JP3375442B2 - Punch / laser combined processing machine - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a punch / laser combined processing machine provided with a punch processing machine for punching and a laser processing machine for performing laser processing.

[0002]

2. Description of the Related Art Conventionally, a punch cutting machine typified by a turret punch press has been the main force as a blank cutting machine in sheet metal working, but in reality, its position is divided into two by the aging of a laser processing machine. is there. The punching machine is particularly effective when the processing is repeated and the number of products is collected. On the other hand, in the case of a free-form product including a curve, a laser processing machine is used.
Recently, a so-called punch / laser combined processing machine has been proposed, which makes it possible to perform both punching and laser processing with a single processing machine by taking advantage of the characteristics of each of these punching machines and laser processing machines. Has been done. According to such a punch / laser combined processing machine, a product having a predetermined shape can be quickly processed by the punch processing machine, and a product which cannot be processed by the punch processing machine or which is difficult to process can be processed by the laser processing machine. By doing so, it becomes possible to quickly deal with the processing of various products.

By the way, the punching machine generates a great amount of vibration during punching, while the laser processing machine has many parts such as a laser oscillator, a reflecting mirror, a lens, etc. which are averse to this vibration. For this reason, in the punch / laser combined processing machine as described above, various measures are usually taken so that the optical system such as the laser oscillator is not adversely affected by the vibration of the punch processing machine. .

Conventionally, as an example of a vibration isolation structure of a laser processing machine, those disclosed in the following publications are known. (1) A laser processing machine including a laser oscillator and a laser processing head is attached to a body frame of a punching machine via a vibration isolation device (eg, Japanese Patent Publication No. 3-18995, Japanese Utility Model Publication No. 2-35422). . (2) A laser beam machine equipped with a punching machine inside a frame via a vibration isolation device (eg, Japanese Patent Publication No. 4-207).
No. 16, JP-A-2-21917). (3) A laser oscillator frame of a laser beam machine is provided outside the body frame of the punching machine, and an optical axis frame integrated with the laser oscillator frame is provided in non-contact with the body frame (example) : JP-A-2-2355
No. 90).

[0005]

However, in the vibration isolating structure as described in the above (1), since the laser beam machine is attached to the body frame of the punching machine via the vibration isolator, the punching machine is used. Is transmitted from the body frame to the laser oscillator, which does not like vibration, only through the vibration isolator, and it is extremely difficult to damp the vibration.

Further, in the vibration-proof structure as described in (2) above,
Since it is necessary to vibration-proof the entire punching machine, the anti-vibration structure becomes large-scale, and the frame of the laser processing machine is enlarged to accommodate the punching machine, which also enlarges the overall structure of the multifunction machine. There is a problem that the cost increase cannot be avoided.

Further, in the vibration isolation structure as described in (3) above, since the laser oscillator and the laser processing head are provided in an integral frame, the positional relationship between the body frame of the punching machine and the laser frame is Always fixed,
Also, there is no anti-vibration structure between the laser frame and the ground,
There is a problem that vibration during punching is transmitted to the laser frame through the ground and adversely affects the optical system such as the oscillator and the laser processing head.

The present invention has been made in view of the above-mentioned problems, and the compact vibration-proof structure reliably prevents the vibration generated during punching from being transmitted to the laser processing head and the laser oscillator. Therefore, it is an object of the present invention to provide a punch / laser combined processing machine capable of preventing the deviation of the optical system in the laser processing machine.

[0009]

[Means for Solving the Problems and Action and Effect] Punch the multifunction machine according to the present invention, in order to achieve the foregoing objects, a laser processing machine for performing punching machine and laser processing of performing punch processing In the punch / laser combined processing machine, the laser oscillator is separately mounted from the main body frame that supports the punching head so that the laser oscillator can be supported on the ground through the vibration isolator for the laser oscillator, and the laser processing head is attached to the main body. The present invention is characterized in that the frame can be supported via a vibration isolating device for a laser processing head, and the frame is attached with a predetermined offset amount from the punching head.

In the present invention, the laser oscillator is supported separately from the body frame via the vibration isolator for the laser oscillator with respect to the ground, and the laser machining head is actuated via the vibration isolator for the laser machining head during punching. It is supported by the body frame. Since the laser oscillator is installed separately from the body frame that supports the punching head in this way, the vibration generated during punching is transmitted from the body frame to the ground and then to the laser oscillator. It becomes possible to do. Further, the vibration generated during the punching process is prevented from being absorbed by the laser processing head vibration isolator and transmitted to the laser processing head.

In this way, the optical system of the laser processing machine is not displaced, the accuracy of laser cutting processing is improved, and the accuracy of combined processing of punching and laser processing is improved. Moreover, the frequency of the optical axis adjustment of the optical system is reduced, and the life of the optical system can be improved. Furthermore, the laser processing head is attached to the body frame,
Since the laser oscillator is placed separately, there is no need to provide a laser frame separate from the main frame, and the installation location of the laser oscillator can be freely selected and changed simply by adding a mirror that refracts the laser optical axis. This makes it possible to make the installation space and machine structure relatively small,
In addition, it is possible to freely lay out the installation place of the laser oscillator according to the factory layout.

In the present invention, the vibration isolator for the laser oscillator may be an air spring that is activated during punching to prevent transmission of vibrations from the ground to the laser oscillator.

Further, it is preferable to provide a seating / positioning device for the laser oscillator for releasing the support by the vibration isolator for the laser oscillator during the laser processing and seating and positioning the laser oscillator on a mount supporting the laser oscillator.

This seating and positioning device for a laser oscillator is
Provided on one side of the lower surface of the laser oscillator or one side of the lower surface of a mounting plate on which the laser oscillator is mounted, or a pin-shaped convex portion provided on one of the one end sides of the pedestal facing the one side. A first laser oscillator positioning mechanism comprising a concave portion fitted to the convex portion, and the other end side of the lower surface of the laser oscillator or the lower surface of the mounting plate on which the laser oscillator is mounted, or the other end side. A second laser oscillator positioning mechanism including a wedge-shaped convex portion provided on one of the other ends of the opposite pedestals and a concave portion fitted to the convex portion provided on the other side. Is preferred. According to such a seating positioning device for a laser oscillator, it is possible to absorb the elongation of a material such as iron that constitutes the positioning mechanism for a laser oscillator due to the outside air temperature, and further improve the laser processing accuracy and the composite processing accuracy. You can

Further, the vibration isolator for the laser processing head is an air spring that is actuated during punching to prevent the transmission of vibration from the main body frame to the laser machining head, like the vibration isolator for the laser oscillator. Preferably.

Further, there is provided a seating positioning device for a laser processing head for releasing the support by the vibration isolating device for the laser processing head during laser processing and seating and positioning the laser processing head on a support table for supporting the laser processing head. It is preferably provided.

The seating positioning device for the laser processing head is a pin-shaped projection provided on one side of the lower surface of the mounting plate to which the laser processing head is attached or on one side of the support base facing the one side. And a first laser processing head positioning mechanism including a concave portion to be fitted to the convex portion provided on the other side, and the other end side or the other end side of the lower surface of the mounting plate for mounting the laser processing head. A second laser processing head positioning mechanism including a wedge-shaped convex portion provided on one of the other ends of the support base and a concave portion fitted on the convex portion provided on the other side is provided. Is preferred. According to such a seating positioning device for a laser processing head, the elongation of a material such as iron, which constitutes the positioning mechanism for a laser oscillator due to the outside air temperature, can also be absorbed, and laser processing accuracy and composite processing accuracy are further improved. Can be made.

It is preferable that the first laser processing head positioning mechanism and the second laser processing head positioning mechanism are covered with a dustproof cover. Further, an air blowing device is provided for blowing air to the contact surfaces of the first laser processing head positioning mechanism and the second laser processing head positioning mechanism when the laser processing head is seated on the support base. Is good. By doing this,
It is possible to prevent dust from entering between the convex portion and the concave portion that are the contact surfaces, and it is possible to improve both laser processing accuracy and composite processing accuracy.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a specific embodiment of the punch / laser combined processing machine according to the present invention will be described with reference to the drawings.

FIGS. 1 and 2 show the construction of a punch / laser combined processing machine according to an embodiment of the present invention.
Is a partially broken schematic perspective view, and FIG. 2 is a plan view.

First, the structure of the punching portion of the punch / laser combined machining apparatus of this embodiment will be mainly described.

