JPH08172140A - Semiconductor device, lead frame, used for it, and its carrying and measuring methods - Google Patents

Abstract

PURPOSE: To provide a semiconductor device for accurate alignment and retention and a lead used for it, and its carrying and measuring methods. CONSTITUTION: In a semiconductor device 1, a hole 5 for positioning in reference to the position of a lead 3 is provided at an extension part 4 being extended from the side part of a package 2, a dam bar 13 for connecting approximately the middle of a plurality of leads 3 is provided at the extension part 4 as a lead frame 11 used for it, and the hole 5 for positioning is provided there. Also, a retention mechanism is inserted toward the hole 5 for positioning from a direction which is nearly vertical to the surface of the package 2 and is opened to perform alignment and retention for carrying and then is arranged on a substrate for measurement in this state for accurately causing the measuring probe to contact the leads 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device having a plurality of leads extending from a package for encapsulating a semiconductor element, a lead frame used for the same, a method of carrying the same, and a method of measuring the same.

[0002]

2. Description of the Related Art In a semiconductor device, a chip-shaped semiconductor element is mounted on a metal lead frame made of 42 alloy (iron-nickel 42% alloy) material or the like, and the inner lead portion of the semiconductor element and the lead frame is bonded by a bonding wire. The semiconductor element and the bonding wire are sealed with a package such as a mold resin in the state where the wirings are wired. Further, the semiconductor device sealed by the package is housed and arranged in a container such as a tray after cutting and shaping the outer lead portion extending from the peripheral edge of the package.

When measuring the characteristics of this semiconductor device or mounting it on a substrate as a component, the target semiconductor device is taken out from a storage container such as a tray using a predetermined transport mechanism, and then the target semiconductor device is used. Transporting to the position.
FIG. 11 is a diagram illustrating an example of a carrying mechanism and a positioning mechanism in a conventional semiconductor device. In the suction type shown in FIG. 11A, the surface of the package 2 in the semiconductor device 1 ′ is suction-held by the suction nozzle 70, and the semiconductor device 1 ′ is taken out from a storage container made of, for example, a tray, and a measuring device, a substrate, etc. not shown Is transported to the target position.

The abutting type shown in FIG. 11 (b) is disclosed in Japanese Unexamined Patent Publication No. 6-252291, in which a package 2 of a semiconductor device 1 '' is provided with a positioning portion such as a notch portion 21. It is provided with the tip 7 of the guide claw 71.
The semiconductor device 1 ″ is aligned by abutting 1a. When the semiconductor device 1 ″ is conveyed, a suction nozzle 70 as shown in FIG. 11A is used.

[0005]

However, in a transport mechanism using such a suction nozzle, it is necessary to suck air in order to suck and hold the semiconductor device. Therefore, for example, a measuring device for measuring the temperature characteristic of the semiconductor device. In the case of (1), a temperature drop is caused in the region from the package surface, which is the adsorption part, to the semiconductor element inside the package part, which causes a decrease in measurement reliability. Therefore, it may be possible to perform suction only during transportation and not suction during measurement, but if it is necessary to perform measurement with the front and back surfaces of the package substantially vertical, the semiconductor device cannot be held. There is an inconvenience that

Further, when the mechanism for abutting the guide claws on the package for alignment is applied to the measuring device, the temperature drop of the package or the like due to the suction as described above does not occur, but for the alignment. It is necessary to place the guide claws on the side of the package, so that the guide claws do not come into contact with other parts when aligning the socket of the measuring device (to obtain electrical contact with the semiconductor device. Space must be secured around the (thing). Moreover, if the package is sandwiched by the two guide claws from the outside, the package is distorted, and lead pitch deviation and floating occur, which causes poor contact with the gauge of the socket. This is a problem that becomes more prominent as the lead pitch becomes finer.

