JP2669085B2 - Continuous strip plating system for metal strips - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a plating system for masking a minimum amount of surface and performing partial plating. Particularly, the processing liquid in each processing step does not come into contact with anything other than the surface to be plated. The present invention relates to a novel metal strip continuous partial plating system capable of performing highly efficient plating treatment by intensively treating only the surface to be plated and further enhancing the commercial value of the product.

[Prior art] High reliability is required for electronic component materials such as lead frames for ICs, and the bonding surfaces and electrical contacts are plated with expensive precious metals such as gold, IC mounting and wires. Normally, solder plating is performed to facilitate bonding.

Partial plating was developed to plate such a precious metal or solder to the minimum necessary range, and to reduce the material cost as well as the cost.

Hereinafter, a description will be given by taking stripe plating, which is a typical example of partial plating, as an example.

In the conventional stripe plating, as shown in the cross-sectional view of FIG. 4, only the surface 21 ′ of the strip 20 ′ to be plated is left and all other surfaces are infiltrated with a resist solution or a masking tape 23. It is common to block and immerse this in a plating solution and then stir and spray the electrolytic solution onto the surface to be plated for plating.

However, in such a conventional method, the surface to be plated 2
Since all masks other than 1'are masked by the masking tape 23, a large amount of masking tape is required compared to the size of the plating surface, and it is inevitable that it will be expensive, and the plating solution is often taken out, and the plating target If a masked surface except for the surface 21 'is passed through a plating tank or a guide roll, it may break due to burrs on the slit ends of the strip 20' to be plated. Penetrates to cause displacement plating, which may cause poor appearance.

Further, in the conventional immersion plating method using the above-mentioned whole surface masking, since only a small amount of liquid can be stirred, a high current density cannot be obtained, and the plating bath must be lengthened in order to increase the plating speed. There was also.

Therefore, the inventors have previously performed the plating apparatus as shown in FIG.
Suggested 10 .

First, for the strip 20 to be plated, as shown in the cross-sectional view of FIG.
Partial masking is carried out to a minimum by a separate masking step with 22, and the strip 20 to be plated is slid in the longitudinal direction with the wide surface kept vertical as shown in FIG. The stored plating solution 2 is forcibly circulated by the pump 7 as shown by the arrow in the figure, and is temporarily stored in the auxiliary tank 3, and then the pressurized plating solution is sprayed from the nozzle 4 onto the plated surface 21. . On the outer periphery of the nozzle 4, a plated surface 21 is divided by the masking tape 22 of the plated strip.
Is provided with an outer jacket 5 having an interval somewhat wider than the width or having an inner diameter dimension that makes sufficient contact with the masking tape 22 to form the opening surface 5A. A suction passage 6 is formed between the outer jacket 5 and the nozzle 4 while being configured to slide. The surface to be plated is evacuated by a suction pump 8 in the upper part of the plating solution tank 1 to make the inside of the plating solution tank 1 negative pressure.
The plating solution jetted to 21 is sucked by the suction passage 6, and the surplus plating solution 2 is sucked and collected in the plating solution tank 1. The auxiliary tank 3 is provided to stabilize the pressure for spraying the plating solution and to install the anode material 9, and the pressurized plating solution 2 is temporarily stored in the auxiliary tank 3. In the pressurized state, it is stored and jetted through the nozzle 4.

[Problems to be Solved by the Invention] Stripe plating can be continuously performed on a metal strip by an electroplating method as described above. However, when performing a continuous plating operation, in addition to the plating treatment using the above plating solution, It is necessary to perform various pretreatments such as activation in a degreasing step, an acid washing step, or strike plating.

The above-mentioned pre-processing has been conventionally performed by a dip method. However, as shown in FIG. 3, when the masking is partially performed to the minimum and the pretreatment is performed by the dipping method as in the conventional method, the front end and the back surface of the strip to be plated are processed. There was a problem that the surface condition of the non-masked part was different from that of the non-masked part, and the commercial value of the product after peeling the masking tape was considerably reduced.

The object of the present invention is to solve the problems of the prior art as described above, and in the case of partial plating by masking the minimum surface, other than the surface to be plated in other processing steps other than the main plating. The treatment liquid does not come into contact with the surface, and only the surface to be plated is treated intensively to enable high-efficiency plating, while maintaining a good appearance of plated products and producing products with high commercial value. It is an object of the present invention to provide a new system for continuous plating of metal strips.

[Means for Solving the Problem] The present invention provides a treatment solution at least in a treatment means portion that can change the surface condition of a metal strip such as degreasing, pickling, strike plating and main plating of a strip to be plated. A nozzle that sprays toward the surface to be partially masked, a jacket that defines the periphery of the nozzle to form a processing opening surface that is slightly larger than the surface to be plated, and processing that sprays with a negative pressure inside the processing liquid tank A device having a suction means for collecting the liquid in the processing liquid tank is sequentially installed in each processing position in an array, and in this case, a process of spraying from a nozzle to a part or all of each processing device. The auxiliary tank is provided for temporarily storing the liquid and injecting the processing liquid with a balanced pressure.

