JP2714922B2 - Manufacturing equipment for ultra-fine composite metal plated wire - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for manufacturing an ultra-fine composite metal plated wire suitable as a coil winding material for a small coil, for example, a chip coil or a watch coil. The present invention relates to an apparatus for manufacturing an ultra-fine composite metal plated wire that prevents diffusion and outflow of metal.

[0002]

2. Description of the Related Art In recent electronic devices, the tendency of miniaturization of components and chipping has become remarkable as circuit boards have been mounted at higher density. The downsizing and chipping of components have spread to coil components, and of course, the wire rods used for these coil components have also been reduced in diameter, and the conductor diameter has been reduced to 0.030 mm or more.
Extra fine copper wire such as 0.050mm and conductor diameter 0.030m
m or less ultra-fine copper wires are being used. As the coil wire, a polyurethane insulated copper wire that can be soldered without peeling an insulating film is widely used. On the other hand, in the soldering process of coil components, when soldering very fine wires, the copper contained in the conductor diffuses and elutes into the solder due to the tin contained in the solder, and the outer diameter of the conductor decreases (hereinafter referred to as solder erosion). ), Resulting in a decrease in production yield in the coil manufacturing process and a decrease in reliability in the market. JP-A-3-98210 discloses that a conductor having a conductor diameter of copper or copper alloy of 0.10 mm or less is plated with iron or iron-nickel alloy and then plated with a metal having good solder wettability, for example, nickel or copper plating. It is disclosed that solder erosion can be solved by applying a composite metal plated wire.

[0003] As a general apparatus for producing this composite metal plated wire, there are a pretreatment tank for pretreating the outer periphery of a continuously running copper conductor, an iron plating layer on the outer periphery of the conductor by electroplating. An iron plating tank, a copper plating tank provided with a copper plating layer on the outer periphery of the iron plating layer by electroplating, a power supply roll attached to the electrolytic degreasing tank and each plating tank, and a power supply roll attached to each of the processing tanks. What consisted of a washing tank, a drying furnace for drying the surface of the copper plating layer, and a winder was used.

[0004]

In recent years, when the size of the coil has been increasingly reduced in size, and the required wire diameter of the plated wire has become ultra-fine wire having a diameter of 0.030 mm or less, the disconnection frequently occurs during the production of the plated wire, and the production of the plated wire is increased. The problem that the property is reduced has arisen. In particular, it is difficult to continuously produce a long ultra-fine plated wire without breaking the wire with a conventional manufacturing apparatus for a wire having an extremely small breaking strength such as an ultra-fine copper wire. There are very few wires plated on the market. For this reason, if it is going to manufacture the plating wire of a super-fine copper wire, it was necessary to minimize disconnection of the above-mentioned super-fine copper wire as much as possible, and to raise productivity.

[0005] Further, as in the conventional case, an ultra-fine plated wire is first produced by a plating apparatus, wound on a bobbin, then the plated wire is unwound from the bobbin, and an enamel paint is applied and baked. Due to the small weight per unit length, not only could productivity not be improved, but also delays in delivery.

The present invention has been made in order to solve the above-mentioned problems of the prior art, and has been made in the range of 0.018 to 0.08.
In an apparatus for manufacturing an ultra-fine composite metal plated wire in which an iron plating layer and a copper plating layer are provided on the outer periphery of a 30-mm ultra-fine copper wire, disconnection can be reduced as much as possible, and productivity can be increased.
It is another object of the present invention to provide an apparatus for manufacturing an ultra-fine composite metal plated wire capable of improving productivity by directly connecting to an enamel paint application and baking apparatus.

[0007]

In order to achieve the above object, the present invention comprises an electrolytic degreasing tank and an acid pickling tank for pretreating the outer periphery of an ultra-fine copper wire which is a continuously running wire to be plated. A pretreatment tank, an iron plating tank that provides an iron plating layer around the copper wire by electroplating, a copper plating tank that provides a copper plating layer around the iron plating layer by electroplating,
A power supply roll associated with the electrolytic degreasing treatment tank and each plating treatment tank, a washing treatment tank associated with each treatment tank, a drying furnace for drying the surface of the copper plating layer, and a winding machine for an ultra-fine composite metal plating wire. In the manufacturing apparatus, the pretreatment tank,
An iron plating tank, a copper plating tank, an electrolytic degreasing tank and a power supply roll associated with each plating tank, a washing tank associated with each of the processing tanks, a drying furnace, and a winder are linearly arranged. The process from the pre-treatment of the wire to be plated to the winding of the ultra-fine composite metal plated wire is performed continuously in a straight line, and each of the treatment tanks is overflowed with each treatment solution. The structure is such that each processing is performed by running in a straight line in each processing liquid, and the angle θ at which the wire to be plated contacts the power supply roll can be adjusted to 0 ° <θ ≦ 20 °. It is in the production equipment for composite metal plated wire.

[0008] The present invention also relates to the present invention, wherein the ultrafine composite metal plated wire has a conductor diameter of 0.018 to 0.030 mm and an iron plating layer having a thickness of 0.018 to 0.030 mm.
0.08 to 0.3 μm, and the thickness of the copper plating layer is 0.03 to 0.10 μm
m in the manufacturing apparatus for ultra-fine composite metal plated wire.

The present invention also relates to a method of directly connecting the above-mentioned ultrafine composite metal plated wire manufacturing apparatus and an enamel paint application and baking apparatus.
It is in the production equipment for ultra-fine composite metal plated wire which is in-line.

[0010]

The apparatus for manufacturing an ultra-fine composite metal plated wire according to the present invention comprises the above-mentioned pretreatment tank, iron plating tank, copper plating tank,
Since the electrolytic degreasing treatment tank and the power supply rolls associated with each plating treatment tank, the water washing treatment tank associated with each treatment tank, the drying furnace, and the winding machine are linearly arranged, the pretreatment of the ultra-fine copper wire is performed. To the winding of the ultra-fine composite metal plating wire are continuously performed in a straight line, and each of the processing tanks is overflowed with each processing solution, and the wire to be plated is formed in a straight line in each of the processing solutions in each of the processing tanks. , And each processing is performed, so that an unreasonable force is not applied to the running plating target wire, and the disconnection is reduced.

In addition, since the angle θ at which the wire to be plated comes into contact with the power supply roll can be adjusted to 0 ° <θ ≦ 20 °, the load applied to the wire to be plated in the vertical direction can be reduced. And disconnection decreases. Θ is 0
In the case of °, power is not supplied sufficiently, and when θ exceeds 20 °, the load applied to the wire to be plated in the vertical direction increases, and the number of disconnections increases.

In the present invention, the conductor diameter of the ultra-fine copper wire is set to 0.01
The reason for limiting the thickness to 8 to 0.030 mm is that the manufacturing apparatus of the present invention is particularly preferable as an apparatus for manufacturing a plating wire for an ultra-fine copper wire in this range. Extra-fine copper wire outside this range,
Needless to say, it can also be used as an apparatus for manufacturing a fine copper wire.

In the present invention, the 0.08 to 0.30 μm thick iron plating is applied to the outer periphery of the ultrafine copper wire having a diameter of 0.018 to 0.03 mmφ because the iron plating is difficult to diffuse and flow into the molten solder on the ultrafine copper wire. This is because the plating layer acts as a barrier layer for diffusion and outflow of copper atoms into the molten solder. If the thickness of the iron plating layer is less than 0.08 μm, the effect of solder corrosion resistance is not sufficient, and
If it exceeds 0 μm, productivity is undesirably reduced.

In the present invention, 0.0
The reason why copper plating with a thickness of 3 to 0.10 μm is performed is to improve solder wettability in a soldering process. In addition,
If the copper plating thickness is less than 0.03 μm, the solder wettability is not good, and if it exceeds 0.10 μm, the length of the plating bath becomes long, which impairs productivity.