[0007]

SUMMARY OF THE INVENTION The present invention is a semiconductor device, a lead frame used for the same, a method of carrying the same, and a method of measuring the same, which are made to solve the above problems. That is, the semiconductor device of the present invention includes a package that covers the periphery of a chip-shaped semiconductor element, and a plurality of leads that are electrically connected to the semiconductor element and extend from the package, and are different from the package. It is provided with an extending portion which is provided and extends from a side portion of the package, and a positioning hole which is provided in the extending portion with reference to the position of the lead.

Further, the lead frame of the present invention connects the arrangement portion for arranging the semiconductor element, the plurality of leads extending outward from the periphery of the arrangement portion, and the middle of the plurality of leads. The dam bar is provided with an extending portion that extends outward from a position that is a side portion of the package from the dam bar, and a positioning hole that is provided in the extending portion with the position of the lead as a reference.

The semiconductor device carrying method of the present invention is
First, in a state in which the semiconductor device is mounted, the holding mechanism that can be opened and closed along the inner diameter direction of the positioning hole is inserted into the positioning hole from a direction substantially perpendicular to the package surface of the semiconductor device, Then, the holding mechanism is opened along the inner diameter direction of the positioning hole to align the holding mechanism with the positioning hole and hold the semiconductor device,
In this state, the semiconductor device is transported by moving the holding mechanism to a predetermined position.

Further, in the method for measuring a semiconductor device according to the present invention, first, a holding mechanism which can be opened and closed in a positioning hole from a direction substantially perpendicular to a package surface of the semiconductor device along an inner diameter direction of the positioning hole. Is inserted and the holding mechanism is opened along the inner diameter direction of the positioning hole to align the holding mechanism with the positioning hole and hold the semiconductor device, and then the holding mechanism is moved to move the semiconductor device. The probe mounted on the measurement base is placed in contact with the lead extending from the package of the semiconductor device, and in this state, the electrical signal to the semiconductor element is passed through the probe and the lead. The input / output is performed to perform a predetermined measurement.

[0011]

The semiconductor device of the present invention is provided with an extending portion extending from the side portion of the package which is different from the package for covering the periphery of the semiconductor element, and the extending portion is based on the position of the lead. The positioning hole is provided. Accordingly, when the semiconductor device is mounted on the measuring device, the substrate, or the like, the position of the lead can be accurately aligned with the object by using the positioning hole as a reference. Also,
The lead frame used for the semiconductor device of the present invention is provided with an extending portion extending from a dam bar connecting the middle of a plurality of leads, and the extending portion is provided with a positioning hole based on the position of the lead. Therefore, the relative position between the positioning hole and the lead can be accurately set.

Further, in the method of transporting a semiconductor device of the present invention, the holding mechanism is inserted into the positioning hole from a direction substantially perpendicular to the package surface, and the holding mechanism is inserted in the positioning hole along the inner diameter direction. When opened, the holding mechanism is fitted into the positioning hole. As a result, the holding mechanism and the positioning hole can be aligned without affecting the lateral space of the package, and the semiconductor device can be held at the same time, so that the semiconductor device can be accurately conveyed to a predetermined position. Become.

According to the semiconductor device measuring method of the present invention, the holding mechanism is inserted into the positioning hole from a direction substantially perpendicular to the package surface, and the holding mechanism is opened to align the holding mechanism with the positioning hole. Then, the semiconductor device is held, and in this state, the holding mechanism is arranged on the measurement base. That is, the relative position between the lead of the semiconductor device and the holding mechanism is accurately set without affecting the lateral space of the package by aligning the holding mechanism with the positioning hole, and in this state, the semiconductor device is set to the measurement base. By arranging the probe on the table, the probe and the lead can be brought into proper contact with each other.

[0014]

Embodiments of the semiconductor device of the present invention, a lead frame used for the same, a method of carrying the same and a method of measuring the same will be described below with reference to the drawings. FIG. 1 is a plan view illustrating the present invention, where (a) is a semiconductor device and (b) is a semiconductor device.
Indicates a lead frame. As shown in FIG. 1A, a semiconductor device 1 according to the present invention includes a package 2 made of, for example, a molding resin, and a plurality of leads 3 extend from four side portions of the package 2 in a QFP (Qua).
d Flat Package) type or DIP (Dua) in which a plurality of leads 3 extend from two substantially parallel side portions.
Inline Package) type and the like.

In the following description, the semiconductor device 1 mainly of QFP type will be described as an example. The semiconductor device 1 mainly includes a package 2 for encapsulating a chip-shaped semiconductor element 10, and a plurality of leads 3 electrically connected to the semiconductor element 10 and extending from a side portion of the package 2. In addition, an extension portion 4 provided separately from the package 2 and extending from the side portion of the package 2, and a positioning hole 5 provided in the extension portion 4 with the position of the lead 3 as a reference. It is configured with.

The extending portion 4 extends from two corners of the package 2 which are, for example, substantially quadrangular in a plan view and are diagonally opposite to each other. The positioning holes 5 provided in these portions are used to align the semiconductor device 1 with each other. And will come to hold. That is, by inserting a holding mechanism, which will be described later, into the positioning hole 5 and opening the holding mechanism along the inner diameter direction of the positioning hole 5, the semiconductor device 1 is aligned and held at the same time. By inserting the holding mechanism into the positioning hole 5 of the semiconductor device 1 and aligning and holding the semiconductor device 1, the subsequent processing without affecting the outer space of the package 2, for example, the semiconductor device is performed. 1 can be transported, measured, mounted, and the like.

Next, the lead frame 11 used for manufacturing the semiconductor device 1 will be described with reference to FIG. The lead frame 11 shown in FIG. 1B shows a case of a single body corresponding to one semiconductor device. However, when it corresponds to a plurality of semiconductor devices, a continuous long frame is formed. It suffices to configure a shape. The lead frame 11 is mainly an island 12 that is a placement portion for mounting the chip-shaped semiconductor element 10, a plurality of leads 3 extending outward from the periphery of the island 12, and the leads 3 of these leads 3. Dam bar 13 connecting the middle
And the extending portion 4 extending outward from the position (see the broken line in the figure) which is a side portion of the package 2 from the dam bar 13.
And a positioning hole 5 provided in the extending portion 4 with the position of the lead 3 as a reference.

Although FIG. 1B shows an example in which the island 12 is provided as the arrangement portion of the semiconductor element 10, the island 12 does not exist and only the region for arranging the semiconductor element 10 is provided in the arrangement portion. There is also a lead frame provided as. The lead frame 11 shown in FIG. 1B includes an island 12 as an arrangement portion, and a suspension lead 14 for connecting the island 12 to the dam bar 13.
It has. The suspension leads 14 are provided so as to extend obliquely outward from the corners of the island 12 having a substantially rectangular shape, for example.

FIG. 2 is a diagram for explaining a method of manufacturing a semiconductor device using this lead frame 11. First, FIG.
As the die bonding and wire bonding steps shown in (a),
The chip-shaped semiconductor element 10 is mounted on the island 12 of the lead frame 11 using a conductive paste material or the like (die bonding), and then the electrode pad (not shown) of the semiconductor element 10 and the lead 3 of the lead frame 11 are connected. Is wired by the bonding wire 15 (wire bond).

Next, as a molding step shown in FIG. 2B, the lead frame 11 on which the semiconductor element 10 is mounted is mounted.
Is sandwiched between molds including an upper mold 20 and a lower mold 30, and the semiconductor element 10, the bonding wire 15 and the like are arranged in the cavity 40. In this state, the cavity 40
A mold resin (not shown) made of epoxy resin or the like is transferred and filled therein, and the semiconductor element 10, the bonding wires 15 and the like are integrally sealed with the mold resin.

