JPH03154854A - Detecting device for extremely small defect of thin wire - Google Patents

Detecting device for extremely small defect of thin wire

Info

Publication number
JPH03154854A
JPH03154854A JP1293556A JP29355689A JPH03154854A JP H03154854 A JPH03154854 A JP H03154854A JP 1293556 A JP1293556 A JP 1293556A JP 29355689 A JP29355689 A JP 29355689A JP H03154854 A JPH03154854 A JP H03154854A
Authority
JP
Japan
Prior art keywords
measured
light
image
laser light
fourier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1293556A
Other languages
Japanese (ja)
Other versions
JPH0781963B2 (en
Inventor
Kohei Sumi
角 浩平
Masahiro Nakashiro
正裕 中城
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP1293556A priority Critical patent/JPH0781963B2/en
Priority to KR1019900018174A priority patent/KR940002504B1/en
Publication of JPH03154854A publication Critical patent/JPH03154854A/en
Publication of JPH0781963B2 publication Critical patent/JPH0781963B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light

Abstract

PURPOSE:To detect the defect of the thin wire over a wide range with high accuracy and high reliability by providing a cylindrical lens group, a light shield plate, and a device which reduces and detects the disorder of a Fourier pattern due to scattered light. CONSTITUTION:A light source 2 emits single-wavelength laser light and when the light is transmitted through the cylindrical lens group 3, the light spreads into a plane in the lengthwise direction of a body 1 to be measured to become laser light which is thicker than the body 1 to be measured. The laser light is scattered by the body 1 to be measured and is reduced and imaged on the image pickup surface of a TV camera 5 through a lens 4 as a Fourier- transformed image pattern. At this time, laser light which travels straight at the periphery of the body to be measured is cut off by the light shield plate 6. The Fourier pattern of the image is sent as a video signal to an image processor 8 and sent to a monitor TV. The Fourier pattern is disordered by an extremely small defect of the body to be measured and the disorder is recognized by an image recognizing device 8 to detect the defect. When the body is irradiated with laser light beams in two directions, the detection dead angle is reducible and the thin wire defect can be detected with higher accuracy.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、光学的手段を使用した外観検査装置等におけ
る細線の微細欠陥検出装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a device for detecting minute defects in thin wires in a visual inspection device or the like using optical means.

従来の技術 以下、従来の細線の微細欠陥検出装置について図面を参
照して説明する。
2. Description of the Related Art Hereinafter, a conventional fine wire defect detection device will be described with reference to the drawings.

第3図は従来の細線の微細欠陥検出装置の模式図である
。同図において、1は被測定物としての細線である。光
源部はハロゲンランプ等の光源13とハーフミラ−14
で構成される。検出部はテレビカメラ5と拡大レンズ1
2で構成される。処理部はモニターテレビ7と画像認識
装置8で構成される。
FIG. 3 is a schematic diagram of a conventional fine wire defect detection device. In the figure, 1 is a thin line as an object to be measured. The light source section includes a light source 13 such as a halogen lamp and a half mirror 14.
Consists of. The detection part consists of a TV camera 5 and a magnifying lens 1.
Consists of 2. The processing section is composed of a monitor television 7 and an image recognition device 8.

以上のように構成された細線の微細欠陥検出装置につい
て、以下その動作を示す。
The operation of the thin wire fine defect detection apparatus configured as described above will be described below.

まず、光源13から出射された光はハーフミラー14で
反射され、拡大レンズ12を透過して被測定物1に照射
される。被測定物1に照射された光は物体光去して反′
射され、前記拡大レンズ12、前記ハ・−フミラー14
を透過して、テレビカメラ5の撮像面に拡大実体画像と
して結像される。結像された拡大実体画像は映像信号と
して画像認識装置8に送信され、さらにモニターテレビ
7に送信される。検査部の測定可能視野内の欠陥はモニ
ターテレビ7による目視検出、もしくは画像認識装置8
による自動検出により検出される。
First, light emitted from the light source 13 is reflected by the half mirror 14, passes through the magnifying lens 12, and is irradiated onto the object to be measured 1. The light irradiated onto the object to be measured 1 is reflected by the object beam.
, the magnifying lens 12 and the half mirror 14
, and is imaged on the imaging surface of the television camera 5 as an enlarged solid image. The formed enlarged solid image is transmitted as a video signal to the image recognition device 8, and further transmitted to the monitor television 7. Defects within the measurable field of view of the inspection department are detected visually using a monitor television 7 or by an image recognition device 8.
Detected by automatic detection.