Further, the productivity can be increased by directly connecting the super-fine composite metal plating wire producing apparatus and the enamel paint application and baking apparatus to be in-line. This in-line is achieved only when there is a manufacturing apparatus that hardly disconnects in the plating step. If there are many disconnections in the plating step, the production efficiency is rather remarkably reduced. According to the present invention, since the manufacturing apparatus has almost no disconnection in the plating step, the effect of in-line conversion is increased.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described with reference to the drawings and tables. Note that the present invention is not limited to the present embodiment. FIG. 1 is a schematic side view showing an embodiment of the apparatus for manufacturing an ultra-fine composite metal plated wire according to the present invention, and FIG. FIG. 3 is a schematic view showing an embodiment of the structure of each processing tank of the apparatus for manufacturing a plated wire according to the present invention, and FIG. 3 (a) is a side view thereof. FIG. 4B is a front view of the overflow portion, FIG. 4 is a schematic side view showing an embodiment in which the apparatus for manufacturing a plated wire and the coating and baking apparatus of the present invention are directly connected and inlined, and FIG. FIG. 6 is a sectional view showing an example of the obtained ultrafine composite metal plated wire, and FIG. 6 is a sectional view showing an example of the ultrafine polyurethane composite metal plated wire obtained according to the present invention.
Table 1 is a table showing production conditions of the ultra-fine composite metal plated wires of Examples 1 to 3, and Table 2 is a table showing characteristics of the ultra-fine composite metal plated wires of Examples 1 to 3.

Embodiment 1 An apparatus for manufacturing an ultra-fine composite metal plated wire according to the present invention will be described with reference to FIGS. This manufacturing apparatus includes a pretreatment tank 7 comprising an electrolytic degreasing tank 5 and an pickling tank 6, an iron plating tank 9, a copper plating tank 10, the electrolytic degreasing tank 5 and each of the plating tanks 9, 10. Associated power supply rolls b1 to b
5, the washing tanks 8a to 8d, the drying furnace 11, and the winding machine 12 attached to each of the above-mentioned processing tanks are arranged in a straight line, and the pre-treatment of the ultra-fine copper wire 1 to be plated and the ultra-fine composite metal plating are performed. The winding up of the wire 4 is performed continuously in a straight line. In each of the processing tanks 5, 6, 8a to 8d, 9, 10, each of the processing liquids 5s, 6s, 8s, 9s, 10s (hereinafter referred to as "s"). s) is overflowed, and the plating target wire 1 is configured to run in a straight line in each processing solution s in each of the processing tanks to perform each processing, and the plating target wires 1 are attached to the power supply rolls b1 to b5. Has a structure in which the contact angle θ can be adjusted to 0 ° <θ ≦ 20 °. Although not shown, electrodes are also provided in the electrolytic degreasing tank 5 and the plating tanks 9 and 10, respectively.

The details of the apparatus for manufacturing the ultrafine composite metal plated wire will be described. Each of the processing tanks 5, 6, 8a to 8
Each of d, 9, and 10 is configured such that each processing liquid s is sent from each circulation tank t1 to t4 (a water treatment tank is not shown) by each pump p (a water treatment pump is not shown) and circulates. After each processing solution s sent to each processing tank from the liquid supply pipe d provided on the bottom portion of each processing tank, the processing solution fills the processing tank and then flows over the overflow sections f on the inlet side and the outlet side of the processing tank. Each tank t1 overflows from the edge g and is discharged from the drainage pipe e.
To t4. And the wire to be plated 1
Is run in the central part of the U-shaped groove provided in the overflow section f, and immersed in each processing solution s to perform each processing. In the apparatus of the present invention, the lengths of the respective treatment tanks are 600 mm for the electrolytic degreasing tank 5 and the pickling tank 6, 1800 mm for the iron plating tank 9 and the copper plating tank 10, and The length of 8a to 8d was 300 mm to 600 mm.

The electrolytic degreasing tank 5 and the iron plating tank 9
And copper feeding rolls b1 to b5 of 20 mmφ are provided on the inlet side or the outlet side of the copper plating tank 10, respectively.
Each processing voltage and current were set as shown in Table 1. The power supply rolls b1 to b5 include guide pulleys c1 to c.
5 was set so that the contact angle θ with the wire to be plated 1 was 5 °.

[0020]

[Table 1]

An example in which an ultra-fine composite metal plated wire having a diameter of 0.018 mm is manufactured using the above manufacturing apparatus will be described with reference to FIG. First, an ultra-fine copper wire 1 of 0.018 mmφ, which is a wire to be plated, is fed from the winding frame a at a linear speed of 100 m / min, and the electrolytic degreasing tank 5 of the pretreatment tank 7 in which the electrolytic degreasing solution 5s at 40 ° C. is overflowed. To perform an electrolytic degreasing treatment, a water washing treatment in a water washing treatment tank 8a in which the water washing treatment liquid 8s is overflowed, and then a pickling treatment in the acid washing treatment tank 6 in which the acid washing treatment liquid 6s at 25 ° C. is overflowed. Rinsing tank 8 in which rinsing liquid 8s is overflowing
b, then 9 seconds of iron plating solution at 25 ° C
Is subjected to electric iron plating in the iron plating tank 9 in which the iron is overflowed, and the iron plating layer 2 is provided.
Is subjected to a water washing treatment in a water washing treatment tank 8c in which is overflowed, and then an electrolytic copper plating treatment is carried out in a copper plating treatment tank 10 in which a copper plating treatment liquid 10s at 25 ° C. is overflowed to form a copper plating layer 3; Then, the surface of the copper plating layer 3 is dried in a drying furnace 11 set at 100 ° C., and then wound around a winding frame a2 of a winding machine 12.
An ultra-fine composite metal plated wire 4 of 018 mmφ was manufactured. The production of the plated wire 4 was carried out continuously day and night, but a high quality product was obtained without disconnection.

Examples 2 and 3 Ultra-fine composite metal plated wires of 0.025 mmφ and 0.030 mmφ were manufactured using the same manufacturing apparatus as in Example 1 and in the same manner as in Example 1 under the manufacturing conditions shown in Table 1. The production of the plated wire 4 was carried out continuously day and night as in Example 1, but a high quality product was obtained without disconnection.

Embodiment 4 An example in which an apparatus for manufacturing an ultra-fine composite metal plated wire of the present invention is directly connected to an apparatus for applying and baking an enamel paint to form an in-line will be described with reference to FIG. The apparatus for manufacturing the ultrafine composite metal plated wire is the same as that in Example 1 (A except for the winder 12).
), An annealing furnace 21 having a length of 1500 mm, a coating and baking apparatus 24 including a coating apparatus 22 and a baking furnace 23 having a length of 1800 mm, and a winding machine 12 which is the same as in the first embodiment are linearly arranged. did. The annealing furnace 21 is used as needed.

Using the above in-line apparatus, 0.025 m
An example in which a polyurethane composite metal plated wire of mφ is manufactured will be described with reference to FIGS. First, a composite metal plated wire 4 was manufactured using the above-described apparatus for manufacturing a plated wire (part A) under exactly the same manufacturing conditions as in Example 2, and then an annealing furnace 2 at 350 ° C.
1, annealed by passing through, and then passing through a paint application device 22 for felting containing a 20% concentration of polyurethane paint to apply the paint, followed by passing through a baking furnace 23, repeated 5 times. A polyurethane composite metal plating wire 26 having a thickness of 0.025 mm was provided with a polyurethane coating layer 25 having a thickness of 0.002 mm, and was wound around a winding frame a2 of the winder 12. Using this in-line device, the product was manufactured continuously day and night, but a high quality product was obtained without disconnection.

Table 2 shows the characteristics of the ultra-fine composite metal plated wire obtained in Examples 1 to 3. The disconnection time of the ultra-fine copper wire in the solder was also shown as a reference example. As is clear from this table, the ultrafine composite metal plated wire obtained by the present invention has a long disconnection time in the solder and has excellent solder corrosion resistance. The breaking time in the solder of the 0.025 mmφ polyurethane composite metal plated wire of Example 4 was almost the same as that of the 0.025 mmφ composite metal plated wire of Example 2.

[0026]

[Table 2]

[0027]

According to the present invention, in an apparatus for manufacturing a superfine composite metal plated wire having an iron plating layer and a copper plating layer on the outer periphery of a superfine copper wire of 0.018 to 0.030 mm, disconnection is reduced as much as possible and productivity is increased. It is possible to increase productivity by directly connecting to a printing apparatus, and it is extremely large to contribute to industry.

[Brief description of the drawings]

FIG. 1 is a schematic side view showing one embodiment of an apparatus for manufacturing an ultra-fine composite metal plated wire of the present invention.

FIG. 2 is a side view showing one embodiment of a state in which a power supply roll and a wire to be plated are in contact with each other in the apparatus for manufacturing a plated wire according to the present invention.

FIG. 3 is a schematic view showing an embodiment of the structure of each processing tank of the apparatus for manufacturing a plated wire according to the present invention. (A) is a side view thereof. (B) is a front view of the overflow part.

FIG. 4 is an apparatus for manufacturing a plated wire according to the present invention (excluding a winding machine).
FIG. 2 is a schematic side view showing an embodiment in which the apparatus is directly connected to a coating and baking device for enamel paint to form an in-line.

FIG. 5 is a cross-sectional view showing one embodiment of an ultrafine composite metal plated wire obtained by the present invention.

FIG. 6 is a cross-sectional view showing one embodiment of the ultrafine polyurethane composite metal plating wire obtained by the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Ultra-fine copper wire (wire to be plated) 2 Iron plating layer 3 Copper plating layer 4 Ultra-fine composite metal plating wire 5 Electrolytic degreasing treatment tank 5s Electrolytic degreasing treatment liquid 6 Pickling treatment tank 6s Pickling treatment liquid 7 Pretreatment tank 8a ８8d Rinse treatment tank 8s Rinse treatment liquid 9 Iron plating treatment tank 9s Iron plating treatment liquid 10 Copper plating treatment tank 10s Copper plating treatment liquid 11 Drying furnace 12 Winding machine a, a2 Reel b1 to b5 Power supply roll c1 to c5 Guide Pulley d Supply pipe e Drain pipe f Overflow section g Upper edge p Pump s Each treatment liquid t1 to t4 Circulation tank 21 Annealing furnace 22 Paint coating device 23 Baking furnace 24 Coating and baking device 25 Polyurethane film layer 26 Ultrafine polyurethane composite Metal plated wire A Equipment for producing plated wire of the present invention (excluding winding machine) θ Contact angle

 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-57-165913 (JP, A) JP-A-62-151594 (JP, A) JP-A-4-12402 (JP, A) JP-A-3-3 98210 (JP, A)

Claims (3)

(57) [Claims] 1. A pretreatment tank comprising an electrolytic degreasing treatment tank and an acid pickling treatment tank for pretreating the outer periphery of a super-fine copper wire of a continuously running wire to be plated, and an iron plating on the outer periphery of the copper wire by electroplating. Iron plating treatment tank providing a layer, copper plating treatment tank providing a copper plating layer around the iron plating layer by electroplating, power supply roll accompanying the electrolytic degreasing treatment tank and each plating treatment tank, attached to each of the treatment tanks The pretreatment tank, the iron plating tank, the copper plating tank, and the electrolytic bath in the apparatus for manufacturing an ultra-fine composite metal plating wire, which comprises a water washing tank, a drying furnace for drying the surface of the copper plating layer, and a winder. A degreasing tank and a power supply roll associated with each plating tank, a washing tank associated with each of the processing tanks, a drying furnace, and a winding machine are linearly arranged, and from the pretreatment of the wire to be plated to the ultra-fine composite metal. Until winding of plating wire Each processing tank is configured to be continuously performed in a linear manner, and each processing tank is overflowed with each processing liquid, and the plating target wire runs in a straight line in each processing liquid in each processing tank to perform each processing. And the angle θ at which the wire to be plated contacts the power supply roll is 0 ° <θ ≦
An apparatus for manufacturing an ultra-fine composite metal plated wire, characterized in that the structure can be adjusted to 20 °. 2. The conductor diameter of the ultra-fine composite metal plated wire is
0.018 to 0.030 mm, iron plating layer thickness 0.08 to 0.3 μ
2. The apparatus according to claim 1, wherein the thickness of the copper plating layer is 0.03 to 0.10 [mu] m. 3. The apparatus for manufacturing an ultra-fine composite metal plated wire according to claim 1, wherein the apparatus for manufacturing an ultra-fine composite metal plated wire is directly connected to an apparatus for applying and baking an enamel paint. .