In the punch / laser combined processing machine according to the present embodiment, a main body frame 1 having a gate structure is erected on a fixed bed 2, and the main body frame 1 is arranged below the main body frame 1 so as to intersect with the main body frame 1. A movable table 3 common to punching and laser processing for placing and moving a plate-shaped work is arranged. Further, a punching head 4 for mounting an upper die (punch) and a plate holder (stripper) sets the axis line to the vertical direction at a position slightly offset to one side from the central portion in the longitudinal direction of the main body frame 1. The lower die (die) is provided below the punching head 4.
There is provided a fixed base 5 for mounting.

A magazine support frame 6 is arranged in parallel with the main body frame 1 at a position separated from the main body frame 1 by a cylindrical mold magazine 7 having both ends. It is rotatably supported by the bearing. Further, between the mold magazine 7 and the main body frame 1, a mold transfer device 8 which mainly transfers the mold between the mold magazine 7 and the main body frame 1.
Are arranged.

This mold conveying device 8 has a traveling rail 9 installed in parallel with the main body frame 1 and the mold magazine 7.
An ATC carriage 10 capable of traveling along the traveling rail 9, an elevating shaft frame 11 capable of ascending and descending with respect to the ATC carriage 10, and a moving shaft frame 12 horizontally arranged at the lower end of the elevating shaft frame 11. A carrier 13 movable along the moving shaft frame 12,
The carrier 13 is provided with a mold hand 14 capable of horizontally rotating a required angle. Here, the mold hand 14
Has two arms of a substantially V-shape in plan view protruding from a base that serves as a center of rotation, and a gripping mechanism that grips a die including a punch, a stripper and a die in a set state at a tip end of each arm. There is.

The mold magazine 7 requires a hollow support shaft 15 having a rectangular cross section, a plurality of mold holding units fixed to the four outer surfaces of the support shaft 15 along the axis, and the support shaft 15. And a magazine indexing drive unit for indexing and rotating the rotation angle. To each mold holding unit, a large number of mold holding bodies 16 for holding a mold including a punch, a stripper and a die in a set state are fixed. In the case of the present embodiment, a total of 15 mold holders 16 are attached to one mold holding unit, three in the circumferential direction of the support shaft 15 and five in the axial direction, and each mold holding unit has a support shaft. A total of 20 units are arranged, 15 units in the circumferential direction and 4 units in the circumferential direction, and 5 units in the axial direction. Therefore, 15 × 20 = 300 mold holders 16 are attached to the mold magazine 7 as a whole, in other words, 300 sets of molds can be stored.

By being configured in this way,
The support shaft 15 of the die magazine 7 is indexed to a required rotation angle by the magazine indexing drive means, and the ATC carriage 10 of the die transporting device 8 is moved to a predetermined position along the traveling rail 9 so that the carrier 13 and By positioning the mold hand 14 at the required position,
The target mold is delivered to the mold magazine 7. Further, when exchanging the dies mounted on the punching head 4 and the fixed base 5, the die hand 14 is moved to a predetermined position near the punching head 4 and made to stand by, and then the die of the die hand 14 is first moved. The operation of removing the used die is performed by the arm on the side not holding the die, and then the die hand 14 is rotated and the operation of attaching the die is performed by the arm on the side holding the die. .

Next, the structure of the laser processing portion in the punch / laser combined processing machine of this embodiment will be described.

A laser light guide tube 17 is fixed to the side surface of the main body frame 1 along the longitudinal direction of the main body frame 1, and the front end portion of the laser light guide tube 17 is laser-processed on the main body frame 1 to be described later. A laser processing head 18 is attached via a head vibration isolator and offset from the punch processing head 4. Further, a laser oscillator 19 is disposed separately from the main body frame 1 at a position adjacent to the rear portion of the main body frame 1 so as to be connected to the rear end portion of the laser light guide tube 17.

As shown in FIGS. 3 to 6, the laser oscillator 19 can be supported by a pedestal 21 fixed to the ground 20 via four air springs 22. More specifically, the support plates 23 are fixed to the one end side and the other end side of the upper surface of the pedestal 21, respectively, and the mounting plate 24 on which the laser oscillator 19 is mounted is fixed to the lower surface of the laser oscillator 19, The air spring 22 is inserted between the support plates 23, 23 and the mounting plate 24 via a mounting seat. These air springs 22 are vertically expandable and contractable by compressed air supplied from an air source (not shown).