After that, the lead 3 and the dam bar 13 (see FIG.
The individual semiconductor devices are completed by cutting (see (a)) and shaping the leads 3. Even if the dam bar 13 is cut, at this stage, the leads 3 and a part of the extending portion 4 are already embedded in the mold resin. Hole 5 and lead 3
The relative positional relationship with will be maintained.

In particular, as shown in FIG. 2 (a), the extending portion 4
By providing the hole 16 at the root portion of the mold, a molding resin (not shown) transferred and filled into the cavity 40 (see FIG. 2B) in the molding process enters into the hole 16 and has an anchor effect. Like Therefore, even if the dam bar 13 is cut in a later step, the extending portion 4 does not fall out of the mold resin.

FIG. 3 is a perspective view showing the appearance of the semiconductor device after molding. For example, in the semiconductor device 1 of the QFP type shown in FIG. 3A, a plurality of leads 3 extend from the four sides of the package 2 (in the figure, only the leads 3 extending from two directions are shown. ), The extension 4 extends from two diagonal corners of the package 2. Further, each extending portion 4 is provided with the positioning hole 5 described above. By inserting a holding mechanism, which will be described later, into these positioning holes 5 and opening it along the diagonal direction of the package 2, the semiconductor device 1 can be aligned and held.

In the semiconductor device 1 of the DIP type shown in FIG. 3B, a plurality of leads 3 extend from two sides of the package 2, and the other two sides where the leads 3 do not extend. The extension part 4 extends from. Positioning holes 5 are also provided in the extending portions 4, respectively. In the semiconductor device 1 of the DIP type, a semiconductor device 1 can be aligned and held by inserting a holding mechanism described later into the positioning hole 5 and opening the holding mechanism along the longitudinal direction of the package 2. Like

Next, a method of carrying such a semiconductor device 1 will be described. FIG. 4 is a schematic perspective view for explaining the alignment accompanying the transportation of the semiconductor device. The semiconductor device 1 of QFP type will be described as an example. In order to align the semiconductor device 1, first, the holding mechanism 50 is inserted from a direction substantially perpendicular to the surface of the package 2 toward the positioning hole 5 provided in the extending portion 4. The holding mechanism 50 is provided so as to be openable and closable along the inner diameter direction of the positioning hole 5, and by opening the holding mechanism 50 after the insertion, the positioning with the positioning hole 5 and the holding of the semiconductor device 1 can be performed at the same time. You can do it.

As for the opening / closing operation of the holding mechanism 50, as shown by the arrow in the figure, the two holding mechanisms are opened and closed along the inner diameter direction of the positioning hole 5, and as shown by the arrow in the figure, each holding mechanism is held. There are two types, one that opens and closes along the inner diameter direction inside each positioning hole 5 of the mechanism 50. Hereinafter, the state of alignment and holding of the semiconductor device 1 will be described for each opening / closing operation of the holding mechanism 50.

FIG. 5 is a schematic view (No. 1) for explaining the alignment by (1), and the portions of the extending portions 4 and the positioning holes 5 provided at two diagonal corners of the package 2 are enlarged. Is shown. Further, the holding mechanism 50 shown in FIG. 4 is shown in a sectional view in a state of being inserted into the positioning hole 5 in FIG. That is, the positioning hole 5 provided in the extending portion 4 has a circular shape in plan view,
The holding mechanism 50 also has a circular cross-sectional view corresponding to this.

In this example, with the semiconductor device 1 mounted on a tray or the like, first, the holding mechanisms 50 are inserted into the positioning holes 5 provided at the two corners of the package 2. Then, the distance between the two holding mechanisms 50 is set to open outward along the direction indicated by the alternate long and short dash line in the figure, that is, along the diagonal direction of the package 2 (see arrow A in the figure). As a result, the holding mechanism 50 and the positioning hole 5 are aligned, and the semiconductor device 1 is held by the holding mechanism 50. That is, the semiconductor device 1 can be aligned and held at the same time. By raising the holding mechanism 50 in this state, the semiconductor device 1 can be pulled up from the mounting position and can be transported to a predetermined position. When removing the semiconductor device 1, the gap between the two holding mechanisms 50 may be closed.

Further, FIG. 6 is a schematic view (No. 2) for explaining the alignment by. In this example, the positioning hole 5 has a substantially square shape in plan view, and the holding mechanism 50 is provided.
Has a triangular shape, for example, in cross section, which has a corner that fits the corner of the positioning hole 5. In order to hold the semiconductor device 1, as in the previous example, the two holding mechanisms 50 are inserted into the respective positioning holes 5, and then the distance between the two holding mechanisms 50 is changed in the direction indicated by the alternate long and short dash line in the figure. So that it opens outward (see arrow B in the figure). As a result, the corners of the holding mechanism 50 are aligned with the outer corners of the positioning hole 5, the semiconductor device 1 is aligned, and at the same time, the semiconductor device 1 can be held. Further, when the semiconductor device 1 is removed, the gap between the two holding mechanisms 50 may be closed as in the previous case.

Next, the alignment according to FIGS. 7 and 8 will be described. The positioning is performed by opening the holding mechanism 50 in the positioning hole 5 in the inner diameter direction thereof. FIG. 7 is a schematic sectional view for explaining the alignment by. The holding mechanism 50 used for this alignment has a structure in which an opening / closing part 52 is arranged around the taper rod 51, and the opening / closing part 52 is opened / closed according to the vertical movement of the taper rod 51. There is.

In order to perform the alignment using the holding mechanism 50, first, as an insertion step shown in FIG.
The holding mechanism 50 is inserted into the positioning hole 5 provided in the extending portion 4 with the opening / closing portion 52 closed. When the opening / closing part 52 is closed, the outer diameter of the entire holding mechanism 50 is the positioning hole 5
The inner diameter is smaller than the inner diameter, and it can be easily inserted.

Next, as a holding step shown in FIG. 7 (b), the tapered rod 51 of the holding mechanism 50 is pulled up so that the tapered portion abuts against the opening / closing portion 52 and pushes it outward. As a result, the opening / closing portion 52 opens in the direction indicated by the arrow D in the figure, and the holding mechanism 50 as a whole fits into the positioning hole 5. For example, when the positioning holes 5 are provided at two corners of the package 2 of the semiconductor device 1 as shown in FIG.
7, holding mechanisms 50 each having a mechanism as shown in FIG.
Are fitted into the positioning holes 5. As a result, the semiconductor device 1 is aligned with the position of the holding mechanism 50 as a reference, and the semiconductor device 1 is held by the holding mechanism 50. In addition, the semiconductor device 1
When removing, the taper bar 51 of the holding mechanism 50 may be pushed down to close the opening / closing part 52.

FIG. 8 is a plan view for explaining the type of holding mechanism 50 having such an opening / closing mechanism. In the example shown in FIG. 8A, the positioning hole 5 is provided in a substantially circular shape in a plan view, and correspondingly, three holes are provided around the tapered rod 51 so that the holding mechanism 50 has a substantially circular sectional shape. One opening / closing part 52
a to 52c are arranged. Each opening / closing part 52a to 52c
The outer surface of is a curved surface conforming to the shape of the positioning hole 5, and when it is opened in the direction shown by the arrow E in the drawing by pulling up the taper rod 51, it can accurately contact the positioning hole 5. There is. With such a holding mechanism 50, the semiconductor device 1 (see FIG. 4) can be accurately aligned and held.

Further, in the example shown in FIG. 8B, the positioning hole 5 has a substantially quadrangular shape in a plan view, and the holding mechanism 50 has a substantially quadrangular sectional shape corresponding to this. Around the taper rod 51, two opening / closing portions 52d, 5
2e is arranged, and the outer surface of each opening / closing part 52d, 52e is formed in a planar shape corresponding to the side of the positioning hole 5.

By pulling up the taper rod 51 of the holding mechanism 50, the two opening / closing portions 52d and 52e open in the direction shown by the arrow F in the figure, and are brought into a state of surface contact with the positioning hole 5. By this surface contact, the positioning hole 5 is aligned with the outer surfaces of the opening / closing portions 52d and 52e of the holding mechanism 50. By using such a holding mechanism 50, the semiconductor device 1 (see FIG. 4) can be more accurately aligned. 7 and 8
In the holding mechanism 50 as shown in (a) and (b),
Both the operation of inserting the holding mechanism 50 into the positioning hole 5 and the operation of the taper rod 51 for opening / closing the opening / closing portion 52 can be performed in one direction (a direction substantially perpendicular to the positioning hole 5), so that the mechanism is simplified. It becomes possible to do.

Whichever of the holding mechanisms 50 shown in FIGS. 5 to 8 is used, when the semiconductor device 1 is held, the holding mechanism 50 is substantially perpendicular to the surface of the package 2. Since it is inserted into the positioning hole 5 from the direction and the positioning and the holding are performed by a predetermined opening operation, the holding can be performed without affecting the outer space of the package 2.

In particular, when the semiconductor device 1 is placed in a storage container such as a tray, a member for partitioning the adjacent semiconductor device 1 is provided so as to surround the outside of the package 2. However, by using such a holding mechanism 50, the semiconductor device 1 can be taken out without being affected by the partition member. In addition, such a positioning hole 5
In the above, since it is provided inside the extension part 4 and its shape is simple, even if the holding mechanism 50 abuts many times, deformation due to the contact does not easily occur, and the semiconductor device provided with the alignment member. There is also an advantage that the durability of 1 and the stability of alignment accuracy can be secured for a long period of time.

Next, a measuring method of the semiconductor device 1 according to the present invention will be described. This measuring method is characterized in that the semiconductor device 1 is mounted on the measuring device and the predetermined measurement is performed by using the transportation accompanied by the positioning and holding of the semiconductor device 1 described above. That is, the semiconductor device 1 placed in a storage container such as a tray is taken out by the holding mechanism 50 (see FIG. 4) described above, conveyed to the socket of the measuring device, and the measurement is performed here. I have to.

FIG. 9 is a front view for explaining this measuring method. The semiconductor device 1 is held by, for example, two holding mechanisms 50, and is transported to the position of the measurement base 61 in the socket 60. Note that the example shown in FIG. 9 shows a case where the front and back surfaces of the package 2 of the semiconductor device 1 are substantially vertical to obtain a contact. As described above, when the semiconductor device 1 is held by the holding mechanism 50, the holding mechanism 50 and the positioning holes 5 (see FIGS. 4 to 8) are also aligned at the same time. The positioning hole 5 is provided with the position of the lead 3 as a reference. Therefore, when the semiconductor device 1 is held by the holding mechanism 50, the relative position between the holding mechanism 50 and the lead 3 is also accurately determined.

Therefore, by accurately controlling the position of the holding mechanism 50, the probe 62 provided on the measurement base 61 and the lead 3 of the semiconductor device 1 can be accurately brought into contact with each other. To perform the measurement, the holding mechanism 50 slightly presses the semiconductor device 1 in the direction of arrow G in the drawing, and the lead 3
And surely contact the probe 62. In this state, from the measuring device to the semiconductor device 1 via the probe 62 and the lead 3.
A predetermined electric signal is sent to the semiconductor device 1 to operate it, and its output signal is transmitted to the measuring device through the lead 3 and the probe 62. The measuring device obtains an output signal from the semiconductor device 1 and measures a predetermined electrical characteristic.

Further, the holding mechanism 5 as shown in FIGS.
When 0 is used, the holding mechanism 50 is inserted into the positioning hole 5 provided in the package 2 of the semiconductor device 1, and the holding mechanism 50 is opened along the inner diameter direction of the positioning hole 5 to position the semiconductor device 1. Since the alignment and the holding are performed, an external force for sandwiching the semiconductor device 1 from the outside toward the inside is not applied at this time. That is, in the holding operation, no distortion is generated in the semiconductor device 1, and the pitch shift in the plurality of leads 3 and the leads 3 are caused.
Will not occur.

Since such inconvenience does not occur,
It is possible to obtain accurate contact between the leads 3 and the probe 62. This is very important for accurately measuring the operation of the semiconductor device 1. In addition, the semiconductor device 1 is held with the front and back surfaces of the package 2 in a substantially vertical direction so that dust (solder scraps or the like peeled off from the lead 3 due to contact between the lead 3 and the probe 62) does not accumulate on the measurement base 61. Even if it is necessary, since it can be held without using a suction nozzle or the like, it is possible to stabilize the temperature conditions and the like given to the package 2 and the internal semiconductor element when measuring the temperature characteristics in this state. Become.

FIG. 10 is a diagram for explaining another example of the present invention. FIG. 10A is a plan view showing another example of the lead frame 11, and shows an example in which three extending portions 4 and three positioning holes 5 are provided. That is, the extending portion 4 is provided at the tip of the suspension lead 14 that obliquely extends from the three corners of the island 12 that is provided in a substantially square shape. The remaining one corner where the suspension lead 14 is not provided is used when the cavity 40 is filled with a mold resin (not shown) in the molding process using the mold shown in FIG. 2B. Used to secure the injection channel.

By using such a lead frame 11, the package 2 can be used in the semiconductor device 1 (see FIG. 1).
Three extension parts 4 will extend from the sides of the. By providing the three extending portions 4 and the positioning holes 5, the semiconductor device 1 can be held more stably than in the case of two. The numbers of the extending portions 4 and the positioning holes 5 are not limited to two or three, and the numbers may be provided as needed.

Further, FIG. 10 (b) shows an example in which the shape of the tip of the extending portion 4 is a curved line in plan view. That is, by making the shape of the tip of the extending portion 4 a curved line in plan view,
It is possible to prevent the extension section 4 from being injured when a person holds the semiconductor device 1. In order to obtain such a shape, for example, when the lead frame 11 is manufactured, the tip of the extending portion 4 may be chamfered and shaped so as to form a curved line in plan view.

In the present embodiment, the package type of the semiconductor device 1 has been described with reference to the case of QFP and DIP. However, the present invention is not limited to this, and the case of other types such as SOP and SOJ. Is the same. Further, the present invention is not limited to these mold-sealing types, and the same applies to a type formed of a hollow package using ceramics or the like. Also, an example has been described in which the semiconductor device 1 is transported by the transport method according to the present embodiment, and then the measurement is performed by an electrical measuring device. However, using this transport method, an IC handler, an IC lead inspection machine, or an IC board mounting machine is used. The same merit can be obtained by carrying it to another device such as a marking machine and performing alignment.

[0047]

As described above, the present invention has the following effects. That is, in the semiconductor device of the present invention, since the extension portion extending from the side portion of the package is provided with the positioning hole with the lead as a reference, accurate positioning can be performed using this hole. Becomes Further, by using the lead frame of the present invention, it becomes possible to easily manufacture a semiconductor device having such an extending portion and a positioning hole. Further, in the method of transporting a semiconductor device according to the present invention, the holding mechanism is inserted from a direction substantially perpendicular to the package surface of the semiconductor device toward the positioning hole and opened to perform the positioning and holding of the semiconductor device. Can be done at the same time. Therefore, it is possible to carry without affecting the outer space of the package.