発明が解決しようとする課題 しか”しながら上記の従来の構成では、高分解能を得る
ための光学系の高倍率化により生じる視野の縮小のため
、1画像に対し被測定物の極一部分での検出しかできな
い。このため全体像について測定するためには、被測定
物又は測定装置のいずれかをスキャンする必要があり、
測定に長時間を要したり、正確な測定が困難になるとい
う問題があった。
Problems to be Solved by the Invention However, in the above-mentioned conventional configuration, the field of view is reduced due to the high magnification of the optical system to obtain high resolution. Therefore, in order to measure the entire image, it is necessary to scan either the object to be measured or the measuring device.
There have been problems in that measurement takes a long time and accurate measurement is difficult.

また、被測定物としての細線は、これを拡大してみると
立体状になっており、両側線近傍部は反射光の散乱のた
め、画像が暗くなり欠陥の検出が困難になるという欠点
を有していた。
In addition, when a thin wire as an object to be measured is enlarged, it has a three-dimensional shape, and reflected light is scattered near the wire on both sides, making the image dark and making it difficult to detect defects. had.

本発明は上記従来の問題点を解決するもので、被測定物
に対し広範囲な細線の欠陥を一括して検出ができ、高精
度、高信頼性のある細線の微細欠陥検出方法を提供する
ことを目的とする。
The present invention solves the above-mentioned conventional problems, and provides a highly accurate and highly reliable method for detecting minute defects in thin wires, which can simultaneously detect defects in a wide range of thin wires on an object to be measured. With the goal.

課題を解決するための手段 この目的を達成するために本発明の第1の発明は、被測
定物に対し被測定物の長手方向に平面状に拡がり厚みが
被測定物の厚みより大である光束をもつレーザー光を照
射するためのシリンドリカルレンズ群と、被測定物を通
過した散乱光以外のレーザー光を遮光する遮光板と、散
乱光による画像のフーリエ変換されたパターン(以下フ
ーリエパターンと呼ぶことがある)の乱れを縮小検出す
る光学系及び画像認識装置の構成を有している。
Means for Solving the Problems In order to achieve this object, the first invention of the present invention provides a method for measuring a workpiece, which extends in a plane in the longitudinal direction of the workpiece and has a thickness greater than the thickness of the workpiece. A group of cylindrical lenses for irradiating laser light with a luminous flux, a light shielding plate for blocking laser light other than the scattered light that has passed through the object to be measured, and a Fourier-transformed pattern of the image created by the scattered light (hereinafter referred to as the Fourier pattern). It has an optical system and an image recognition device configured to reduce and detect disturbances (which may occur).

また、本発明の第2の発明は、上記検出方法において、
被測定物に対し2方向より均一な平面波のレーザー光を
照射する手段と、それぞれの散乱光による画像のフーリ
エパターンを検出する手段を有している。
Moreover, the second invention of the present invention is the above detection method,
It has means for irradiating the object to be measured with uniform plane wave laser light from two directions, and means for detecting a Fourier pattern of an image formed by each scattered light.

作   用 本発明の第1の発明は、遮光板番とより散乱光のみを検
出できるため、高精度な細線の欠陥検出ができる。さら
に、シリンドリカルレンズ群により被測定物の長手方向
に平面状に拡がり厚みが被測定物の厚みより大である光
束をもつレーザー光を照射でき、かつ光学系により散乱
光による画像のフーリエパターンを縮小検出できるため
、−一括に広範囲な細線の欠陥検出ができる。
Function: The first aspect of the present invention is capable of detecting only scattered light based on the number of light shielding plates, so that defects in thin wires can be detected with high accuracy. Furthermore, the cylindrical lens group enables irradiation of laser light with a luminous flux that spreads out in a plane in the longitudinal direction of the object to be measured and whose thickness is greater than the thickness of the object to be measured, and the optical system reduces the Fourier pattern of the image caused by scattered light. Since it can be detected, it is possible to detect defects in a wide range of thin lines all at once.