Further, the laser oscillator 19 is mounted on the mount 2
These support plates 2 for seating and positioning with respect to 1.
The following three types of seating positioning mechanisms are provided between 3, 23 and the mounting plate 24. First, both sides of one side of the mounting plate 24 and the support plates 23, 23 facing the mounting plate 24 (left end side in FIG. 4) and the center part of the other end side (right end side in FIG. 4) near the center part. 2 is a seating and positioning mechanism in which the abutting surfaces provided at a total of 4 places are a pair of upper and lower flat blocks 25, 26 having horizontal planes, and the second is a seating positioning mechanism shown in FIG. ), A convex block 27 having a pin-shaped convex portion 27a provided at an approximately central portion on one end side of one support plate 23 and a convex portion 27a of the convex block 27. Is a seating positioning mechanism composed of a concave block 28 provided on the lower surface of the mounting plate 24 so as to be fitted to, and the third is a seating positioning mechanism provided on the other end side of the other support plate 23 at a substantially central portion and on the upper end portion. The convex block 29 having the wedge-shaped convex portion 29a and the convex portion 29a of the convex block 29 are A seating positioning mechanism consisting of a concave block 30. provided on the lower surface of the mounting plate 24 so as to focus (see FIG. 6).
Here, when the four pairs of upper and lower planar blocks 25 and 26 are in contact with each other and the laser oscillator 19 is seated, the convex block 27, the concave block 28, and the convex block 29 are arranged.
The concave block 30 and the concave block 30 are fitted with play.

Further, as shown in FIG. 8 (a sectional view taken along line BB in FIG. 4), the support plates 23 and 23 and the mounting plate 24 are provided.
A detection mechanism for detecting that the laser oscillator 19 has been seated is provided between and. This detection mechanism is provided in a total of three pairs at the inner positions of the two pairs of flat blocks 25, 26 on the one end side and the outer positions of the one flat block 25, 26 on the other end side. A detection bar 3 provided on the side of 23 and constantly urged upward by the action of a compression spring
1 and a limit switch 32 provided on the mounting plate 24 side and pressed by the detection bar 31.

A reflecting mirror 34 is connected to the rear end portion of the laser light guide cylinder 17 via a bellows 33.
The reflecting mirror 34 is supported on the upper end of a column 35 standing on the upper surface of the mounting plate 24 via a bracket 36, and the upper end of the column 35 is provided on a side surface of the laser oscillator 19 via a reinforcing member 37. Are linked to.

With this structure, when compressed air is supplied to the four air springs 22 and the air springs 22 are expanded during punching by the punching head 4, the seating positioning mechanisms face each other. Each block 2
5, 26; 27, 28; 29, 30 are separated from each other, and the laser oscillator 19 is elastically supported on the pedestal 21, whereby punch vibration is generated from the ground 20 to the laser oscillator 19.
It is prevented from being transmitted to. On the other hand, during the laser processing by the laser processing head 18, when the supply of the compressed air to the air springs 22 is stopped and the air springs 22 are contracted, the pressure in the direction of lifting the laser oscillator 19 becomes 0, and each air spring 22 is lifted. Blocks 25, 26; 27, 28; 29, 30
The laser oscillator 19 is seated and positioned at a predetermined position by mutual contact and fitting. At this time, one end of the seating positioning mechanism is composed of a convex block 27 having a pin-shaped convex portion 27a and a concave block 28 fitted to the convex block 27, and the other end thereof has a wedge-shaped convex portion 29a. Since it is composed of the convex block 29 and the concave block 30 that fits into the convex block 29, the material of each block 25, 26; 27, 28; Even if the elongation occurs, the elongation can be absorbed and the positioning can be performed reliably, and thereby the laser processing accuracy and the composite processing accuracy can be improved. The seating / positioning of the laser oscillator 19 is detected by a detection mechanism including a detection bar 31 and a limit switch 32.

