JP3638726B2 - Compound processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a composite processing apparatus.
[0002]
[Prior art]
For example, JP-A-2-224829 discloses an example of a combined processing machine in which a turret punch press (1) and a laser processing apparatus (7) are combined. In this combined processing machine, the laser processing position (47) of the laser processing apparatus is provided on a fixed table slightly separated from the punching processing position (45) of the turret punch press, and the turret punch press or the laser processing apparatus is used. The cut product is discharged by tilting one of the large and small shooter tables (51, 53) provided on the fixed table (21).
[0003]
The workpiece W is moved and positioned by the workpiece positioning device (23) with respect to the laser processing position (47) of the laser processing device or the punching processing position (45) of the turret punch press.
[0004]
[Problems to be solved by the invention]
Side tables (27) provided on both sides of the fixed table are integrally provided on the carriage base (31) that moves in the front-rear direction (usually in the Y-axis direction) of the workpiece positioning device of the multi-task machine. The overall weight of the carriage (41) that moves in the left-right direction (usually the X-axis direction) on the carriage base is very large. Therefore, the inertia of the workpiece positioning device in the Y-axis direction is very large compared to the inertia in the X-axis direction, and a large drive source is required to move and position the workpiece positioning device in the Y-axis direction with high speed and high accuracy. There is a problem in terms of cost. Note that the positioning accuracy problem is not completely solved only by increasing the driving source, and it is necessary to improve the rigidity of the workpiece positioning device and the like.
[0005]
Further, since the shooter table of the multi-task machine is provided on the fixed table, there is a problem that the width of the shooter table that can be employed is limited by the width of the fixed table in the left-right direction (X-axis direction).
[0006]
The present invention has been made to solve the above-described problems. An object of the present invention is to provide a high-speed laser by providing a second plate material positioning device for laser processing using an X-axis carriage of a punching processing device. It is an object of the present invention to provide a combined processing apparatus including a laser processing apparatus and a punching processing apparatus that enable processing. It is another object of the present invention to provide a combined machining apparatus provided with a movable table on a movable table that can drop and discharge a large laser-cut piece.
[0007]
[Means for Solving the Problems]
As a means for solving the above-mentioned problems, the combined processing apparatus according to claim 1 is a combined processing apparatus in which a punch press and a laser processing apparatus are combined, and a pair of moving tables that move on both sides of the fixed table of the punch press. A first plate material positioning device comprising a Y _1- axis carriage provided with an X _1- axis carriage provided with a plate material clamping device that moves in the X _1- axis direction on the Y _1- axis carriage, and a side of the fixed table Is provided with a second plate material positioning device comprising a Y ₂ axis carriage that moves in the Y ₂ axis direction parallel to the Y ₁ axis, and an X ₁ axis carriage provided with the plate material clamping device. The gist is that a laser processing head is provided on the Y _2- axis carriage.
[0008]
Therefore, the Y ₂ -axis carriage 23 is light in weight and can be positioned at high speed. The X ₁ -axis carriage 19 is also light in weight as compared to the Y ₁ -axis carriage 17, and thus can be positioned at high speed. Therefore, it is possible to perform laser processing at high speed by using the second plate material positioning device.
[0009]
The composite processing apparatus according to claim 2 is the composite processing apparatus according to claim 1, wherein a swing table capable of dropping and discharging the cut piece of the plate material is provided on the moving table below the laser processing head. Is a summary. Therefore, since the shape size of the swing table is not limited by the width of the fixed table in the left-right direction (X-axis direction), it is possible to provide a swing table having an appropriate shape size as required.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 are drawings for conceptually explaining the technical idea of the embodiment of the present invention. 1 is a front view of the combined machining apparatus 1, and FIG. 2 is a plan view of FIG.
[0011]
Now, referring to FIG. 1 and FIG. 2, the composite processing apparatus 1 is composed of a combination of a turret punch press 3 which is a kind of punch press for punching a plate material and a laser processing apparatus 5 for performing laser processing. ing. The main configuration of the turret punch press 3 is the same as that of a known turret punch press as disclosed in, for example, Japanese Patent Laid-Open No. Hei 4-158941 which is the invention of the present applicant. .
[0012]
The turret punch press 3 includes a portal frame 7 similar to the known turret punch press, and a plurality of tools (not shown) including punching punches and dies are mounted on the portal frame 7. The upper and lower turrets 9 are rotatably provided, and an arbitrary tool mounted on the turret 9 can be indexed to the punching processing position 11 under the control of an NC controller (not shown).
[0013]
The portal frame 7 of the turret punch press 3 is provided with a fixed table 13 that supports the plate material W. On both sides of the fixed table 13, moving tables 15 (A, B) that support the plate material W together with the fixed table 13 are provided so as to be movable in the Y ₁ axis direction which is the first Y axis as shown in FIG. It is. The moving table 15 (A, B) is integrally connected to a Y ₁ axis carriage 17 whose one end extends in the X ₁ axis direction (shown in FIG. 2) perpendicular to the Y ₁ axis direction. is there.
[0014]
Wherein the Y ₁ axis carriage 17, X ₁ axis carriage 19 movable in the X ₁ axis direction is provided. A plate material clamping device 21 that holds the end of the plate material is mounted on the X ₁ axis carriage 19 so as to be movable and fixed in the X ₁ axis direction. The Y ₁ axis carriage 17 can be moved and positioned at an arbitrary position in the Y ₁ axis direction by a Y ₁ axis servo motor (not shown) that is rotationally driven under the control of the NC controller and a drive mechanism. . Similarly, the X ₁ axis carriage 19 can be moved and positioned at an arbitrary position in the X ₁ axis direction by an X ₁ axis servo motor and a drive mechanism (not shown).
[0015]
The Y _1- axis carriage 17 and the X _1- axis carriage 19 provided with the plate material clamping device 21 constitute a first plate material positioning device that moves and positions the plate material W with respect to the punching position 11 of the turret punch press 3. It is.
[0016]
Also, above one moving table 15A (left side in FIG. 2) of the moving table 15 (A, B), as shown in FIG. 2, Y ₂ is a _second Y axis parallel to the Y ₁ axis. A Y _2- axis carriage 23 that is movable in the axial direction is provided. The Y ₂ -axis carriage 23 is provided with a laser processing head 25 that is movable in the Z-axis direction perpendicular to the X ₁ -axis direction and the Y ₁ -axis direction. In the laser processing head 25, a condensing optical system (not shown) such as a convex lens that condenses the laser beam LB guided from a gas laser oscillator 27 such as a carbon dioxide laser through a plurality of bend mirrors BM. And a nozzle 29 for injecting an assist gas onto the surface of the plate material W is attached to the lower end of the laser processing head 25.
[0017]
The Y ₂ -axis carriage 23 is considerably smaller than the Y ₁ -axis carriage 17 and is light in weight. The Y ₂ -axis carriage 23 is supported on a Y ₂ -axis guide rail 31 provided on the side surface of the portal frame 7 so as to be movable in the Y ₂ axis direction. The Y ₂ axis carriage 23 can be moved and positioned at an arbitrary position in the Y ₂ axis direction by a Y ₂ axis servo motor (not shown) that is rotationally driven under the control of the NC controller and a drive mechanism. It can be done.
[0018]
The Y ₂ -axis carriage 23 having the above configuration and the X _1- axis carriage 19 constitute a second plate material positioning device of the laser processing device 5. In the configuration of the second plate member positioning apparatus, wherein Y ₂ is an axial carriage 23 shows an example in which the side surface of the gantry frame 7, Y ₂ axis carriage bears Y ₂ axis carriage frame portal frame 7 The Y ₂ axis carriage may be provided on the side of the Y ₂ axis carriage and the independent Y ₂ axis carriage frame. In addition, on the side of the portal frame 7, the Y ₂ axis origin 33 is provided at a position on the moving table 15 A at a position spaced apart from the punching position 11 by a certain distance L in the X ₁ axis direction. is there.
[0019]
On the moving table 15A located below the laser processing head 25, a swing table 35 capable of dropping and discharging the laser-cut cutting piece CP is pivotally supported on a swing shaft 37. Furthermore, the oscillating table 35 in accordance with the movement path of the laser processing head 25 moves in the Y ₂ axial suction port 39 for sucking and discharging the like sputtering and Hyuumu generated during laser cutting processing It is provided. The suction port 39 communicates with the dust collector 41 through a duct 43 that can be expanded and contracted.
[0020]
A piston rod 47 of a fluid pressure cylinder 45 such as pneumatic pressure or hydraulic pressure is provided on the lower surface of the swing table 35 so as to be freely engageable. Therefore, by operating the fluid pressure cylinder 45 and extending and retracting the piston rod 47, the swing table 35 can be swung, that is, opened and closed with the swing shaft 37 as a fulcrum. In the present embodiment, an example in which the fluid pressure cylinder is attached to the dust collector 41 is shown, but it may be provided on the side surface of the frame 7. Alternatively, the swing table 35 can be swung so that the swing shaft 37 is directly driven to rotate.
[0021]
The moving table 15A is provided with a shot pin cylinder 49 for fixing the swing table 35 in a horizontal position, and a shot pin of the shot pin cylinder 49 is provided at an end of the swing table 35 on the open / close side. A positioning hole 53 for fitting to 51 is provided.
[0022]
Therefore, when the swing table 35 is in the horizontal position, the shot pin cylinder 49 is operated, and the shot pin 51 is fitted into the positioning hole 53 of the swing table 35 so that the swing table 35 is brought into the horizontal position. Can be fixed.
[0023]
In the combined machining apparatus having the above-described configuration, when punching is performed, the Y ₁ -axis carriage 17 having a pair of moving tables that move on both sides of the fixed table, and the Y ₁ -axis carriage 17 are placed on the X ₁ axis. Using a first plate material positioning device including an X _1- axis carriage 19 having a plate material clamping device 21 that moves in the direction, the plate material W is positioned with respect to the punching processing position 11 to perform punching processing.
[0024]
Further, when laser cutting is performed on the contour of the product after punching, or when only laser cutting or other laser processing is performed on the plate material, the Y _1- axis carriage 17 returns to the origin 55 of the first plate material positioning device. In this state, a second plate material positioning device comprising a Y ₂ axis carriage 23 that moves in the Y ₂ axis direction parallel to the Y ₁ axis and an X ₁ axis carriage 19 that includes the plate material clamping device 21 is used. The plate material W is then subjected to laser cutting and other laser processing.
[0025]
Sputters, fumes and the like generated during the laser processing are sucked and discharged from the suction port 39 to the dust collector 41 through the duct 43.
[0026]
The positioning speed at the time of punching using the second plate material positioning device described above is equivalent to that of a conventional turret punch press. On the other hand, positioning speed of the Y ₂ axis carriage when laser processing using a second plate positioning device, the weight of the Y ₂ axis carriage 23 is light and capable of high-speed positioning, also the X ₁ axis carriage 19 the Since the weight is lighter than that of the Y _1- axis carriage 17, high-speed positioning is possible. Therefore, high-speed laser processing can be performed by using the second plate material positioning device.
[0027]
Further, since the swing table for dropping and discharging the laser-cut pieces is provided on the moving table 15A, the shape size of the swing table 35 is limited by the width in the left-right direction (X-axis direction) of the fixed table 13. There is nothing.
[0028]
【The invention's effect】
According to the first aspect of the present invention, it is possible to perform high-speed laser processing by using the second plate material positioning device. In addition, since the second plate material positioning device uses the X _1- axis carriage of the first plate material positioning device used for punching in common, the cost can be reduced and the axis control can be simplified. There are advantages.
[0029]
According to the second aspect of the present invention, since the shape size of the swing table is not limited by the width in the left-right direction (X-axis direction) of the fixed table, a swing table having an appropriate shape size according to need is provided. Became possible. Therefore, by using a common punch press and enlarging the moving table, it is possible to provide a swing table suitable for the size of the plate that can be processed. There is an advantage such as easy to make.
[Brief description of the drawings]
FIG. 1 is a front view of a combined machining apparatus according to the present invention, which conceptually explains the technical idea of an embodiment of the present invention.
2 is a plan view of FIG. 1. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Compound processing apparatus 3 Turret punch press 5 Laser processing apparatus 7 Portal frame 9 Upper and lower turret 11 Punching processing position 13 Fixed table 15 (A, B) Moving table 17 Y _1- axis carriage 19 X _1- axis carriage 21 Plate material clamping apparatus 23 Y _2- axis carriage 25 Laser processing head 27 Gas laser oscillator 29 Nozzle 31 Y _2- axis guide rail 33 Y _2- axis origin 35 Swing table 37 Swing shaft 39 Suction port 41 Dust collector 43 Duct 45 Fluid pressure cylinder 47 Piston rod 49 Shot Pin Cylinder 51 Shot Pin 53 Positioning Hole 55 Origin BM of First Plate Positioning Device BM Bend Mirror CP Cut Piece LM Laser Beam W Plate Material

Claims (2)

In a combined machining apparatus combining a punch press and a laser machining apparatus, a Y ₁ axis carriage having a pair of moving tables that move on both sides of a fixed table of the punch press, and an X ₁ axis on the Y ₁ axis carriage A Y ₂ axis carriage which is provided with a first plate material positioning device comprising an X ₁ axis carriage provided with a plate material clamping device which moves in the direction, and which moves the side of the fixed table in the Y ₂ axis direction parallel to the Y ₁ axis And a second plate material positioning device comprising an X ₁ axis carriage provided with the plate material clamping device, and a laser processing head is provided on the Y ₂ axis carriage of the second plate material positioning device. . 2. The combined machining apparatus according to claim 1, wherein a swing table capable of dropping and discharging the cut pieces of the plate material is provided on the movable table below the laser machining head.

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