[Operation] A nozzle for injecting toward the surface to be plated with the processing liquid partially masked in the processing means portion that can give some change to the surface state of the metal strip, and the periphery of the nozzle are divided to be slightly larger than the surface to be plated. If an outer jacket that forms the processing opening surface is provided, each processing solution will be sprayed only toward the surface to be plated and will not seep to the outside of the masking tape, so after removing the masking tape after partial plating There will be no difference between the surface of and the surface of the part where the masking tape was not applied from the beginning,
There is no risk of losing product value.

EXAMPLES Hereinafter, the present invention will be described sequentially with reference to examples.

FIG. 2 is an explanatory view showing a specific configuration of a continuous plating system for metal strips according to the present invention.

Strip to be plated (for example, copper strip) wound around the delivery device 60
20 is sent from the sending device 60 as shown in the figure, and the power feeding roll 61
(This power feed roll feeds the cathode side to the strip 20 to be plated, and a similar feed roll is also installed as the power feed roll 62 on the winding side of the winding device 15. Is kept in the cathode state.), The strip 20 to be plated has already passed through the tape application roll 65 at the third position.
As described in the drawing, the partial masking tape 22 having the minimum necessary width is attached.

When the partial masking tape 22 is attached, a tape of a predetermined width wound around the tape feeding device 63 is cut by the cutter 64, and the tape 20 is temporarily cut by the tape sticking roll 65 while the strip 20 is to be plated. The excess tape inside the guide roll 66, that is, the inner excess tape 22a that is removed to form the plated surface 21 of FIG. 3, is separated from the cut portion formed in the cutter 64, It is taken up and removed by the tape take-up device 67. The excess tape may be removed before the application roll.

By winding and removing the excess tape 22a, the plated surface 21 of the plated strip 20 is exposed, and the above-described partial masking tapes 22, 2 having a width of the minimum necessary range on both sides thereof.
2 remains, and in that state, is moved and moved to the degreasing device 30 .

The degreasing device 30 has conventionally been degreased by a so-called dipping method, but in the present invention, the degreasing device 30 also has a structure similar to that shown in FIG. 1, and the degreasing liquid is exposed from the nozzle 4 by the outer jacket opening 5A. It is configured to degrease only the surface 21 to be plated. In this case, it is highly desirable to use a stainless steel electrode as the electrode material 9 for electrolytic degreasing. In this way, the surface 21 to be plated is sufficiently degreased by the degreasing device 30 , and then thoroughly rinsed by the first washing tank 31 and the second washing tank 32, and then transferred to the pickling device 40 which is the next step. Be punished.

This pickling device 40 has also conventionally been pickled by a dip method, but in the system according to the present invention, this pickling device 40 also has the same configuration as that shown in FIG. Only the surface 21 to be plated exposed by the nozzle 4 is exposed by pickling, and pickling is performed so that the pickling solution does not leach outside the surface 21 to be plated. Next, the strip to be plated having the surface to be plated 21 whose surface has been sufficiently activated by pickling is the first washing tank 41 and the second washing tank.
Washed thoroughly with water washing tank 42, then is allowed to migrate to the strike plating device 50, so-called strike plating is performed by first drawing similar device, then it is thoroughly washed with water end of this plating apparatus by washing tank 51 10 To reach.

FIG. 1 is an explanatory sectional view for explaining a plating situation in the main plating apparatus 10. As shown in FIG.

The components indicated by the respective reference numerals have already been described in detail, and the plating solution 2 forcibly circulated in the auxiliary tank 6 by the supply pump 7 gives a balanced internal pressure in the auxiliary tank 3. And is sprayed from the tip of the nozzle 4 toward the plating surface 21 as shown by the arrow in the figure,
The surplus plating solution 2 after the injection is collected again in the plating solution tank 1 through the suction passage 6.

Thus, sufficient suction of the plating solution is performed by the negative pressure of the internal space by the suction pump 8 and forced circulation of the plating solution by the supply pump 7, and the critical current density in plating is also obtained by using this plating solution injection method. 3 to 4 times the current density in the immersion plating method (40A / d
m ² ), and a higher plating speed can be achieved.

In FIG. 1, reference numeral 9 is an anode material, and a consumable electrode is used depending on a plating material for stripe plating, a graphite electrode or the like is used, and an appropriate electrode is installed.

After the stripe plating is performed on the surface to be plated 21 as described above, it is then sufficiently washed in the washing tank 11, and the partial masking tape that has been masked so far at the point where it has passed the guide roll 66 is peeled off. The peeled peeling tape 22b is wound up by the peeling tape winding device 12, the strip 20 to be plated from which the masking tape is removed is finally washed in the final washing tank 13 and dried by the drying device 14 as described above. After passing the power supply roll 62,
It is wound up by the winding device 15 as the plated-up strip 20A.

As is clear from the above description, according to the present invention, the degreasing device 30 , the pickling device 40 , the strike plating device 50 is provided on the front surface or the back surface on which the masking tape is not attached.
There is no risk of contact with the treatment liquid in any of the
Therefore, after the masking tape is peeled off, the difference in surface appearance between the masking tape peeling portion and the masking tape non-sticking portion, unlike the conventional example, does not occur, and the commercial value is significantly increased. Is possible.

In the above description, it is explained that the same devices as those shown in FIG. 1 are all adopted at the predetermined positions, that is, the processing means portions that can give some changes to the surface condition of the metal strip, but the structure itself. Is the first
It does not have to be exactly the same as the structure shown in the figure.

For example, for the auxiliary device 3, a strike plating device
In 50, it is highly desirable to place in providing a stable pressure jet force, for example, in the degreasing device 30 or the pickling device 40, supplying pressurized by the supply pump 7 without providing the auxiliary tank 3 If the processing liquid is directly jetted by the pressure and there is no particular problem in terms of quality, the auxiliary tank 3 may be omitted. Further, in the water washing devices 31, 32, 41, 42, 51, 11 and the like, it will be particularly explained whether or not the nozzle 4 injects water from the jacket opening 5A as shown in FIG. However, it is a matter of course that a more desirable effect can be expected if the water washing device is also of the nozzle injection type while the partial masking tape 22 is attached to the strip to be plated 20.

Further, in the above-mentioned embodiment, the case where the copper strip is plated with gold, for example, is described as an example, but this partial plating is not necessarily limited to only the stripe plating, and spot plating other than that is not limited thereto. It goes without saying that it can be widely applied to partial plating.

[Effects of the Invention] As described above, according to the present invention, the masking tape can be partially masked with a necessary minimum width, and the masking tape can be greatly saved, and each processing device, particularly at least The processing device that can change the outer surface of the plating strip is configured to spray the processing liquid only on the surface to be plated with a device that uses a plating solution injection suction method, so it is extremely difficult to carry out the processing solution as in the dip method. In addition, it is possible to greatly simplify the water washing process or the waste liquid process, and it is possible to increase the critical current density by using the injection method and thereby speed up the plating. Not only can costs be reduced on all sides, but the surface without partial masking and the surface with masking are the same in the final finished product. This makes it possible to maintain the same surface condition, thereby significantly increasing the commercial value.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an embodiment of the present plating apparatus in a system according to the present invention, FIG. 2 is an explanatory view showing a configuration of a continuous partial plating system according to the present invention, and FIG. 3 is a plated object according to the present invention. Sectional view showing partial masking of strips, 4th
FIG. 1 is a sectional view showing a masking state using a conventional full-surface masking tape. 1: Plating solution tank, 2: Plating solution, 3: Auxiliary tank, 4: Nozzle, 5: Mantle, 5A: Mantle opening, 6: Suction path, 7: Supply pump, 8: Suction pump, 9: Anode material, 10 : main plating device, 20: strip to be plated, 21: surface to be plated, 22: partial masking tape, 30 : degreasing device, 40 : pickling device, 50 : strike plating device.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koichi Kayne 2-1-2 Marunouchi, Chiyoda-ku, Tokyo Within Hitachi Cable Co., Ltd. (72) Inventor Hiromichi Yoshida 3550, Kidayo-cho, Tsuchiura-shi, Ibaraki Hitachi Densen Co., Ltd. (72) Inventor Kenji Konishi, 3-1-1 Sukegawa-cho, Hitachi City, Ibaraki Nitrate Electric Cable Co., Ltd. (56) Reference JP-A-2-153090 (JP, A) JP-A 3-183793 (JP, A)

Claims (2)

(57) [Claims] 1. A treatment means portion capable of giving some changes to the surface condition of a metal strip such as degreasing, pickling, strike plating and main plating of the strip to be plated, on the surface to be plated with the treatment liquid partially masked. A nozzle that sprays in the opposite direction, a jacket that divides the periphery of the nozzle to form a processing opening surface that is slightly larger than the surface to be plated, and a sprayed processing liquid with a negative pressure inside the processing liquid tank is collected in the processing liquid tank. A continuous partial plating system for metal strips, in which devices having suction means are installed in sequence at respective processing positions. 2. An auxiliary tank for temporarily storing the treatment liquid jetted from a nozzle and jetting the treatment liquid by a balanced pressure is provided in a part or all of the arranged treatment devices. 1. The continuous partial plating system according to 1.