser oscillator via a flexible waveguide member, and a suction device is provided above the laser processing head so as to be movable up and down. be.

(Function) When performing laser processing by irradiating a laser beam onto a workpiece from the laser processing head, the plate-shaped workpiece is placed on a table, and the bottom surface of the workpiece is always at the same height with respect to the table. It's in the right position. and,
Since the laser processing head is installed below the table, by aligning the focal point of the condensing lens provided on the laser processing head with the top surface of the table, the workpiece can be constantly monitored regardless of changes in the thickness of the workpiece. The focus position of the condenser lens matches the bottom surface of the piece, eliminating the need to adjust the focus position.

(Example) Referring to FIG. 2, a laser/punch compound processing machine 1 according to an example is a combination of a punch press 3 and a laser processing machine 5.

As the punch press 3, a turret punch press is exemplified in this embodiment. However, the punch press is not limited to the turret punch press, and any ordinary punch press may be used.

The turret punch press 3 is well known, and to briefly explain its overall configuration, the frame 7 of the turret punch press 3 according to this embodiment is configured in a gate shape.
In this claim 7, an upper turret 11 supporting a large number of bunches 9 and a lower turret 15 supporting a large number of dies 13 are rotatably supported via upper and lower rotation shafts 17 and 19, respectively. Also, turret punch press 3
The upper frame 7U has upper and lower turrets 11.
A ram 23 is provided which is movable up and down and is equipped with a striker 21 that strikes a punch 9 that is indexed and positioned in the processing area by rotation of the ram 23.

Furthermore, the turret punch press 3 has a lower frame 7L.
A workpiece moving and positioning device 27 is provided that moves and positions the workpiece W placed on the upper table 25 in the X and Y axis directions (front, rear, left and right directions). The workpiece movement and positioning device 27 includes a carriage base 2 that is movable along a rail in the left and right direction (Y-axis direction) provided on the lower frame 7L.
It also includes a carriage 31 supported by two carriage bases and movable in the X-axis direction, and a plurality of work clamps 33 supported by the carriage 31. Furthermore, at a position close to the processing area of the table 25 in the turret punch press 3, there is a slope for discharging products or scraps separated from the work W from a supported position where the work W is horizontally supported. Work shooter 3 that can freely change the state to the position of the
5 is provided.

Incidentally, since the structure of the turret punch press 3 having the above structure is well known, a more detailed explanation of the structure and operation will be omitted.

The laser processing machine 5 includes a laser oscillator 37 and a laser processing head 39 that irradiates the workpiece W with a laser beam.
and a suction device 41 that suctions gas and the like generated during laser processing.

More specifically, in order to process the workpiece W from below, the laser processing head 39 is connected to a table 25, a die holder, or a work shooter 3 in a punch press.
5, and in this embodiment, it is attached to the work shooter 35. This laser processing head 3
9 and a laser oscillator 37, in order to guide the laser beam oscillated by the laser oscillator 37 to the laser processing head 39, for example, the inner surface of an optical fiber or a small diameter nickel pipe is coated with a germanium thin film to increase the reflectance of the laser beam. They are connected via a flexible waveguide member 43 such as a hollow waveguide.

The laser processing head 39 is provided with a condensing lens 45 that condenses the laser beam irradiated from the waveguide member 43, and the focal position of the condensing lens 45 is set on the table 25. It is set at the lower surface of the work bead W or at a slightly higher position than the lower surface. Further, the laser processing head 39 is provided with a gas supply hole 49 for ejecting assist gas from the nozzle 47. Although detailed illustrations are omitted, assist gas is injected from the nozzle 47 during laser processing, and when laser processing is stopped and air is constantly ejected during punching processing, it is connected to a gas cylinder or pump via a switching valve. ing.

With the above configuration, when performing laser processing on the workpiece W, the laser beam is focused on the lower surface of the workpiece W or a slightly higher position by the condenser lens 45 of the laser processing head 39, so that the thickness of the workpiece W can be reduced. There is no need to adjust the focal position of the condenser lens 45 even when the angle changes.

Further, when laser processing is stopped, assist gas or air is constantly ejected from the nozzle 47, so dust and the like are prevented from falling into the nozzle from the opening of the nozzle 47, and the condenser lens 45 is protected. becomes. Note that as a structure for preventing dust and the like from falling into the nozzle 47 from the opening of the nozzle 47, it is also possible to provide a shutter that can be opened and closed at the opening of the nozzle 47.

Furthermore, in the above configuration, when the work shooter 35 is opened and closed up and down by the lifting cylinder CY, the laser processing head 39 and the laser oscillator 37 are connected to the flexible waveguide member 43.
Since the work shooter 35 is connected to the work chute 35 by a screw, it is easy to open and close the work shooter 35 up and down, and there is no possibility of misalignment of the optical path.

The suction device 41 is attached to the upper frame 7U at a position above the laser processing head 39. A suction tube 51 in this suction device 41 is provided to be movable up and down, and is connected to a suction drive device such as a blower via a flexible duct (not shown). In order to move the suction tube 51 up and down, a vertical movement device 53 such as an air cylinder is attached to the upper frame 7U.
The piston rod is connected to a suction tube 51.

Therefore, the suction tube 51 is lowered during laser processing, and is kept raised when unnecessary.
During punching processing (when laser processing is stopped), the suction pipe 5
1 does not get in the way.

[Effects of the Invention] As can be understood from the above description of the embodiments, in this invention, a laser processing head is attached to a fixed table or a work shooter in a punch press, and laser processing is performed from below. Therefore, the focal position of the condensing lens provided in the laser processing head can be fixed, for example, on the top surface of the table, eliminating the need to adjust the focal position according to changes in the thickness of the workpiece, simplifying the configuration of the laser processing head. It is possible. Furthermore, since the laser processing head is located on the lower side, it does not get in the way during processing.

Furthermore, since the laser oscillator and the laser processing head are connected via a flexible waveguide member, even if the laser processing head is attached to a workpiece shooter that can be opened and closed, the workpiece shooter can be easily opened and closed. In addition, the optical path configuration for guiding the laser beam to the laser processing head can be easily simplified.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, and FIG. 1 is a sectional view of the main parts, and FIG. 2 is a front view schematically showing the overall configuration of a laser punch multitasking machine. 35...
Work shooter 39...Laser processing head 43...Wave guide member 41...Suction device

Claims (1)

[Claims] A laser processing head for performing laser processing on the workpiece from below is provided on the die holder, fixed table, or work shooter of the punch press, and this laser processing head is connected to a laser oscillator via a flexible waveguide member, and the laser processing head is connected to a laser oscillator via a flexible waveguide member. A laser/punch compound processing machine characterized by having a suction device movable up and down above the processing head.