On the other hand, as shown in FIGS. 9 to 11, the laser processing head 18 provided at the front end portion of the laser light guide tube 17 has a pair of front and rear support brackets 38 fixed to the side surface of the main body frame 1. , 38 air springs 3
It can be supported via 9. More specifically, a pair of support brackets 38, 38 are fixed to the side surface of the main body frame 1 so as to be separated from each other by a predetermined distance, and upper plate 38a, 38a of the support brackets 38, 38,
The air spring 39 is inserted via a mounting seat between the laser processing head 18 and a laser processing head mounting plate 40 that fixedly supports the laser processing head 18. These air springs 39 are vertically expandable and contractable by compressed air supplied from an air source (not shown). Here, the laser processing head 18 is vertically attached to the laser processing head mounting plate 40 so as to be sandwiched between the pair of support brackets 38, 38.
A bellows 41 is inserted between the front end portion of the laser light guide tube 17 and the laser processing head 18.

Further, in order to seat and position the laser processing head 18 with respect to the pair of support brackets 38, 38, in other words, the body frame 1, these support brackets 38 as well as the seating positioning mechanism of the laser oscillator 19 are mounted. , 38 and the laser processing head mounting plate 40 are provided with the following three types of seating positioning mechanisms.
First, as shown in FIG. 12 (C-C sectional view of FIG. 11), a pin-shaped convex portion 42 a is provided on one side (upper side in FIG. 10) of one of the support brackets 38 and is provided at the upper end. And a convex portion 42 of the convex block 42.
The seating positioning mechanism is composed of a concave block 43 provided on the lower surface of the laser processing head mounting plate 40 so as to be fitted in a. The second is a seating positioning mechanism shown in FIG. 13 (a sectional view taken along the line DD in FIG. 11).
As shown in FIG. 5, a convex block 44 provided on the other side (lower side in FIG. 10) of the other support bracket 38 and having a wedge-shaped convex portion 44 a at the upper end, and a convex block 44. A seating positioning mechanism comprising a concave block 45 provided on the lower surface of the laser processing head mounting plate 40 so as to be fitted to the portion 44a, and the third is provided side by side with the first and second seating positioning mechanisms, respectively. The abutting surface is a seating positioning mechanism including a pair of upper and lower planar blocks 46 and 47 having horizontal surfaces.

Further, as shown in FIGS. 12 and 13, a detection mechanism for detecting that the laser processing head 18 is seated between the support brackets 38, 38 and the laser processing head mounting plate 40. It is provided. This detection mechanism is provided on the support brackets 38, 38 side and is always urged upward by the action of a compression spring, and the detection bar 48 is provided on the laser processing head mounting plate 40 side. Limit switch 49 pressed
It consists of and.

Further, as shown in FIG. 14, an air cylinder 50 is attached to each of the support brackets 38, 38 so as to be located between the air spring 39 and the seating positioning mechanism. This air cylinder 50 has a hole 40 in which a tip of a rod 51 is formed in a laser processing head mounting plate 40.
A circular locking plate 52 having a diameter larger than that of the hole 40a is attached to the tip of the rod 51 so as to pass through the hole a. The air cylinder 50 is operated in the contracting direction when the supply of the compressed air to the air spring 39 is stopped, and the locking plate 5
2 serves to reliably pull the laser processing head mounting plate 40 toward the support bracket 38 side. In addition, FIG.
As shown in FIG. 15, the main body frame 1 is provided with an upper limit stopper 53 located above the laser processing head mounting plate 40 and an abnormality detection switch 53a. The upper limit stopper 53 prevents the laser processing head mounting plate 40 from rising more than a predetermined amount when the laser processing head mounting plate 40 is lifted by the air spring 39.

The above-mentioned convex block 42 and concave block 4
3, a seating positioning mechanism, a planar block 46,
The seating positioning mechanism consisting of 47 and the detection mechanism provided in the middle of both seating positioning mechanisms are entirely covered by a dust cover 54. Similarly, the seating positioning mechanism including the convex blocks 44 and the concave blocks 45, the seating positioning mechanism including the planar blocks 46 and 47, and the detection mechanism provided between the seating positioning mechanisms are also covered with the dust cover 54. ing. These dust-proof covers 54 are provided to prevent fumes, spatters, etc. scattered during laser processing from adhering to the contact surface of the seating positioning mechanism, and are provided upright on the upper surface of the support bracket 38. The first cover portion 54a and the second cover portion 54b provided upright on the lower surface of the laser processing head attachment plate 40 are provided, and the elastic body 54c attached to the tip of the second cover portion 54b is the first cover portion 54a. It is configured to be in sliding contact with the outer peripheral surface of the cover portion 54a.