Further, according to the semiconductor device measuring method of the present invention, it is possible to perform the measurement in the state where the semiconductor device is accurately aligned by the holding mechanism, and the measuring device of the measuring device and the lead of the semiconductor device are measured. It is possible to make accurate contact. Moreover, since the semiconductor device can be held without using a suction nozzle or the like, stable measurement can be performed even when measuring temperature characteristics. These can improve the reliability of measurement.

[Brief description of drawings]

FIG. 1 is a plan view illustrating the present invention, in which (a) shows a semiconductor device and (b) shows a lead frame.

FIG. 2 is a diagram illustrating a method for manufacturing a semiconductor device, in which FIG.
Shows a die-bonding and wire-bonding step, and (b) shows a molding step.

FIG. 3 is an external perspective view of a semiconductor device after molding,
(A) is a QFP type, (b) is a DIP type.

FIG. 4 is a schematic perspective view illustrating alignment.

FIG. 5 is a schematic view (No. 1) for explaining the alignment by FIG.

FIG. 6 is a schematic view (No. 2) for explaining the alignment by FIG.

FIG. 7 is a schematic cross-sectional view for explaining the alignment by
(A) shows an insertion step and (b) shows a holding step.

FIG. 8 is a plan view illustrating types of holding mechanisms.

FIG. 9 is a front view illustrating a method for measuring a semiconductor device.

10A and 10B are diagrams illustrating another example, FIG. 10A shows an example in which three positioning holes are provided, and FIG. 10B shows an example in which the tip shape of the extending portion is different.

11A and 11B are diagrams illustrating a conventional example, in which FIG. 11A shows a suction type and FIG. 11B shows a butting type.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor device 2 Package 3 Lead 4 Extension part 5 Positioning hole 11 Lead frame 50 Holding mechanism 51 Tapered rod 52 Opening / closing part

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Office reference number FI technical display location H01L 21/68 N 23/04 E

Claims (4)

[Claims] 1. A semiconductor device comprising: a package covering a periphery of a chip-shaped semiconductor element; and a plurality of leads electrically connected to the semiconductor element and extending from the package, the semiconductor apparatus being different from the package. 2. A semiconductor device, comprising: an extension portion provided in the side portion of the package and extending; and a positioning hole provided in the extension portion based on the position of the lead. 2. The lead frame used for manufacturing the semiconductor device according to claim 1, wherein an arrangement portion for arranging the semiconductor element, and a plurality of lead portions extending outward from a periphery of the arrangement portion. A lead; a dam bar connecting the middle of the plurality of leads; an extending portion extending outward from a position that is a side part of the package from the dam bar; and the extending based on the position of the lead. A lead frame, comprising: a positioning hole provided at the projecting portion. 3. A method of transporting a semiconductor device, comprising: a package that covers the periphery of a chip-shaped semiconductor element; and a positioning hole that extends from the package. First, the semiconductor device is placed. In this state, a holding mechanism that is openable and closable along the inner diameter direction of the positioning hole is inserted into the positioning hole from a direction substantially perpendicular to the package surface of the semiconductor device, By opening along the inner diameter direction, the holding mechanism is aligned with the positioning hole and the semiconductor device is held, and in this state, the holding mechanism is moved to a predetermined position to carry the semiconductor device. A method of transporting a semiconductor device, comprising: 4. A method for measuring a semiconductor device, comprising: a package that covers the periphery of a chip-shaped semiconductor element; and a positioning hole that extends from the package. A holding mechanism that can be opened and closed along the inner diameter direction of the positioning hole is inserted into the positioning hole from a substantially vertical direction, and the holding mechanism and the positioning mechanism are opened by opening the holding mechanism along the inner diameter direction. The semiconductor device is arranged on the measurement base by moving the holding mechanism and the semiconductor device is held, and the probe attached to the measurement base. The leads extending from the package of the semiconductor device are brought into contact with each other, and in this state, electric signals are input / output to / from the semiconductor element through the probe and the leads to perform a predetermined measurement. A method for measuring a semiconductor device, comprising: