JPH03148148A - Socket for semiconductor inspection device - Google Patents
Socket for semiconductor inspection deviceInfo
- Publication number
- JPH03148148A JPH03148148A JP28626889A JP28626889A JPH03148148A JP H03148148 A JPH03148148 A JP H03148148A JP 28626889 A JP28626889 A JP 28626889A JP 28626889 A JP28626889 A JP 28626889A JP H03148148 A JPH03148148 A JP H03148148A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- lead
- measured
- mold
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims description 5
- 238000007689 inspection Methods 0.000 title claims 2
- 239000000523 sample Substances 0.000 claims abstract description 17
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は半導体装置用のソケットに関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a socket for a semiconductor device.
従来、この種のソケットは、第４図及び第５図に示すよ
うに、ソケット本体１ａのモールドガイド部（Ｘ方向４
１１部４及びＹ方向ガイド部３ａ＞で第３図に示す被測
定物のモールド部５の四隅部分をガイドして位置決めを
行い、被測定物のリード６と、ソケットのコンタクトプ
ローブ２′をずれないように接触させていた。Conventionally, this type of socket has a mold guide portion (X direction 4) of the socket body 1a, as shown in FIGS.
11 section 4 and the Y-direction guide section 3a> guide the four corners of the mold section 5 of the object to be measured shown in FIG. I made sure that there was no contact between them.
上述した従来のソケットは、被測定物のモールド部のぼ
りや、封入工程でのずれ、又リード成形時の切断ずれ等
によりモールド部端面とリードまでの寸法にばらつきが
あり特にその寸法が小さいものはＸ方向ガイド部を小さ
くできない為、Ｘ方向ガイド部にリードが接触すること
がある。その接触した状態で外力が加わると接触してい
るリードが曲る場合があるという欠点がある。The above-mentioned conventional sockets have variations in the dimension between the mold end face and the lead due to the rise of the mold part of the object to be measured, misalignment during the encapsulation process, misalignment of cutting during lead molding, etc., especially those with small dimensions. Since the X-direction guide section cannot be made small, the leads may come into contact with the X-direction guide section. There is a drawback that if an external force is applied while the leads are in contact, the leads in contact may bend.
本発明のソケットは、被測定物のソケット内での位置決
めをリードの無い方向（Ｙ方向）はソケットのモールド
ガイド部でガイドし、リード方向くＸ方向〉はコンタク
トプローブでガイドして行う。In the socket of the present invention, the object to be measured is positioned within the socket by being guided by the mold guide portion of the socket in the direction without leads (Y direction), and by the contact probe in the lead direction (X direction).
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図（ａ）、（ｂ）は本発明の一実施例の平面図及び
Ａ−Ａ’線断面図、第２図は第１図のＢ部詳細図である
。FIGS. 1(a) and 1(b) are a plan view and a sectional view taken along the line AA' of an embodiment of the present invention, and FIG. 2 is a detailed view of section B in FIG. 1.
第３図に示した被測定物のり一ド６とソケットのコンタ
クトプローブ２とのずれを防止する為の位置決めをリー
ドの無い方向（Ｙ方向〉のガイドは、ソケット本体１の
モールドガイド部３で被測定物のモールド部５をガイド
し、リード方向のモールドガイド部３で被測定物のモー
ルド部５をガイドし、リード方向（Ｘ方向〉のガイドは
コンタクトプローブ２でリード６をガイドして行う。The mold guide portion 3 of the socket body 1 is used as a guide in the direction without leads (Y direction) to prevent misalignment between the glue 6 of the object to be measured and the contact probe 2 of the socket shown in FIG. Guide the mold part 5 of the object to be measured, guide the mold part 5 of the object to be measured with the mold guide part 3 in the lead direction, and guide the lead 6 in the lead direction (X direction) with the contact probe 2. .
コンタクトプローブ３は、先端を曲げた形状として、被
測定物のリード２がモールドガイド部３とコンタクトプ
ローブ２のすきま及びコンタクトプローブ２の間への落
ち込みを防止し装着し易くしている。The contact probe 3 has a bent tip to prevent the lead 2 of the object to be measured from falling into the gap between the mold guide portion 3 and the contact probe 2 and between the contact probes 2, thereby making it easier to mount the contact probe 3.
以上説明したように、本発明は、被測定物の位置決めを
コンタクトプローブで行うことにより被測定物のリード
がコンタクトプローブ以外に接触しないソケット形状と
することにより、リード曲りを防止しコンタクトプロー
ブについても先端を曲げた形状にすることによりソケッ
ト本体のモールドガイド部とコンタクトプローブの間、
及びコンタクトプローブ間へのリードの落ち込みを防ぎ
被測定物の装着９位置決めが容易に行えるという効果が
ある。As explained above, the present invention uses a contact probe to position the object to be measured, thereby creating a socket shape in which the leads of the object to be measured do not come into contact with anything other than the contact probe. By making the tip curved, it will fit between the mold guide part of the socket body and the contact probe.
This also has the effect of preventing the lead from falling between the contact probes and facilitating the mounting 9 positioning of the object to be measured.
第１図は本発明のソケットの平面図及びＡＡ′線断面図
、第２図は第１図のＢ部詳細図、第３図は被測定物の平
面図及び正面図、第４図は従来のソケットの平面図及び
Ｃ−Ｃ’ 線断面図、第５図は第４図のＤ部詳細図であ
る。
１．１ａ・・・ソケット本体、２，２ａ・・・コンタク
トプローブ、３，３ａ・・・モールドガイド部、４・・
・モールドガイド部（Ｘ方向ガイド部）、５・・・モー
ルド部、
６・・・リード。
＝５
Ｓ
換
餡
乙
９１７Fig. 1 is a plan view and a sectional view taken along line AA' of the socket of the present invention, Fig. 2 is a detailed view of part B in Fig. 1, Fig. 3 is a plan view and front view of the object to be measured, and Fig. 4 is a conventional one. 5 is a plan view and a sectional view taken along the line CC' of the socket, and FIG. 5 is a detailed view of section D in FIG. 4. 1.1a...Socket body, 2,2a...Contact probe, 3,3a...Mold guide part, 4...
- Mold guide part (X direction guide part), 5...Mold part, 6...Lead. =5 S Kanan Otsu917
Claims (1)
ソケットにおいて、被測定物の装着を容易に行えかつ、
コンタクトプローブ間にリードが落ち込み難い様にリー
ドとの接触部を広くした形状のコンタクトプローブを有
する半導体検査装置用のソケット。In a socket for a semiconductor testing device that measures the electrical characteristics of a semiconductor device, the object to be measured can be easily attached, and
A socket for semiconductor inspection equipment that has a contact probe with a wider contact area with the leads so that the leads are less likely to fall between the contact probes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28626889A JPH03148148A (en) | 1989-11-02 | 1989-11-02 | Socket for semiconductor inspection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28626889A JPH03148148A (en) | 1989-11-02 | 1989-11-02 | Socket for semiconductor inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03148148A true JPH03148148A (en) | 1991-06-24 |
Family
ID=17702164
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28626889A Pending JPH03148148A (en) | 1989-11-02 | 1989-11-02 | Socket for semiconductor inspection device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03148148A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5634267A (en) * | 1991-06-04 | 1997-06-03 | Micron Technology, Inc. | Method and apparatus for manufacturing known good semiconductor die |
-
1989
- 1989-11-02 JP JP28626889A patent/JPH03148148A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5634267A (en) * | 1991-06-04 | 1997-06-03 | Micron Technology, Inc. | Method and apparatus for manufacturing known good semiconductor die |
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