JPH03150858A - ボンディング装置のテープ切断装置 - Google Patents
ボンディング装置のテープ切断装置Info
- Publication number
- JPH03150858A JPH03150858A JP1289541A JP28954189A JPH03150858A JP H03150858 A JPH03150858 A JP H03150858A JP 1289541 A JP1289541 A JP 1289541A JP 28954189 A JP28954189 A JP 28954189A JP H03150858 A JPH03150858 A JP H03150858A
- Authority
- JP
- Japan
- Prior art keywords
- bonding
- tape
- cutting
- adhesive
- cut
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1289541A JPH03150858A (ja) | 1989-11-07 | 1989-11-07 | ボンディング装置のテープ切断装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1289541A JPH03150858A (ja) | 1989-11-07 | 1989-11-07 | ボンディング装置のテープ切断装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03150858A true JPH03150858A (ja) | 1991-06-27 |
| JPH0578179B2 JPH0578179B2 (OSRAM) | 1993-10-28 |
Family
ID=17744580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1289541A Granted JPH03150858A (ja) | 1989-11-07 | 1989-11-07 | ボンディング装置のテープ切断装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03150858A (OSRAM) |
-
1989
- 1989-11-07 JP JP1289541A patent/JPH03150858A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0578179B2 (OSRAM) | 1993-10-28 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081028 Year of fee payment: 15 |
|
| LAPS | Cancellation because of no payment of annual fees |