また、本発明の第2の発明は、2方向より前記レーザー
光を照射し、それぞれの散乱光による・画像のフーリエ
パターンを検出できるため、検出の死角を縮小でき、よ
り信頼性の高い細線の欠陥検出ができる。
In addition, the second aspect of the present invention is that the laser beam is irradiated from two directions, and the Fourier pattern of the image due to the respective scattered lights can be detected. Can detect defects.

実施例 以下本発明の一実施例について、図面を参照しながら説
明する。
EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

第1図は本発明の第1の実施例における細線の微細欠陥
検出装置の模式図である。同図において、1は被測定物
としての細線である。光源部はレーザー光源2とシリン
ドリカルレンズ群3で構成される。検出部は集光レンズ
4とテレビカメラ5と遮光板6で構成される。この遮光
板6は直射光を遮断するものである。処理部はモニター
テレビ7と画像認識装置8で構成される。
FIG. 1 is a schematic diagram of a fine wire fine defect detection apparatus according to a first embodiment of the present invention. In the figure, 1 is a thin line as an object to be measured. The light source section is composed of a laser light source 2 and a cylindrical lens group 3. The detection section is composed of a condensing lens 4, a television camera 5, and a light shielding plate 6. This light shielding plate 6 blocks direct light. The processing section is composed of a monitor television 7 and an image recognition device 8.

以上のように構成′された細線の微細欠陥検出装置につ
いて、以下その動作を示す。
The operation of the thin wire micro defect detection apparatus configured as described above will be described below.

まず、単波長のレーザー光がレーザー光源2から出射さ
れ、シリンドリカルレンズ群3を透過する際に被測定物
1の長手方向に平面状に拡がり厚みが被測定物1の厚み
より大・である光束をもつレーザー光に変換され、被測
定物1に照射される。前記レーザー光は被測−宝物′1
により散乱され、集光レンズ4によりテレビカメラ5の
撮像面に画像のフーリエパターンとして縮小結像される
。このとき、被測定物1の周辺を直進状に通過したレー
ザー光は遮光板6で遮光される。
First, a single-wavelength laser beam is emitted from a laser light source 2, and when it passes through the cylindrical lens group 3, it spreads in a planar manner in the longitudinal direction of the object to be measured 1, and the luminous flux has a thickness larger than the thickness of the object to be measured 1. The laser beam is converted into a laser beam with The laser beam is measured - treasure '1
The light is scattered by the condenser lens 4 and focused on the imaging surface of the television camera 5 as a reduced Fourier pattern. At this time, the laser beam that has passed straight through the periphery of the object to be measured 1 is blocked by the light blocking plate 6.

散乱光による画像のフーリエパターンは映像信号として
画像処理装置8に送信され、モニターテレビ7に送信さ
れる。散乱光による画像のフーリエパターンは被測定物
1の微細な欠陥により乱れ、この乱れを画像認識装置8
により認識し、欠陥を検出する。
The Fourier pattern of the image created by the scattered light is transmitted as a video signal to the image processing device 8 and then to the monitor television 7. The Fourier pattern of the image created by the scattered light is disturbed by minute defects in the object to be measured 1, and this disturbance is recognized by the image recognition device 8.
recognition and detect defects.

以上のように本実施例によれば、遮光板6により直射光
の影響を排除して散乱光のみを検出できるため、高精度
な細線の欠陥検出ができる。また、シリンドリカルレン
ズ群3により被測定物の長手方向に平面状に拡がり厚み
が被測定物の厚みより大である光束をもつレーザー光を
被測定物1に照射でき、集光レンズ4とテレビカメラ5
により散乱光による画像のフーリエパターンを縮小検出
できるため、広範囲な細線の欠陥を一括して検出ができ
る。
As described above, according to this embodiment, since only scattered light can be detected by eliminating the influence of direct light using the light shielding plate 6, it is possible to detect thin wire defects with high precision. In addition, the cylindrical lens group 3 can irradiate the object 1 with a laser beam having a luminous flux that spreads in a plane in the longitudinal direction of the object and has a thickness larger than the thickness of the object. 5
Since the Fourier pattern of the image caused by scattered light can be detected in a reduced size, a wide range of thin line defects can be detected at once.

第2図は本発明の第2の実施例における細線の微細欠陥
検出装置の模式図である。同図において、1は被測定物
である。光源部はレーザー光源2とシリンドリカルレン
ズ群3−a、3−bで構成される。検出部は集光レンズ
4−a、4−bとテレビカメラ5−a、5−bと遮光板
6−a、、6−bで構成される。処理部はモニターテレ
ビ7−a。
FIG. 2 is a schematic diagram of a fine line defect detection device according to a second embodiment of the present invention. In the figure, 1 is an object to be measured. The light source section is composed of a laser light source 2 and cylindrical lens groups 3-a and 3-b. The detection section is composed of condenser lenses 4-a, 4-b, television cameras 5-a, 5-b, and light shielding plates 6-a, 6-b. The processing section is a monitor television 7-a.

7−bと画像認識装置8で構成される。7-b and an image recognition device 8.

以上は第1図の構成と同様なものである。第1図の構成
と異なるのはレーザー光を被測定物に対し2方向から照
射するための、ハーフミラ−9と全反射ミラー10.1
1設けた点である。
The above configuration is similar to the configuration shown in FIG. The difference from the configuration shown in Fig. 1 is that a half mirror 9 and a total reflection mirror 10.1 are used to irradiate the object to be measured with laser light from two directions.
1 point.

上記のように構成された細線の微細欠陥検出装置につい
て、以下その動作を示す。
The operation of the thin wire fine defect detection apparatus configured as described above will be described below.

まず、レーザー光源2から出射された単波長のレーザー
光はハーフミラ−9で2分され、一方はシリンドリカル
レンズ群3−aに、他方は全反射ミラー10.11で光
軸制御された後シリンドリカルレンズ群3−bに照射さ
れる。さらに、照射されたレーザー光はシリンドリカル
レンズ群3−a。
First, a single wavelength laser beam emitted from the laser light source 2 is divided into two by a half mirror 9, one is sent to a cylindrical lens group 3-a, and the other is controlled by a total reflection mirror 10.11, and then the optical axis is controlled by a cylindrical lens. Group 3-b is irradiated. Furthermore, the irradiated laser beam is applied to the cylindrical lens group 3-a.

3−bを透過する際に、被測定物1の長手方向に平面状
に拡がり厚みが被測定物1の厚みより大である光束を有
するレーザー光に変換され、被測定物1に2方向から照
射され、被測定物1により散乱され、集光レンズ4−a
、4−bによりテレビカメラ5−a、5−bの撮像面に
画像のフーリエパターンとしてそれぞれ結像される。こ
のとき、被測定物1を通過した前記レーザー光は遮光板
6−a。
3-b, it is converted into a laser beam having a luminous flux that spreads flat in the longitudinal direction of the object to be measured 1 and has a thickness larger than the thickness of the object to be measured 1, and is transmitted to the object to be measured 1 from two directions. It is irradiated and scattered by the object to be measured 1, and the condensing lens 4-a
, 4-b, the images are formed as Fourier patterns on the imaging surfaces of television cameras 5-a and 5-b, respectively. At this time, the laser beam that has passed through the object to be measured 1 is directed to the light shielding plate 6-a.

6−bで遮光される。The light is blocked by 6-b.

