JPH0315330B2 - - Google Patents
Info
- Publication number
- JPH0315330B2 JPH0315330B2 JP391984A JP391984A JPH0315330B2 JP H0315330 B2 JPH0315330 B2 JP H0315330B2 JP 391984 A JP391984 A JP 391984A JP 391984 A JP391984 A JP 391984A JP H0315330 B2 JPH0315330 B2 JP H0315330B2
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- lead wire
- recess
- insulating plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000003990 capacitor Substances 0.000 claims description 31
- 229910052782 aluminium Inorganic materials 0.000 claims description 23
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 23
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 20
- 238000005476 soldering Methods 0.000 claims description 20
- 239000011888 foil Substances 0.000 claims description 12
- 238000007789 sealing Methods 0.000 claims description 9
- 239000003792 electrolyte Substances 0.000 claims description 5
- 230000004907 flux Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007743 anodising Methods 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000007872 degassing Methods 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59003919A JPS60148104A (ja) | 1984-01-12 | 1984-01-12 | アルミ電解コンデンサ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59003919A JPS60148104A (ja) | 1984-01-12 | 1984-01-12 | アルミ電解コンデンサ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60148104A JPS60148104A (ja) | 1985-08-05 |
| JPH0315330B2 true JPH0315330B2 (instruction) | 1991-02-28 |
Family
ID=11570560
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59003919A Granted JPS60148104A (ja) | 1984-01-12 | 1984-01-12 | アルミ電解コンデンサ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60148104A (instruction) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62182533U (instruction) * | 1986-05-10 | 1987-11-19 | ||
| JPS6433914A (en) * | 1987-07-29 | 1989-02-03 | Sony Corp | Electronic part |
| JPH01107123U (instruction) * | 1988-01-12 | 1989-07-19 | ||
| JPH0265327U (instruction) * | 1988-11-05 | 1990-05-16 | ||
| JPH0399427U (instruction) * | 1990-01-31 | 1991-10-17 | ||
| JPH0629161A (ja) * | 1993-05-10 | 1994-02-04 | Nippon Chemicon Corp | チップ形電解コンデンサの製造方法 |
-
1984
- 1984-01-12 JP JP59003919A patent/JPS60148104A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60148104A (ja) | 1985-08-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |