JPS6328043A - Wire bonding apparatus - Google Patents
Wire bonding apparatusInfo
- Publication number
- JPS6328043A JPS6328043A JP61172191A JP17219186A JPS6328043A JP S6328043 A JPS6328043 A JP S6328043A JP 61172191 A JP61172191 A JP 61172191A JP 17219186 A JP17219186 A JP 17219186A JP S6328043 A JPS6328043 A JP S6328043A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- wire bonding
- lead frame
- pellet
- bonding head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000008188 pellet Substances 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000007246 mechanism Effects 0.000 abstract description 20
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7865—Means for transporting the components to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、ＩＣ等の半導体装置の製造装置に関し、特に
ワイヤーボンディング装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an apparatus for manufacturing semiconductor devices such as ICs, and particularly to a wire bonding apparatus.
従来、この種のワイヤーボンディング装置は半導体ペレ
ットを搭載したリードフレーム（５）を移動させる搬送
機構（１）と、リードフレーム上のペレット結線部分を
検出するボンディング認識機構（３）と、ペレットとリ
ードフレームとを結線するボンディングヘッド機構（２
とを１個ずつ備えている（第４図参照）。Conventionally, this type of wire bonding equipment has a transport mechanism (1) that moves a lead frame (5) loaded with semiconductor pellets, a bonding recognition mechanism (3) that detects the pellet connection portion on the lead frame, and a bonding recognition mechanism (3) that detects the pellet connection area on the lead frame. Bonding head mechanism (2
and one each (see Figure 4).
通常、半導体装置の製造工程において、リードフレーム
上のペレットとリードフレーム間結線というワイヤーボ
ンディング工程の前にリードフレーム上にペレットを搭
載するというマウント工程が存在するが、ペレット１個
を搭載するマウント工程時間に比較し、多数個所の結線
を行なうワイヤーボンディング工程時間は、３〜４倍も
必要である。Normally, in the manufacturing process of semiconductor devices, there is a mounting process in which a pellet is mounted on a lead frame before the wire bonding process of connecting the pellet on the lead frame and the lead frame. The wire bonding process for connecting wires at multiple locations requires three to four times as much time.
したがって、上述したボンディング装置においては、ボ
ンディングヘッドが１個であるため、１度に１個のペレ
ットしかボンディングできなく、生産性の低下を招く。Therefore, in the above-described bonding apparatus, since there is only one bonding head, only one pellet can be bonded at a time, leading to a decrease in productivity.
本発明のワイヤーボンディング装置は、半導体ペレット
を搭載したリードフレームを搬送する手段と；
前記リードフレームに搭載された前記ペレットのワイヤ
ーボンディング個所を検出する手段と；前記ペレットと
前記リードフレームとをワイヤーボンディングする少な
くとも２個のボンディングヘッド手段とを備える。The wire bonding apparatus of the present invention includes: means for transporting a lead frame on which a semiconductor pellet is mounted; means for detecting a wire bonding location of the pellet mounted on the lead frame; and wire bonding between the pellet and the lead frame. and at least two bonding head means.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例として、ボンディングヘッド
機構を２個設けたものである。すなわち、リードフレー
ム５がリードフレーム搬送装置１の上を右から左へと移
動されてゆき、ボンディング認識装置３，３′及び認識
処理装置４にて、ボンディングワイヤーの結線位置が決
定されると、ボンディングヘッド機構２及び２′により
、第２図に示されるように、リードフレーム５とペレッ
ト６とがボンディングワイヤー７にて結線されてゆく。FIG. 1 shows an embodiment of the present invention in which two bonding head mechanisms are provided. That is, when the lead frame 5 is moved from right to left on the lead frame transport device 1 and the bonding recognition device 3, 3' and the recognition processing device 4 determine the bonding wire connection position, As shown in FIG. 2, the bonding head mechanisms 2 and 2' connect the lead frame 5 and the pellet 6 with the bonding wire 7.
この過程におけるボンディングヘッド１ｆｉ１２．２’
とリードフレーム５上のペレット６との相対位置は第
３図に示す。つまり、ボンディングヘッド機構２はリー
ドフレーム５上のペレットを１個おきにボンディングし
てゆき、ボンディングヘッド機構２′にて残りの全ての
ボンディングを行うものである。これにより、ワイヤー
ボンディング装置上のスループット能力はボンディング
ヘッド機構が１個のものに対し２倍に向上する。Bonding head 1fi12.2' in this process
The relative position of the pellet 6 on the lead frame 5 is shown in FIG. That is, the bonding head mechanism 2 bonds every other pellet on the lead frame 5, and the bonding head mechanism 2' performs all the remaining bonding. As a result, the throughput capacity on the wire bonding apparatus is doubled compared to the one with a single bonding head mechanism.
なお、複数のボンディングヘッド機構２．２′に対する
ワイヤーボンディング領域の負担割り当ては、第５図に
おいて１個のペレットを符号ＡおよびＢに示すように分
割して行なうことも可能である。It is also possible to allocate the burden of the wire bonding area to the plurality of bonding head mechanisms 2.2' by dividing one pellet as shown by symbols A and B in FIG.