Further, in order to reliably prevent dust from adhering to the abutting surface of the seating positioning mechanism, the concave blocks 43 and 45 and the planar blocks 47 and 47 on the laser processing head mounting plate 40 side are centered. An air circulation hole 55 penetrating in the vertical direction is formed in the portion, and compressed air is supplied to the air circulation hole 55 from an air source (not shown). As a result, each block 42, 43; 44, 4
Compressed air is blown to the contact surfaces of 5; 46; 47,
The seating positioning of the laser processing head 18 can be performed more reliably.

By being configured in this way,
When compressed air is supplied to the four air springs 39 during the punching by the punching head 4 to expand the air springs 39, the blocks 42, 43; 44, 45; 47 are separated from each other so that the laser processing head 18 is supported by the support brackets 38, 38,
In other words, it is elastically supported with respect to the main body frame 1, which prevents punch vibrations from being transmitted from the main body frame 1 to the laser processing head 18. The upper limit stopper 53 prevents the laser processing head mounting plate 40 from rising above a predetermined amount. On the other hand, during the laser processing by the laser processing head 18, the air spring 39
When the supply of compressed air to the air springs 39 is contracted and the air springs 39 are contracted, and the air cylinder 50 is operated in the contraction direction to pull the laser processing head mounting plate 40 toward the support bracket 38 side, each block 42, 43; 4
The laser machining head 18 is seated and positioned at a predetermined position by abutting and fitting together. At this time, one of the seating positioning mechanisms is composed of a convex block 42 having a pin-shaped convex portion 42a and a concave block 43 fitted into the convex block 42, and the other is a convex block having a wedge-shaped convex portion 44a. Each block 42, 43; 44, 4 depends on the temperature of the outside air because the block 44 and the concave block 45 fitted to the convex block 44 are formed.
5; Even if the material such as iron that composes 46 and 47 is stretched, the stretching can be absorbed and the positioning can be surely performed, whereby the laser processing accuracy and the composite processing accuracy can be improved. . The laser processing head 18
The seating / positioning of is detected by a detection mechanism including a detection bar 48 and a limit switch 49.

Next, the detailed structure of the processing head portion will be described.

As shown in FIG. 16, the laser processing head 18 is attached to the laser processing head mounting plate 40 via a bellows 56 so that it can be moved up and down. It is designed to be raised to the retracted position. Further, a camera 57 as a visual sensor is fixedly attached to the laser processing head 18, and the work W is fixed by the camera 57.
The optical axis is adjusted by imaging the upper reference hole or reference mark. For this optical axis adjustment, for example, a reference hole formed by punching and a reference hole formed by laser processing are imaged by the camera 57, the coordinates of the centroid of the imaged reference holes are obtained by image processing, and the punching head is formed from those coordinates. 4 and the laser processing head 18 (offset amount) is obtained, and this distance is input to the NC device. In this way, the punching head 4
Even if a positional deviation with time occurs between the laser processing head 18 and the laser processing head 18, the positional deviation can be corrected to improve the composite processing accuracy. In FIG. 16, reference numeral 58
Reference numeral denotes a dust collecting duct that sucks dross or the like generated during laser processing due to a pressure difference and discharges it out of the machine.

The punching head 4 is shown in FIG.
The drive is controlled by a hydraulic servo mechanism as shown in FIG. That is, the punching head 4 is provided with a punch driving servo cylinder 59 for vertically moving a punch (not shown). The punch-driving servo cylinder 59 includes a cylinder 59a and a piston 59b that is vertically moved along the inner wall surface of the cylinder 59a, and a pressure chamber 60 having an open top is formed in the piston 59b. A ram 59c integral with the cylinder 59a is fitted in the pressure chamber 60. In addition, the cylinder 59 can be moved by the piston 59b.
The inside of a is partitioned into an upper chamber 61 and a lower chamber 62. The hydraulic pressure discharged from the hydraulic pump 63 is supplied into the pressure chamber 60 and the lower chamber 62 through the servo valve 64, and the upper chamber 6
The hydraulic pressure is supplied from the servo valve 64 to the inside of the valve 1 through the prefill valve 65.

