JPS63307741A - Device for removing foreign matter from substrate surface - Google Patents

Abstract

PURPOSE:To remove foreign matters from the rear side of a semiconductor substrate without damaging an integrated circuit by a method wherein a brush to scrape foreign matters from the rear side of a semiconductor substrate and a water supplying means capable of allowing water to flow out or shoot out to wash away the foreign matters are provided. CONSTITUTION:A semiconductor substrate 2 is installed in a pan 1 and foreign matters are mechanically removed by a brush 3. The semiconductor substrate 2 is so installed that its rear side faces up, and the rear side is scraped by the brush 3 for the removal of foreign matters. There is a cavity under the semiconductor substrate 2, wherethrough pure water flows. The negative pressure resulting from the flow of the pure water causes the semiconductor substrate 2 to he sucked to the pan 1. This ensures that any foreign matters, which have come around to land on the front surface of the semiconductor substrate 2 after removal by the brush 3, will be washed away. Further, a shower of water thrown on the rear side of the semiconductor substrate 2 simultaneously with the application of the brush 3 will facilitate the removal of foreign matters.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a device for removing foreign matter on a semiconductor substrate, and more particularly to a device for removing foreign matter from the back surface of a semiconductor substrate.

[Conventional technology]

In the manufacturing process of semiconductor integrated circuit devices, which are becoming increasingly dense and highly integrated, the conventional method for removing foreign substances adhering to semiconductor substrates is to immerse the semiconductor substrate in a solution to dissolve and oxidize and decompose the contaminants. There are chemical methods for removing foreign substances and physical methods for removing foreign substances by rotating a brush on the surface of a semiconductor substrate.

[Problem that the invention seeks to solve]

In the above-mentioned physical method, the semiconductor substrate is fixed by vacuum suction and the brush is rotated on the surface of the semiconductor substrate, so when trying to remove foreign substances from the semiconductor substrate, it is difficult to remove foreign substances from the semiconductor integrated circuit. There is a problem in that the surface of the semiconductor substrate is vacuum-adsorbed, thereby damaging the semiconductor integrated circuit that has already been formed.

Further, the chemical method has a problem in that foreign matter adhering to the back surface of the semiconductor substrate cannot be sufficiently removed.

SUMMARY OF THE INVENTION An object of the present invention is to solve these problems and provide a device for removing foreign matter from a semiconductor substrate surface, which can remove foreign matter attached to the back surface of a semiconductor substrate without damaging the semiconductor integrated circuit.

[Means for solving problems]

The apparatus for removing foreign matter from a substrate surface according to the present invention has a structure including a substrate support part that supports a semiconductor substrate on which a semiconductor integrated circuit is formed with its front surface facing down, and a substrate support part that supports the semiconductor substrate with the front surface facing down, and a substrate support part that supports the semiconductor substrate with the front surface facing down, and a substrate support part that supports the semiconductor substrate with the front surface facing down, and a substrate support part that supports the semiconductor substrate with the front surface facing down. It is characterized by comprising a brush for removing attached foreign matter, and a water supply means for passing running water or a fountain through the back surface of the semiconductor substrate to wash away the foreign matter.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIGS. 1(a) and 1(b) are a top view and a cross-sectional view of an embodiment of the present invention. In this embodiment, a semiconductor substrate 2 is mounted on a tray 1 to receive the semiconductor substrate, and a brush 3 is used to physically remove foreign matter. After the semiconductor substrate 1 is mounted with the back surface facing upward, foreign matter on the back surface of the semiconductor substrate 2 is removed by rubbing with a brush 3. The lower part of this semiconductor substrate 2 is hollow, and by flowing pure water here, the negative pressure generated by the flowing water causes the semiconductor substrate 2 to be brought into close contact with the tray 1, and at the same time, the foreign matter removed by the brush 3 is removed from the semiconductor substrate. If it gets to the surface of the substrate, it has the effect of washing away. Furthermore, when using the brush 3, foreign matter can be easily washed away by simultaneously spraying a shower onto the back surface of the semiconductor substrate.

When this example was applied to foreign matter attached to the back surface of a semiconductor substrate using semiconductor manufacturing equipment, data was obtained in which the foreign matter removal rate was 90% or more when the load of the brush on the substrate was 300 g or more.

FIGS. 2(a) and 2(b) show a top view and a cross-sectional view of a second embodiment of the present invention.

This embodiment uses a chuck 10 that supports the semiconductor substrate 2 at four points.
, a cylindrical brush 1.2 and a shower nozzle 13. After the semiconductor substrate 2 is set on the chuck 10 with its back side facing up, the chuck 10 is rotated and pure water is sprayed from the shower nozzle 13. The brush 12 rotates to remove foreign matter from the back surface of the semiconductor substrate 2. Also,
At the same time, in order to prevent foreign matter from reaching the surface of the semiconductor substrate 2 after removal, a pure water injection port 11 is installed in the center of the chuck 10.
is provided, and pure water is injected from this injection port 11 toward the surface of the semiconductor substrate 2.

This embodiment has the advantage of uniformly and effectively removing foreign matter by rotating the semiconductor substrate 2 and the brush 12.

〔Effect of the invention〕

As explained above, the present invention physically removes foreign matter adhering to the back surface of a semiconductor substrate while applying a water flow to the surface of the substrate, thereby removing foreign matter generated during the manufacturing process of high-density and highly integrated semiconductor integrated circuit devices. This has the effect of reducing defects in semiconductor integrated circuit devices.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a top view and a cross-sectional view of an embodiment of the present invention, and FIGS. 2(a) and (b) are a back view and a cross-sectional view of a second embodiment of the present invention. 1... Receiver is a dish, 2... Semiconductor substrate, 3... Brush, 4... Pure water inlet, 5... Pure water outlet, 10...
・Chuck, 11... Pure water spout, 12... Brush, 13... Shower nozzle. ,

Claims (1)

[Claims] a substrate support unit that supports a semiconductor substrate on which a semiconductor integrated circuit is formed with its front surface facing downward; a brush that rubs the back surface of the semiconductor substrate to remove foreign matter adhering to the back surface; and a back surface of the semiconductor substrate. Run running water or a fountain through the
A device for removing foreign matter from a substrate surface, comprising: water supply means for washing away the foreign matter.