JPH03157449A - 樹脂組成物 - Google Patents

樹脂組成物

Info

Publication number
JPH03157449A
JPH03157449A JP29617889A JP29617889A JPH03157449A JP H03157449 A JPH03157449 A JP H03157449A JP 29617889 A JP29617889 A JP 29617889A JP 29617889 A JP29617889 A JP 29617889A JP H03157449 A JPH03157449 A JP H03157449A
Authority
JP
Japan
Prior art keywords
mold release
epoxy resin
mold
resin composition
release agent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP29617889A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0581622B2 (enrdf_load_stackoverflow
Inventor
Masaru Ota
賢 太田
Kenichi Yanagisawa
健一 柳沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Bakelite Co Ltd
Original Assignee
Sumitomo Bakelite Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Co Ltd filed Critical Sumitomo Bakelite Co Ltd
Priority to JP29617889A priority Critical patent/JPH03157449A/ja
Publication of JPH03157449A publication Critical patent/JPH03157449A/ja
Publication of JPH0581622B2 publication Critical patent/JPH0581622B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP29617889A 1989-11-16 1989-11-16 樹脂組成物 Granted JPH03157449A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29617889A JPH03157449A (ja) 1989-11-16 1989-11-16 樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29617889A JPH03157449A (ja) 1989-11-16 1989-11-16 樹脂組成物

Publications (2)

Publication Number Publication Date
JPH03157449A true JPH03157449A (ja) 1991-07-05
JPH0581622B2 JPH0581622B2 (enrdf_load_stackoverflow) 1993-11-15

Family

ID=17830175

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29617889A Granted JPH03157449A (ja) 1989-11-16 1989-11-16 樹脂組成物

Country Status (1)

Country Link
JP (1) JPH03157449A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002173578A (ja) * 2000-12-04 2002-06-21 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006249196A (ja) * 2005-03-09 2006-09-21 Kaneka Corp ポリエステル樹脂組成物およびそれから得られる成形体
WO2018216524A1 (ja) * 2017-05-24 2018-11-29 三菱ケミカル株式会社 成形材料、および繊維強化複合材料

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002173578A (ja) * 2000-12-04 2002-06-21 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP2006249196A (ja) * 2005-03-09 2006-09-21 Kaneka Corp ポリエステル樹脂組成物およびそれから得られる成形体
WO2018216524A1 (ja) * 2017-05-24 2018-11-29 三菱ケミカル株式会社 成形材料、および繊維強化複合材料
JPWO2018216524A1 (ja) * 2017-05-24 2019-06-27 三菱ケミカル株式会社 成形材料、および繊維強化複合材料
US11104793B2 (en) 2017-05-24 2021-08-31 Mitsubishi Chemical Corporation Molding material and fiber-reinforced composite material

Also Published As

Publication number Publication date
JPH0581622B2 (enrdf_load_stackoverflow) 1993-11-15

Similar Documents

Publication Publication Date Title
JPS6360543B2 (enrdf_load_stackoverflow)
JPH03157449A (ja) 樹脂組成物
JPH03167215A (ja) 樹脂組成物
JPH08337634A (ja) エポキシ樹脂組成物及び樹脂封止型半導体装置
JPH06287306A (ja) エポキシ基含有オルガノポリシロキサン類の製造方法、樹脂添加剤および半導体封止用エポキシ樹脂組成物
JP2000136290A (ja) 封止用樹脂組成物及び半導体封止装置
JPH03134051A (ja) 半導体封止用エポキシ樹脂組成物
JP3858353B2 (ja) 半導体封止用エポキシ樹脂組成物及びそれを用いた半導体装置
JPS62240312A (ja) 封止用樹脂組成物
JPS61101521A (ja) 封止用樹脂組成物
JPH06329765A (ja) エポキシ樹脂組成物の製造方法と半導体封止装置
JPH01188518A (ja) エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置
JPS6222822A (ja) 封止用樹脂組成物
JPH01242656A (ja) 半導体封止用エポキシ樹脂組成物
JP2001081287A (ja) 半導体封止用エポキシ樹脂組成物及び樹脂封止型半導体装置
JP3627736B2 (ja) エポキシ樹脂組成物並びにこれを用いた半導体装置
JP2823658B2 (ja) 樹脂組成物
JPS5958024A (ja) 半導体封止用エポキシ樹脂組成物の製造方法
JPS6143621A (ja) 封止用樹脂組成物
JP3965689B2 (ja) 光半導体封止用エポキシ樹脂組成物及び光半導体装置
JP3468900B2 (ja) 半導体装置
JPS58152047A (ja) エポキシ樹脂成形材料
JPS62209127A (ja) 半導体装置封止用エポキシ樹脂組成物
JPH0468329B2 (enrdf_load_stackoverflow)
JPS6296522A (ja) 封止用樹脂組成物

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20071115

Year of fee payment: 14

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081115

Year of fee payment: 15

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091115

Year of fee payment: 16

LAPS Cancellation because of no payment of annual fees