また、ボンディング認識処理については、複数のボンデ
ィングヘッド機構２．２′に対し認識装置３．３′をそ
れぞれ付加する構成または１個の認識装置にて、処理時
間を分割する構成で実施可能である。Furthermore, the bonding recognition process can be carried out in a configuration in which recognition devices 3.3' are added to a plurality of bonding head mechanisms 2.2', respectively, or in a configuration in which the processing time is divided into one recognition device. .
上記実施例においてはボンディングヘッド機構を２個設
けた場合について述べたが、３個以上設けた場合も基本
的には同様に実施できる。In the above embodiment, a case was described in which two bonding head mechanisms were provided, but the same principle can be applied even if three or more bonding head mechanisms are provided.
以上説明したように本発明によれば、ボンディングヘッ
ド機構を複数個設けることにより、ワイヤーボンディン
グ作業の処理能力を向上することができる。また、１個
のペレットに対するワイヤーボンディング領域を複数個
のボンディングヘッド機構に分割負担されることにより
、ワイヤーボンディング装置の前後工程との作業サイク
ルが整合化され、マウント工程およびワイヤーボンディ
ング工程がライン化およびシステム化できる。As described above, according to the present invention, by providing a plurality of bonding head mechanisms, the throughput of wire bonding work can be improved. In addition, by dividing the wire bonding area for one pellet between multiple bonding head mechanisms, the work cycle of the front and rear processes of the wire bonding equipment can be harmonized, and the mounting process and wire bonding process can be integrated into a line and Can be systematized.
第１図は本発明の一実施例のワイヤーボンディング装置
の構成図、第２図は半導体製造工程のボンディング工程
でのリードフレーム部分を示す図、第３図は第１図にお
けるリードフレーム上のペレットとボンディングヘッド
機構との位置を示す相対位置図、第４図は従来の一例を
示す構成図、第５図は本発明におけるベレット上のワイ
ヤーボンディング分割分担の例を示す図である。
１・・・リードフレーム搬送装置、２，２′・・・ボン
ディングヘッド機構、３．３′・・・ボンディング認識
装置、４・・・認識処理装置、５，５′・・・リードフ
レーム、６・・・ペレット、７・・・ボンディングワイ
ヤー、８，８′・・・ワイヤーボンディング未完了素子
、９，９′・・・ワイヤーボンディング完了素子。FIG. 1 is a configuration diagram of a wire bonding apparatus according to an embodiment of the present invention, FIG. 2 is a diagram showing a lead frame portion in a bonding process of a semiconductor manufacturing process, and FIG. 3 is a pellet on the lead frame in FIG. 1. FIG. 4 is a diagram showing a configuration of a conventional example, and FIG. 5 is a diagram showing an example of divided assignment of wire bonding on a pellet in the present invention. DESCRIPTION OF SYMBOLS 1... Lead frame conveyance device, 2, 2'... Bonding head mechanism, 3.3'... Bonding recognition device, 4... Recognition processing device, 5, 5'... Lead frame, 6 ... Pellet, 7... Bonding wire, 8, 8'... Wire bonding incomplete element, 9, 9'... Wire bonding completed element.
Claims (1)
手段と； 前記リードフレームに搭載された前記ペレットのワイヤ
ーボンディング個所を検出する手段と；前記ペレットと
前記リードフレームとをワイヤーボンディングする少な
くとも２個のボンディングヘッド手段と； を備えることを特徴とするワイヤーボンディング装置。[Scope of Claims] Means for transporting a lead frame on which a semiconductor pellet is mounted; means for detecting a wire bonding location of the pellet mounted on the lead frame; and at least a means for wire bonding the pellet and the lead frame. A wire bonding device comprising: two bonding head means;
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61172191A JPS6328043A (en) | 1986-07-21 | 1986-07-21 | Wire bonding apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61172191A JPS6328043A (en) | 1986-07-21 | 1986-07-21 | Wire bonding apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6328043A true JPS6328043A (en) | 1988-02-05 |
Family
ID=15937262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61172191A Pending JPS6328043A (en) | 1986-07-21 | 1986-07-21 | Wire bonding apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6328043A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6333243B1 (en) | 1996-06-12 | 2001-12-25 | Micron Technology, Inc. | Method for growing field oxide to minimize birds' beak length |
| US8008183B2 (en) * | 2007-10-04 | 2011-08-30 | Texas Instruments Incorporated | Dual capillary IC wirebonding |
-
1986
- 1986-07-21 JP JP61172191A patent/JPS6328043A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6333243B1 (en) | 1996-06-12 | 2001-12-25 | Micron Technology, Inc. | Method for growing field oxide to minimize birds' beak length |
| US8008183B2 (en) * | 2007-10-04 | 2011-08-30 | Texas Instruments Incorporated | Dual capillary IC wirebonding |
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