JPH04365527A - Compound working device - Google Patents

Abstract

PURPOSE:To minify a dead zone, form the machine into small size, reduce the number of bend mirrors, reduce power loss, and simplify adjustment, by conforming a laser work point to a punching work point. CONSTITUTION:A bend mirror 37 receiving the laser beam LB oscillated from a laser oscillator 29 and a laser beam conduit 39 leading the laser beam bent with the bend mirror 37 are provided in a closed box 33 movably up and down, and a through hole 47 is provided on the center of the piston 31 of a punching cylinder 11 provided in a turret punch press 3. It is featured that the laser beam conduit 39 is inserted through the through hole 47, the lower end of the laser beam conduit 39 is mounted in an inserting hole 63 provided on the upper part turret 15 of the turret punch press 3, and hence the conduit is detachably provided.

Description

[Detailed description of the invention]

0001

[Industrial Field of Application] The present invention relates to a multi-processing device, and more specifically, it is equipped with a turret punch press for punching a workpiece and a laser processing device for laser processing, and has a laser processing point and a punching processing point. This invention relates to an identical multi-processing device.

0002

[Prior Art] Conventionally, a combined processing device that performs laser processing and punching processing has two heads, a laser processing head and a punch press head, and each processing range is moved along the X-axis, Y
Machining was performed by moving in the axial direction, and the machining range was processed on the program.

[0003] Also, for example, U. S. P. 4940.88
0, which has an ATC system, has a model in which the punch head is moved and the laser processing head is inserted into the processing point from the side, making the laser processing point and the punching processing point the same.

[0004] Japanese Patent Application Laid-Open No. 60-238 which has already been filed
There is a type known from No. 094 with a structure as shown in FIGS. 3 and 4. As shown in FIG. 3, this configuration is a type in which a striker 101 is pressed by a piston 105 provided in a cylinder 103 to perform punching on the workpiece W, and the striker 101 is attached and detached by an ATC device (not shown). Ru. To change from punching to laser processing, the striker 101 is removed from the ATC device, and as shown in FIG. Incorporate it into the desired location.

[0005] Then, the laser beam LB oscillated by a laser oscillator (not shown) is bent by a bend mirror 111.
A laser beam path 11 passes through the axial center of the piston 105.
3, the light is focused on the condenser lens 107, and is irradiated onto the workpiece W from the laser processing head 109.

[0006]

[Problems to be Solved by the Invention] However, among the above-mentioned conventional multi-processing devices, the model equipped with both a laser processing head and a punch press head has a large workpiece movement distance, and the machine is correspondingly large. Therefore, there were problems in that the dead zone was large, two work shooters were required, the program was complicated, and it took time to move from the laser processing point to the punching point.

[0007] Also, U. S. P. 940.880, in which the punch head is moved and the laser processing head is inserted from the side into the processing point, requires a lot of effort to adjust because it moves a delicate optical system, and requires a large number of bend mirrors. Note that five bend mirrors are required, and the power loss is as shown in the following equation.

[0008] Power processing=(0.98)5・PO=
0.9・PO However, (0.98) is the mirror efficiency, 5 is the number of mirrors,
PO is oscillation power.

[0009] As mentioned above, the number of mirrors is 10%.
There is a certain amount of power loss, so it is necessary to minimize the number of bend mirrors.

Furthermore, in the model disclosed in Japanese Patent Laid-Open No. 60-23809, the piston 105 of the cylinder 103
Since the laser beam LB passes through the laser beam path 113 that passes through the laser beam path 113, there is a problem in that the laser beam path 113 cannot be blocked, so that dust enters and adheres to the condenser lens 107, causing a large thermal effect.

The purpose of the present invention is to improve the above problems by reducing the number of bend mirrors and by making the laser processing point and the punching processing point the same, thereby reducing the dead zone and downsizing the machine. It is an object of the present invention to provide a multi-processing device that reduces power loss due to the bend mirror and simplifies adjustment of the bend mirror.

0012

[Means for Solving the Problems] In order to achieve the above object, the present invention provides a composite processing device equipped with a turret punch press for punching a workpiece and a laser processing device for performing laser processing. A bend mirror that receives laser light emitted from the laser oscillator of the processing equipment and a laser light conduit that guides the laser light that is irradiated onto the workpiece are installed in a sealed state so that they can move up and down freely, and the punching cylinder installed in the turret punch press is installed. A through hole is provided in the center of the piston, the laser light pipe is inserted into the through hole, and the lower end of the laser light pipe is installed in the insertion hole provided in the turret of the turret punch press so that it can be detached freely. The processing equipment was configured.

[0013]

[Operation] By adopting the composite processing device of the present invention, a bend mirror and a laser light pipe are integrally provided and can move up and down in a sealed state, and this laser light pipe is connected to the piston of the cylinder of a turret punch press. It was inserted into the through hole provided in the center, and the lower end of the laser light guide was installed in the insertion hole of the turret of the turret punch press so that it could be freely removed.

During laser processing, the laser light pipe is lowered and installed into the insertion hole of the turret, and the laser light emitted from the laser oscillator is bent by a bend mirror, and the laser light passing through the laser light pipe is bent. Laser processing is performed on the workpiece using light.

Further, during punching, the laser light pipe is raised to position the striker at the center of the piston of the cylinder, and the punching is performed on the workpiece by vertical movement of the cylinder.

Therefore, the laser processing point and the punching processing point are the same, and the machine becomes smaller. In addition, the bend mirror only needs to be provided at one location, and power loss can be minimized.

[0017]

Embodiments Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

Referring to FIG. 2, the composite processing device 1 includes a turret punch press 3 and a turret punch press 3.
and a laser processing device 5 provided in close proximity to the laser processing device 5. Note that the turret punch press 3 or the laser processing device 5 basically has a known configuration, so a detailed explanation will be omitted and only a general explanation will be given.

The turret punch press 3 is composed of a gate-shaped frame 7, and an upper frame 9 of this frame 7
A punching cylinder 11, for example, a hydraulic cylinder, is provided at the punching cylinder 11, and a shaft 13 provided at the upper frame 9 is further provided.
An upper turret 15 is rotatably supported. A lower turret 21 is rotatably supported on a shaft 19 provided on a lower frame 17 of the frame 7. A plurality of punches are mounted on the circumference of the upper turret 15, and dies are mounted on the circumference of the lower turret 21 at positions corresponding to the punches.

With the above configuration, the upper turret 15 and the lower turret 21 are rotated in synchronization, and the punching cylinder 11 provided on the upper frame 9
By activating the punch, the punch provided on the upper turret 15 is struck, and in cooperation with the die provided on the lower turret 21, a desired punching process is performed on the workpiece W.

In order to position the workpiece W at the punching position, a workpiece positioning device 25 (partially not shown) is provided which includes a gripping portion 23 for gripping the workpiece W and is movable in the X-axis and Y-axis directions. 27 is a striker that is horizontally movable by a cylinder.

On the other hand, the laser processing device 5 is provided with a laser oscillator 29 that oscillates a laser beam LB on the side of the frame 7 of the turret punch press 3 (on the right side in FIG. 2). A laser beam conduit 35 is provided extending horizontally between the laser oscillator 29 and a closed box 33 fixed directly above the piston 31 of the punching cylinder 11.

The laser beam LB guided by the laser light pipe 35 is bent by a bend mirror 37 provided in the sealed box 33, and passes into a laser light pipe 39 extending in the vertical direction. Note that the laser light guide tube 39 and the bend mirror 37 are integrally provided and are movable in the vertical direction. When rising, the lid 4 of the sealed box 33
1 is pushed up, but since the lid 41 and the box body 43 of the sealed box 33 are connected by the sealed bellows 45, the sealed box 33 will not be damaged and the sealed state will not collapse.

With the above configuration, the laser beam LB oscillated by the laser oscillator 29 passes through the laser light pipe 35, is bent in the vertical direction by the bend mirror 37, and is guided by the laser light pipe 39 to the same point as the hunting processing point. The workpiece W is irradiated and laser processing is performed.

Next, the configuration of the punching cylinder 11, the sealed box 33, and the laser light guide tube 39, which are the main parts of this embodiment, will be explained in detail with reference to FIG.

The punching cylinder 11 is attached to the frame 7
A through hole 47 is fixed to the upper frame 9 of the piston 31, and a through hole 47 into which the laser light pipe 39 is inserted is located at the center of the axis of the piston 31.
has been achieved. Further, the lower end of the piston 31 contacts a striker 27, and this striker 27 can be freely shifted in the radial direction of the upper turret 15 by a shift cylinder 49.

The sealed box 33 is provided on the upper frame 9 and is fixed directly above the axial center of the piston 31. The lid 41 of the sealed box 33 is connected to the box body 43 by a sealed bellows 45, and is expandable and retractable. A laser beam L is emitted from the laser oscillator 29 onto the side surface of the box body 43.
The laser light pipe 35 that guides the laser light pipe 39 is connected, and a sealing member 51 is attached to seal the box body 43. A sealing member 53 is also attached to the lower end of the box body 43 so that the laser light pipe 39 can remain sealed even if it moves up and down. It has become.

The laser light pipe 39 has a bend mirror 37 at its upper end and a condensing lens 55 at its lower end. In addition, a rack 57 is carved on the side surface of the upper sealed box 33 of the laser light pipe 39, and a pinion 59 that meshes with this rack 57 is provided.
is provided in a closed box, and a motor 61 is coupled to the pinion 59. On the other hand, the upper turret 15 has an insertion hole 63 into which the laser light pipe 39 is inserted. Note that this insertion hole 63 may be a hole for mounting a mold,
Reference numeral 65 is a hole provided in the lower turret 21.

With the above structure, the operation is as follows: First, during laser processing, the motor 61 is driven to rotate the pinion 59 and the laser light guide tube 39 is slid through the through hole 47 of the piston 31 via the rack 57. lower it to the position shown in Figure 1. At this time, upper turret 15
Needless to say, the insertion hole 63 provided in the upper turret 15 is positioned directly below the laser light pipe 39, and the laser light pipe 39 is inserted into the insertion hole 63 of the upper turret 15 to be positioned.

When the laser light pipe 39 descends to a predetermined position, the bend mirror 3 provided above the laser light pipe 39
7 is a laser beam LB guided by a laser light pipe 35
is positioned opposite to. In this state, the laser oscillator 29 is operated, and the oscillated laser beam LB is guided to the laser light pipe 35 and bent at a right angle by the bend mirror 37. The light is focused and irradiated onto the workpiece W. The workpiece W is gripped by the gripper 23 and moved in the X-axis and Y-axis directions by the workpiece positioning device 25 to be processed into a predetermined shape.

Next, during punching processing, first, the laser light guide tube 39, which has been lowered during laser processing, is raised. That is, the motor 61 is driven, the pinion 59 and the rack 57 are driven.
The lower end of the laser light pipe 39 is raised into the punching cylinder 11 through the punching cylinder 11 . Laser light pipe 3
9 rises, the bend mirror 37 provided at the top of the laser light pipe 39 also rises, and the lid 41 is pushed up by the laser light pipe 39, but the sealing bellows 45 extends and the lid 41 follows.
The airtightness of the airtight box 33 is maintained.

Next, the shift cylinder 4 of the striker 27
9 is activated, the striker 27 is positioned directly below the piston 31 of the punching cylinder 11, and desired punches and dies mounted on the upper and lower turrets 15, 21 are positioned at the punching position. Then, the punching cylinder 11 is operated to strike a punch with the piston 31 via the striker 27, and the punching process is performed on the workpiece W in cooperation with the die.

As described above, the laser processing point and the punching processing point are the same, and the machine can be made extremely compact compared to the conventional method. Furthermore, since only one bend mirror 37 is needed, power loss can be minimized and adjustment of the bend mirror 37 can be made easier. Furthermore, the dead zone becomes smaller and the work shooter etc. can be smaller.

It should be noted that the present invention is not limited to the embodiments described above, but can be implemented in other embodiments by making appropriate changes. For example, in this embodiment, the upper turret 15 is used for positioning the laser light pipe 39.
Although the positioning is performed using the insertion hole 63 provided in the punching cylinder 11, the positioning may be performed using the piston 31 of the punching cylinder 11. Further, the laser irradiation point may be avoided by being offset from the piston 31 or by placing two in parallel.

[0035]

Effects of the Invention As can be understood from the above description of the embodiments, according to the present invention, a through hole is provided in the piston of a punching cylinder, a laser light pipe is inserted into this through hole, and laser processing is performed. The processing points for punching were the same.

For this reason, the machine is extremely compact compared to conventional machines, the dead zone is small, the work shooter etc. need to be small, and the bend mirror only needs to be installed in one place, making adjustment easy and reducing power loss. Since the laser beam conduit is operated in a sealed state, no dust is attached, and processing accuracy can be improved.

[Brief explanation of drawings]

FIG. 1 is an enlarged sectional view taken along arrow I in FIG. 2, showing the main parts of the present invention.

FIG. 2 is a front view of a composite processing apparatus according to an embodiment of the present invention.

FIG. 3 is a cross-sectional explanatory view showing a conventional example when a striker is attached to a piston of a cylinder.

FIG. 4 is a cross-sectional explanatory view showing a conventional example when a laser processing head is attached to a piston of a cylinder.

[Explanation of symbols]

1 Combined processing equipment 3 Turret punch press 5 Laser processing equipment 11 Cylinder for punching 15 Upper turret 29 Laser oscillator 31 Piston 33 Sealed box 37 Bend mirror 39 Laser light pipe 47 Through hole 63 Insertion hole

Claims (1)

[Claims] 1. A compound processing device comprising a turret punch press for punching a workpiece and a laser processing device for performing laser processing, comprising: a bend mirror that receives laser light emitted from a laser oscillator of the laser processing device; A laser beam conduit that guides the laser beam to be irradiated onto the workpiece is provided so as to be movable up and down in a sealed state, a through hole is provided in the center of the piston of the punching cylinder provided in the turret punch press, and the A multi-processing device characterized in that a laser light pipe is inserted through the laser light pipe, and the lower end of the laser light pipe is removably installed in an insertion hole provided in a turret of the turret punch plane.