散乱光による画像のフーリエパターンは映像信号として
画像処理装置8に送信され、モニターテレビ7−a、7
−bに送信される。散乱光による画像のフーリエパター
ンは被測定物1の微細な欠陥により乱れ、この乱れを画
像認識装置8によりそれぞれ認識し、2方向から観測し
た細線の欠陥を同時検出する。
The Fourier pattern of the image created by the scattered light is transmitted as a video signal to the image processing device 8, and is then sent to the monitor televisions 7-a, 7-a.
-b is sent. The Fourier pattern of the image created by the scattered light is disturbed by minute defects in the object to be measured 1, and each of these disturbances is recognized by the image recognition device 8, and defects in thin lines observed from two directions are simultaneously detected.

以上のように本実施例によれば、第1の実施例で得られ
る効果に加えて、欠陥検出の死角を縮小でき、より信頼
性の高い細線の欠陥検出ができる。
As described above, according to this embodiment, in addition to the effects obtained in the first embodiment, the blind spot for defect detection can be reduced, and more reliable thin line defect detection can be performed.

なお、第1の実施例において、検出系はテレビカメラと
画像認識装置としたが、検出系は光電子増倍管として光
量の変化を検出してもよい。
In the first embodiment, the detection system is a television camera and an image recognition device, but the detection system may be a photomultiplier tube to detect changes in the amount of light.

また、第2の実施例において、検出系はテレビカメラと
画像認識装置としたが、検出系は光電子増倍管として光
量の変化を検出してもよいことは言うまでもない。
Further, in the second embodiment, the detection system is a television camera and an image recognition device, but it goes without saying that the detection system may be a photomultiplier tube to detect changes in the amount of light.

発明の効果 以上のように第1の発明によれば、被測定物に対し被測
定物の長手方向に平面状に拡がり厚みが被測定物の厚み
より大である光束をもつレーザー光を照射するためのシ
リンドリカルレンズ群ト、被測定物を通過した散乱光以
外のレーザー光を遮光する遮光板と、散乱光による画像
のフーリエパターンの乱れを縮小検出する光学系及び画
像認識装置を設けられているので、広範囲な微細欠陥を
一括して検出がで、き、被測定物全体の検査を高速化で
きる。
Effects of the Invention As described above, according to the first invention, the object to be measured is irradiated with a laser beam having a luminous flux that spreads in a plane in the longitudinal direction of the object and has a thickness larger than the thickness of the object to be measured. It is equipped with a cylindrical lens group, a light-shielding plate that blocks laser light other than the scattered light that has passed through the object to be measured, and an optical system and image recognition device that reduce and detect disturbances in the Fourier pattern of the image caused by the scattered light. Therefore, a wide range of fine defects can be detected at once, and the inspection of the entire object to be measured can be speeded up.

また、第2の発明によれば、被測定物に対し2方向より
前記レーザー光を照射し、それぞれの散乱光による画像
のフーリエパターンを検出する構成のため、第1の発明
で得られる効果に加えて、欠陥検出の死角を縮小でき、
より信頼性の高い優れた細線の微細欠陥検出装置を実現
できるものである。
Further, according to the second invention, since the object to be measured is configured to irradiate the laser beam from two directions and detect the Fourier pattern of the image formed by each scattered light, the effect obtained in the first invention is not improved. In addition, the blind spot for defect detection can be reduced,
This makes it possible to realize a more reliable and superior fine wire defect detection device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の第1の実施例における細線の微細欠陥
検出装置の模式図、第2図は本発明の第2の実施例にお
ける細線の微細欠陥検出装置の模式図、第3図は従来の
細線の微細欠陥検出装置の模式図である。 1・・・・・・被測定物、2・・・・・・レーザー光源
、3・・・・・・シリンドリカルレンズ群、4・・・・
・・集光レンズ、5・・・・・・テレビカメラ、6・・
・・・・遮光板、7・・・・・・モニターテレビ、8・
・・・・・画像認識装置。
FIG. 1 is a schematic diagram of a fine wire defect detection device according to a first embodiment of the present invention, FIG. 2 is a schematic diagram of a thin wire fine defect detection device according to a second embodiment of the present invention, and FIG. FIG. 1 is a schematic diagram of a conventional thin wire micro defect detection device. 1...Object to be measured, 2...Laser light source, 3...Cylindrical lens group, 4...
...Condensing lens, 5...TV camera, 6...
... Light shielding plate, 7 ... Monitor TV, 8.
...Image recognition device.

Claims (2)

【特許請求の範囲】[Claims] (1)被測定物に単波長のレーザー光を照射することに
より形成される画像のフーリエ変換されたパターンをテ
レビカメラにて観測する装置において、被測定物は細線
で、前記被測定物に対し被測定物の長手方向に平面状に
拡がり厚みが被測定物の厚みより大である光束を形成す
るシリンドリカルレンズ群と、前記被測定物を通過した
散乱光以外のレーザー光を遮光する遮光板と、散乱光に
よる画像のフーリエ変換されたパターンの乱れを縮小検
出する光学系及び画像認識装置を備えたことを特徴とす
る細線の微細欠陥検出装置。
(1) In a device that uses a television camera to observe a Fourier-transformed pattern of an image formed by irradiating a single-wavelength laser beam onto an object to be measured, the object to be measured is a thin line. a cylindrical lens group that forms a light beam that spreads in a planar manner in the longitudinal direction of the object to be measured and has a thickness greater than the thickness of the object to be measured; and a light shielding plate that blocks laser light other than the scattered light that has passed through the object to be measured. 1. An apparatus for detecting minute defects in thin wires, characterized by comprising an optical system and an image recognition device for reducing and detecting disturbances in a Fourier-transformed pattern of an image caused by scattered light.
(2)請求項1記載の細線の微細欠陥検出装置において
、被測定物に対し2方向より被測定物の長手方向に平面
状に拡がり厚みが被測定レーザー光を照射する手段と、
それぞれの数乱光による画像のグーリエ変換されたパタ
ーンを検出する手段とを有することを特徴とする細線の
微細欠陥検出装置。
(2) In the thin wire micro defect detection device according to claim 1, means for irradiating the object to be measured with a laser beam whose thickness is measured by spreading in a plane in the longitudinal direction of the object from two directions;
1. An apparatus for detecting minute defects in thin wires, comprising means for detecting a pattern obtained by Gourier transformation of an image caused by each random light beam.
JP1293556A 1989-11-10 1989-11-10 Fine wire fine defect detection device Expired - Lifetime JPH0781963B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1293556A JPH0781963B2 (en) 1989-11-10 1989-11-10 Fine wire fine defect detection device
KR1019900018174A KR940002504B1 (en) 1989-11-10 1990-11-10 Detecting device for extremely small defect of thin wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1293556A JPH0781963B2 (en) 1989-11-10 1989-11-10 Fine wire fine defect detection device

Publications (2)

Publication Number Publication Date
JPH03154854A true JPH03154854A (en) 1991-07-02
JPH0781963B2 JPH0781963B2 (en) 1995-09-06

Family

ID=17796277

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1293556A Expired - Lifetime JPH0781963B2 (en) 1989-11-10 1989-11-10 Fine wire fine defect detection device

Country Status (2)

Country Link
JP (1) JPH0781963B2 (en)
KR (1) KR940002504B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682393A (en) * 1992-01-27 1994-03-22 American Teleph & Telegr Co <Att> Device and method for detecting defect in coating
JPH0682394A (en) * 1992-02-13 1994-03-22 American Teleph & Telegr Co <Att> Device and method for detecting defect in coating

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101288528B1 (en) * 2011-07-25 2013-07-26 디케이아즈텍 주식회사 Inspect Analyzer for detecting defect in cylinder shape crystal

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682393A (en) * 1992-01-27 1994-03-22 American Teleph & Telegr Co <Att> Device and method for detecting defect in coating
JPH0682394A (en) * 1992-02-13 1994-03-22 American Teleph & Telegr Co <Att> Device and method for detecting defect in coating

Also Published As

Publication number Publication date
KR940002504B1 (en) 1994-03-25
KR910010179A (en) 1991-06-29
JPH0781963B2 (en) 1995-09-06

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