JPH031550A - Wire bonder - Google Patents

Abstract

PURPOSE:To reduce a loss time required for position correction and improve the efficiency of a bonding process by a method wherein detection by an individual lead position detector and the operation of a bonding part are performed in parallel in a wire bonder applied to the assembly process of a semiconductor element and the like. CONSTITUTION:A reference position detecting camera 2 fixed to bonding head 1 as a reference position detector is held on an X-Y table 6. The reference position detecting camera 2 detects the representing points of a chip and a lead. An individual lead position detecting camera 5 is attached to a position before bonding and the detection of the position of each lead and an operation (including the reference position detection) at a bonding part are processed in parallel at independent positions. The individual lead position detecting camera 5 is held on an X-Y table 7 which is different from the X-Y table 6 on which the reference position detecting camera 2 is held. The bonding operation is performed at the bonding position between a chip 10 on a stage 8S and wires 9 and between the wires 9 and respective leads formed in a lead frame 8.

Description

[Detailed Description of the Invention] [Summary] This invention relates to a wire bonder used in the assembly process of semiconductor devices, etc.

The purpose is to improve the efficiency of the bonding process by reducing the time lost due to position correction.

A device in which a mounting part on which a chip is mounted and a lead part connected to the chip with a wire are integrally formed and wire-bonded at a bonding part while sequentially feeding the part,
A reference position detector is provided in the bonding part to detect the deviation of the bonding head and the predetermined leads of the lead part from the initial set position, and and an individual lead position detector for detecting the relative coordinate position of the leads, wire-bonding the chip and the leads using the bonding head using the data detected by each position detector, and detecting the individual lead position. 1. A wire bonder characterized in that the detection by the device and the operation of the bonding section are performed in parallel.

It is configured as follows.

[Industrial application field]

The present invention relates to a wireponder used in the assembly process of semiconductor devices and the like.

In recent years, as the demand for increased pin counts in integrated circuits (ICs) has increased, the lead width and lead pitch of internal leads that are bonded to chips within the IC using wires have become narrower.

For this reason, bonding on the lead side cannot be performed using only the coordinate data of the initial teaching program due to positional deviation, so all individual lead positions for each element are detected one by one, and bonding is performed while correcting the data at that position. There is.

[Conventional technology]

Misalignment of individual leads is caused by variations in materials between lead frames, deformation during handling, etc., and therefore cannot be ignored, especially in the case of a large number of pins as described above.

Therefore, in order to correct the individual lead positions, in conventional wireponders, two individual lead position correction detections are performed after the chip (element) to be bonded is sent to the bonding position. ■ Correct the overall position in order.

■Correct the position of individual leads.

■Bonding It is carried out in three stages.

[Problem to be solved by the invention]

In the conventional example, bonding cannot be started until all of the above-mentioned reference position detection for overall position correction and individual lead position detection for individual lead position correction are completed. As the number of bins increases, the time required to correct the position of each lead increases, and the time lost due to waiting increases.

The present invention aims to improve the efficiency of the bonding process by reducing the loss time that occurs due to position correction in a wire bonder.

[Means to solve the problem]

The solution to the above problem is to provide a device in which a mounting part on which a chip is mounted and a lead part connected to the chip with a wire are integrally formed, and which performs wire bonding at a bonding part while sequentially feeding the part, which is provided in the bonding part. a reference position detector that detects the deviation of the bonding head and the predetermined leads of the lead section from the initial setting position; The bonding head wire-bonds the chip and the leads using the data detected by each position detector. , is achieved by a wire bonder configured such that the operations of the bonding sections are performed in parallel.

[Effect]

FIG. 1 is a diagram showing the principle of the present invention.

In the figure, a reference position detection camera 2 as a reference position detector fixed to a bonding head 1 is held on an XY table 6.

The reference position detection camera 2 detects representative points of the chip and leads.

The lead frame 8 is sent in the direction of the arrow and is fixed on the heater block 4 by the clamper 3 at the bonding position.

Up to this point, it is the same as the conventional device when the number of bins is small, and in the case of a large number of bins, the conventional device detects the reference position and the individual lead position using the same camera 2, but in the present invention, the individual lead position is detected. Camera 5 is installed at the position before bonding, and the time lost due to position detection is reduced by parallel processing of individual lead position detection and bonding part work (including reference position correction) at separate positions. It is something.

The individual lead position detection camera 5 is held on an XY table 7 that is separate from the XY table 6 that holds the bonding head 1 and the reference position detection camera 2.

Bonding is performed between the chip 10 on the stage 8S and the wire 9, and between the wire 9 and each lead formed on the lead frame 8 at the bonding position.

FIG. 2 is a time chart of the present invention in comparison with the conventional example.

In the figure, a: Lead frame feeding time b = Reference position detection time C: Individual lead position detection time d: Bonding time, tI is the time for one cycle of the present invention + tz is the time for one cycle of the conventional example, Δt is the time reduced by the present invention.

By separating individual lead position detection and actual bonding and processing them in parallel at separate points.

The efficiency of the wire bonding process can be improved.

〔Example〕

FIGS. 3(1) and 3(2) are a structural diagram of a bonder and a block diagram illustrating a position correction function, each of which illustrates an embodiment of the present invention.

In FIG. 3 (1), an X-Y table 6 is placed on a bonder base 11 and an X-Y table 7 is placed at a position before bonding, and a bonding head 1 and a reference position detection camera 2 are placed on the X-Y table 6. However, the X-Y table 7 is equipped with an individual lead position detection camera 5. In the figure, bonding baseline 1 indicating the bonding position
2 is shown in dashed lines.

The bonding baseline 12 is a horizontal line passing through the bonding point, and the lead frame is fed parallel to this.

Here, the X-Y table 6 controls the positions of the bonding head 1 and the reference position detection camera 2, and reads and moves coordinates.

In addition, the X-Y table 7 has an individual lead position detection camera 5.
It controls the position of the , and reads the coordinates.

2. Although not shown, the lead frame and heater block are the same as in FIG. 1.

In Fig. 3 (2), the initial X-Y coordinate data by the teaching program is ■, and the X-Y coordinate data detected by the reference position detection camera 2 is ■1. Assuming that the coordinate data is ■, the individual X-Y coordinate data of ■ is corrected by matching the same reference points of ■ and ■ (see FIG. 4).

(1) Correct each chip by replacing the coordinate data tree 1 position data and the above correction data via the CPU.
The bonding point of the bonding head 1 is determined as the Y coordinate data (■).

Here, the same reference point is used for the X-Y coordinate data (■, ■, ■).

Next, individual operations of the embodiment will be explained using FIG.

FIGS. 4(1) and 4(2) are plan views illustrating the reference position correction 2 and the individual lead position correction, respectively.

(1) Correction of reference position In FIG. 4 (1), the arrangement of a stage 8S and a lead 8L formed on the lead frame 8 is shown.

Reference point 1 on chip 10 brazed to stage 8S
0A, IOB and 8LA as the origin lead are detected with a reference position detection camera, and the amount of deviation from the initial data (for the origin lead, the deviation of the X and Y coordinates, for the chip, the χ coordinate, and one rotation of the Y seat (displacement).

(2) Individual lead position correction In Figure 4 (2), the relative coordinates of all leads are detected using the individual lead position detection camera, using the reference point A as the origin of the x'y' coordinates. .

(3) Bonding (IL) In (2), the position of each lead when the origin leads are matched is corrected and used as a bonding point.

Incidentally, the time chart of the operation of each part is as shown in FIG.

Numerical examples showing the effects of the present invention will be shown below in comparison with conventional examples.

For example, in FIG.

a=2 seconds, b=2 seconds.

c=0.1 seconds/wire, d=0.3 seconds/wire.

So, with 200 bonds.

In the conventional example, a+b+c+d=84 seconds.

In the example, a + b + d = 64 seconds.

becomes.

〔Effect of the invention〕

As explained above, according to the present invention, it is possible to improve the efficiency of the bonding process by reducing the loss time caused by nine-position correction.

[Brief explanation of drawings]

FIG. 1 is a diagram showing the principle of the present invention. FIG. 2 is a time chart of the present invention in comparison with the conventional example. FIGS. 3(1) and 3(2) are structural diagrams of a bonder explaining one embodiment of the present invention and block diagrams explaining its operation. FIGS. 4(1) and 4(2) are plan views illustrating reference position correction 1 and individual lead position correction, respectively. In fig. 1 is the bonding head. 2 is a reference position detection camera. 3 is a lead frame clamper 4 is a heater block. 5 is an individual lead position detection camera. 6.7 is an X-Y table. 8 is the lead frame. 8S is the stage. 9 is a wire. 10 is a chip (1) Horizontal drawing d: Bonding Mizuarame H time chart Bu 2 Day (2) 9077 Kunitomo koshi line waving Ehii standing oki width 1 uplift (Noji oto gq figure 3
figure

Claims (1)

[Scope of Claims] A device that performs wire bonding at a bonding section while sequentially feeding a component integrally formed with a mounting section on which a chip is mounted and a lead section connected to the chip with a wire, the device comprising: a reference position detector that detects the deviation of the bonding head and the predetermined leads of the lead section from the initial setting position; and an individual lead position detector that detects a coordinate position, wire bonding the chip and the lead with the bonding head using the data detected by each position detector, and detecting by the individual lead position detector. . A wire bonder, wherein the bonding sections are configured to operate in parallel.