This prefill valve 65 is used for the cylinder 5
A spool 65b is provided in a valve body 65a which is integral with 9a, and the spool 65b is connected to pilot chambers 66 and 67 provided at both ends of the valve body 65a.
It is operated by the pilot pressure supplied from the servo valve 64 or the tank 69 and the cylinder 59a.
The upper chamber 61 is communicated with the upper chamber 61. Here, the tank 69 has a closed structure, and is constantly pressurized at a constant pressure by air introduced from an air source (not shown) through the conduit 70.

The operating position of the piston 59b housed in the cylinder 59a is detected by the position sensor 71, and the pilot valve 68 is controlled based on this detection signal.

In the hydraulic servomechanism constructed as described above, when the piston 59b starts descending at a high speed, the spool 65b of the prefill valve 65 has the structure shown in FIG.
The tank 69 and the upper chamber 61 of the cylinder 59a are communicated with each other at the position shown in (3), and a large amount of oil in the tank 69 flows into the upper chamber 61, whereby the piston 59b is lowered at a high speed.

Then, when the position sensor 71 detects that the punch has come into contact with the work, the prefill valve 6
5, the spool 65b of No. 5 is switched to the position shown in FIG.
The piston 59b further lowered by the hydraulic pressure supplied to the upper chamber 61 and the pressure chamber 60 of 9a and lowered with a large force.
Punches down and punches the workpiece.
After this, when the punching of the work is completed, the spool 65b of the prefill valve 65 is switched to the position shown in FIG. 17, and at the same time, the cylinder 59a is turned on via the servo valve 64.
Hydraulic pressure is supplied to the lower chamber 62 from the hydraulic pump 63, and the piston 59b returns to its original position.

In this way, the piston 59b is lowered at a high speed when the force applied to the punch is not required so much, and the piston 59b is lowered with a large force when the work is sheared, so that the cylinder 59a can be operated at a high speed. Further, by making the stroke speed of the piston 59b variable in this way, noise and vibration generated during punching can be suppressed to a low level, and the adverse effect of this vibration on the laser processing section can be minimized.

Next, referring again to FIGS. 1 and 2, the structure of the carry-out portion for the processed product or punched waste, cut waste, etc. in the punch / laser combined processing machine of this embodiment will be described.

As shown in the figure, in the vicinity of the punching head 4 and the laser processing head 18, for example, a work shooter 72 which can be swung downward is provided for carrying out a medium product (or a cutting waste by laser processing). A work conveyor 73 extending parallel to the main body frame 1 is arranged at the carry-out end of the work shooter 72.

An unloader conveyor (not shown) is provided on the side of the punching head 4 for carrying out products (large products or very small products with micro joints) in a direction orthogonal to the extending direction of the die magazine 7. ) Is arranged, and a grip unloader (not shown) is arranged at the carry-out end of the unloader conveyor. Further, a skeleton shooter (not shown) capable of swinging downward is arranged at a position before reaching the unloader conveyor, and at the carrying-out end of the skeleton shooter, for example, a main body frame 1 for carrying out a small residual material. A skeleton conveyor 74 extending in parallel with is arranged.

Below the punching head 4 and the laser processing head 18, these processing heads 4 and 1 are provided.
Two sets of scrap chip conveyors 75 for discharging punching scraps or cutting scraps generated at the time of processing by 8 are arranged.

As described above, in this embodiment, the product or the residual material is distributed to the various conveyors and carried out according to the size and type of the product or the residual material, thereby improving the operating rate of the processing machine. Has been.

[Brief description of drawings]

FIG. 1 is a partially cutaway schematic perspective view of a punch / laser combined processing machine according to an embodiment of the present invention.

FIG. 2 is a plan view of a punch / laser combined processing machine according to the present embodiment.

FIG. 3 is a front view showing a support structure of a laser oscillator.

FIG. 4 is a plan view of FIG.

FIG. 5 is a left side view of FIG.

FIG. 6 is a right side view of FIG.

FIG. 7 is an enlarged view of part A of FIG.

8 is a cross-sectional view taken along line BB of FIG.

FIG. 9 is a plan view showing the periphery of a processing head portion.

FIG. 10 is a plan view showing a support structure for a laser processing head.

FIG. 11 is a side view showing a support structure of a laser processing head.

12 is a cross-sectional view taken along line CC of FIG.

13 is a cross-sectional view taken along the line DD of FIG.

FIG. 14 is a sectional view taken along line EE of FIG. 11.

FIG. 15 is a view on arrow F of FIG.

FIG. 16 is a front view schematically showing a processing head portion.

FIG. 17 is a hydraulic circuit diagram showing a hydraulic servo mechanism of a punching head.

FIG. 18 is a hydraulic circuit diagram showing a hydraulic servo mechanism of a punching head.

[Explanation of symbols]

1 body frame 4 punching head 18 Laser processing head 19 Laser oscillator 21 stand 22,39 Air spring 25,26,46,47 Planar block 27, 29, 42, 44 Convex block 27a, 42a Pin-shaped convex portion 28, 30, 43, 45 Concave block 29a, 44a Wedge-shaped convex portion 31,48 Detection bar 32,49 Limit switch 38 Support bracket 40 Laser processing head mounting plate 54 Dust cover 55 Air circulation hole 59 Punch drive servo cylinder 64 servo valve 65 prefill valve 68 Pilot valve 71 Position sensor

─────────────────────────────────────────────────── ─── Continuation of the front page (58) Fields surveyed (Int.Cl. ⁷ , DB name) B23P 23/04 B21D 28/24 B23K 26/00 330

Claims (9)

(57) [Claims] 1. A punch / laser combined processing machine comprising a punching machine for punching and a laser processing machine for laser processing, wherein a laser oscillator is provided separately from a main body frame supporting a punching head. The laser machining head can be supported by the main body frame via the vibration isolator for the laser machining head, and can be supported by the punch machining head with a predetermined offset amount. A punch / laser combined processing machine characterized by being installed separately. 2. The punch according to claim 1, wherein the vibration isolator for the laser oscillator is an air spring that is activated during punching to prevent transmission of vibrations from the ground to the laser oscillator. Laser compound processing machine. 3. A seating and positioning device for a laser oscillator is provided which releases support by the vibration isolator for the laser oscillator during laser processing and seats and positions the laser oscillator on a mount supporting the laser oscillator. The punch / laser combined processing machine according to claim 2, which is characterized in that. 4. The seating / positioning device for a laser oscillator is located on one side of a lower surface of the laser oscillator or a lower surface of a mounting plate on which the laser oscillator is mounted, or one end side of the gantry facing the one end side. A first laser oscillator positioning mechanism including a pin-shaped convex portion provided on one side and a concave portion fitted on the other side provided on the other side, and a mounting surface on which the lower surface of the laser oscillator or the laser oscillator is mounted. It comprises a wedge-shaped convex portion provided on either the other end side of the lower surface of the placing plate or the other end side of the pedestal facing the other end side, and a concave portion provided on the other side and fitted to the convex portion. The punch / laser combined machining machine according to claim 3, further comprising a second laser oscillator positioning mechanism. 5. The anti-vibration device for a laser processing head is an air spring that is activated during punch processing to prevent transmission of vibrations from the body frame to the laser processing head. Punch / laser combined processing machine described. 6. A seating positioning for a laser processing head for releasing the support by the vibration isolating device for the laser processing head during the laser processing and seating and positioning the laser processing head on a support table for supporting the laser processing head. The punch / laser combined processing machine according to claim 1, further comprising a device. 7. The seating positioning device for a laser processing head is a pin shape provided on one end side of a lower surface of a mounting plate to which the laser processing head is attached or one end side of the support base facing the one end side. Of the first laser processing head, which is composed of a convex portion and a concave portion that is fitted to the convex portion on the other side, and is opposed to the other end side or the other end side of the lower surface of the mounting plate to which the laser processing head is attached. And a second laser processing head positioning mechanism including a wedge-shaped convex portion provided on one of the other ends of the support base and a concave portion fitted to the convex portion provided on the other side. 7. The punch / laser combined processing machine according to claim 6. 8. The first laser processing head positioning mechanism and the second laser processing head positioning mechanism are covered with a dustproof cover.
Punch / laser combined processing machine described in. 9. An air blower for blowing air to the contact surfaces of the first laser processing head positioning mechanism and the second laser processing head positioning mechanism when the laser processing head is seated on the support base. 9. The punch / laser combined processing machine according to claim 7, further comprising an attachment device.