JPH03158492A - Plating device - Google Patents

Abstract

PURPOSE:To form a plating layer uniform in thickness and to reduce the consumption of a plating soln. when the soln. is injected onto the surface of a material to be plated from an upper nozzle and a current is applied with the nozzle as an anode and the material as a cathode to electroplate the cathode with a metal by rotating the material at high speed. CONSTITUTION:A stage 103 to be rotated by a motor 102 is placed in a plating soln. storage tank 101, and a material 104 to be plated is placed on the stage. The plating soln. 105 in the tank 101 is supplied to a nozzle 107 by a pump 106, the soln. is injected onto the material 104, and a current is applied from a power source 108 with the nozzle 107 as an anode and the material 104 as a cathode to electroplate the surface of the material 104. Since the material 104 is rotated, the thickness of the plating film on the surface is uniformized, the soln. deposited on the material is mostly blown after plating into the tank 101 by the rotation of the material and recovered, and hence the consumption of the soln. due to water washing is remarkably reduced.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a plating apparatus, particularly an apparatus for performing electrolytic plating.

[Prior art 1] A conventional plating apparatus has a plating tank 5 as shown in FIG.
Plating solution 502 is placed in 01, and anode 503 is placed in it.
, the substrate to be processed 504 was immersed and plating was performed.

[Problems to be Solved by the Invention] However, with the above-mentioned technique, the circulation of the plating solution varies widely within the surface of the substrate to be processed, and the variation in the plating film thickness also increases. Washing with water is performed with a large amount of plating solution adhering to the substrate to be processed, resulting in a problem that the plating solution decreases quickly and is inefficient.

The present invention is intended to solve these problems, and its purpose is to provide a plating apparatus that reduces variations in the thickness of the plating on the substrate to be processed and causes almost no loss of plating solution. .

[Means for Solving the Problems] The plating apparatus of the present invention is characterized by having a power source for plating, a nozzle for spouting a plating solution that serves as an anode during plating, and a function of holding and rotating the substrate to be processed once. shall be.

[Example 1] Hereinafter, the present invention will be described in detail based on Examples.

FIG. 1(a) is a diagram showing an embodiment of the present invention, in which a substrate to be processed 104 is placed on a stage 103 rotated by a motor 102 in a tank 101 for storing a plating solution. The structure is such that the plating solution 105 in a tank 101 storing the plating solution is passed through a pump 106 and spouted from a nozzle 107. A plating power source 108 is connected to the stage 103 and the nozzle 107.

FIG. 1(b) is a diagram during processing. Substrate to be processed 104
is placed on a stage 103 and rotated by a motor 102. The plating solution 105 in the tank 101 passes through a pump 106, is ejected from a nozzle 107, is sprayed onto the substrate to be processed 104, and is circulated through a route that returns to the tank 101. In this state, a plating film can be formed on the substrate to be processed 104 by passing a current having a waveform such as DC, pulse, or PR between the substrate to be processed 104 and the nozzle 107 using the power source 10B.

After the plating process is completed, the current is stopped, the pump 106 is stopped, and the substrate 104 to be processed is rotated for a while to spray the plating solution 105 on the substrate 104 to be processed, thereby reducing the amount of plating solution lost. .

Furthermore, by configuring the tank to have the shape shown in FIG. 2, the amount of plating solution 105 used can be significantly reduced, making it possible to increase efficiency.

Also, while rotating the substrate 104 to be processed, the plating solution 10 is
By spraying the plating solution 105 on the surface of the substrate 104 to be processed, it is possible to uniformly and quickly circulate the plating solution 105 on the surface of the substrate 104 to be processed, and the uniformity of the plating film thickness is greatly improved.

In addition to the shape of the nozzle shown in FIGS. 1 and 2, if the shape has a plurality of plating solution ejection holes 302 as shown in FIG. 3, the uniformity of the solution circulation will be further improved. However, the uniformity of the film thickness is also improved. The electrode on the nozzle side can be made by using the entire nozzle 401 as an electrode as shown in FIG. 4(a), by using the inside of the nozzle 402 as an electrode 403 as shown in FIG. 4(b), or by using the electrode 403 as shown in FIG. 4(C). There is a method of providing an electrode 405 inside the nozzle 404 as shown in FIG.

The plating apparatus of the present invention can be further developed into a cassette-to-cassette apparatus.

[Effect of the Invention 1] As described above, according to the present invention, it is possible to provide a plating apparatus that has excellent uniformity in the thickness of the formed plating film and greatly improves the efficiency of use of the plating solution.

[Brief explanation of the drawing]

FIG. 1(a) is a diagram showing one embodiment of the present invention, and FIG. 1(b) is a diagram showing the embodiment during plating processing. FIG. 2 is a diagram showing another embodiment of the present invention. FIG. 3 is a diagram showing a cross-sectional shape of a nozzle with improved uniformity of plating film thickness. FIGS. 4(a) to 4(C) are cross-sectional views of the nozzle showing electrodes on the nozzle side. FIG. 5 is a diagram showing a conventional technique. 101.201,501...tank 102. 103°104°105°106. 107. 108, 01 02 01 02 03 202 ・ 203 ・ 204゜205. 206 ・ 207 ・ 208. 404 ・ ・ ・ ・ ・ ・ ・ ・ 405
・ ・ ・ ・ ・ ・ ・ ・ ・503 ・ ・
・ ・ ・ ・ ・ ・ ・ Motor, stage, substrate to be processed, plating solution, pump, nozzle, power supply, nozzle, plating solution jet hole, integrated electrode nozzle, nozzle, electrode (inside the nozzle), nozzle, More than electrode/anode

Claims (1)

[Claims] A plating device characterized by having a power source for plating, a nozzle that spouts a plating solution that serves as an anode during plating, and a function of holding and rotating a substrate to be processed.