JPH0538791U - IC contactor - Google Patents

Abstract

(57) [Summary] [Purpose] The IC is designed so that the lead bending does not occur.
Positioned with respect to the socket, each lead can be brought into contact with a terminal such as a pin of the IC socket. A positioning means for positioning the IC with respect to the IC socket by receiving the body thereof, and a suction means for sucking the body of the IC positioned by the positioning means are provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to an IC contactor, and more particularly to an IC contactor for electrically connecting an IC to an IC socket.

[0002]

[Prior Art]

 In order to measure the electrical characteristics of the IC, the leads of the IC and the terminals of the measuring instrument must be electrically connected. There are sockets, probes, and probe pins as relaying means for connecting between the leads of the IC and the terminals of the measuring device. However, in terms of reliability of measurement data, life, price, etc. The socket is the best.

FIGS. 5A and 5B show an example of a conventional example of such an IC socket. FIG. 5A is a perspective view and FIG. 5B is an enlarged sectional view showing a lead guide portion. This socket is for QFPIC and is made of resin such as polypropylene. It has holes in the socket body a corresponding to the leads of the resin mold IC, and the conductive pin b with spring property is inserted into each hole. It has a structure. Further, a recess c is provided in the roller, which corresponds to the body of the IC to be positioned substantially in the center of the socket body a, and a movable receiver d for receiving the body of the IC urges the recess c to improve this. It is provided via a spring that does not appear in the drawing. e, e, e, e are lead guides provided at the four corners of the movable receiver d, f, f, f, f are lead guides provided in the socket body a, and the lead guides f, f, f , F are fixed in position, while e, e, e, e are movable with respect to the socket body a together with the movable receiver d.

[0004] g is a contact lid for contacting the IC lead with the pins b, b, ... Of the socket body a, h is a hook, and i, i, i, i are the IC leads with the pin b of the socket body a. , B, ... A lead retainer that retains the lead so as to contact it. When measuring with such an IC socket, if the body of the IC is positioned above the movable receiver d and dropped, the leads of the QFP type IC will naturally lead to the lead guides e, e, e, e and the leads. The body is positioned by being guided by the guides f, f, f, f, the body is positioned on the movable receiver d, and the lead of the IC is positioned on the corresponding pin b. Next, when the lid g is closed, the lead retainers i, i, i, i retain the leads on each side of the QFP type IC on the pins b, b, ... And contact between each lead and the corresponding pin. Let them do it. Thus, the lid g can be said to be an IC contactor for contacting the leads of the IC with the pins b, b, ... Of the bent body a.

[0005]

[Problems to be solved by the device]

 By the way, when an IC socket as shown in FIGS. 5A and 5B was used, lead bending occurred in the IC as shown in FIGS. 6A to 6C. The lead bending shown in FIG. 6 (A) is caused by the lead of the IC touching the lead guides e, e, e, e and the lead guides f, f, f, f when the IC is inserted into or removed from the socket. To do. The lead bending shown in FIGS. 6 (B) and 6 (C) is often caused when the pressing surfaces of the lead pressers i, i, i, i are not in the proper positions.

The present invention has been made in order to solve such a problem. The IC is positioned in an IC socket so that lead bending does not occur, and each lead contacts a terminal such as a pin of the IC socket. It is an object of the present invention to provide a novel IC contactor that can be operated.

[0007]

[Means for Solving the Problems]

 The IC contactor of the present invention comprises positioning means for positioning the IC with respect to the IC socket by receiving the body thereof, and suction means for sucking the body of the IC positioned by the positioning means. Is characterized by.

[0008]

According to the IC contactor of the present invention, the positioning means positions the IC within its body, and the suction means sucks the body of the IC. Therefore, the IC contactor can be positioned without touching the lead of the IC. .. Then, by contacting the leads of the IC whose body is sucked and positioned by the IC contactor to the terminals such as pins of the IC socket, it is possible to make contact without bending the leads.

[0009]

【Example】

 Hereinafter, the IC contactor of the present invention will be described in detail with reference to the illustrated embodiments. FIG. 1 is a sectional view showing an embodiment of the IC contactor of the present invention. Reference numeral 1 is a main body of the IC contactor, and lead escape preventing pieces 2, 2, 2, 2 (however, only two 2, 2 appear as a cross section in the drawing) are formed on four sides of the IC suction side surface. ..

Numeral 3 is a positioning body sliding hole formed in the central portion of the IC contactor body in the axial direction, and a support cylinder 4a of the positioning body is slidably fitted in the hole 3. The positioning body 4 is integrally formed at the tip of the support cylinder 4a, has a size similar to that of the body of the QFPIC as viewed from above, and has substantially the same shape. Positioning pieces 5, 5, 5, 5 for guiding the body (however, only two pieces 5, 5, 5 appear as a cross section) are formed.

Reference numeral 6 denotes a spring that is contracted between the main body 1 of the IC contactor and the positioning body 4 while being externally fitted to the support cylinder 4 a, and urges the positioning body 4 toward the IC side. A stopper 7 is attached to a portion of the support cylinder 5 protruding from the IC contactor body 1 to the side opposite to the IC side (the left side in FIG. 1), and is positioned by engaging with the surface of the IC contactor body 1 opposite the IC side. The limit of movement of the body 5 to the IC side is defined.

Reference numeral 8 denotes a vacuum suction tool, which is slidably fitted in a center hole 9 formed in the positioning body 4 and the support cylinder 4a. 10 is a QFPIC, 11 is a body (molded package) made of resin, 12, 12, ... Leads.

In order to bring the IC into contact with the IC socket 13 with the present IC contactor, specifically, each lead 12, 12, ... Of the IC is connected to the corresponding pin 14, 14 ,. For example, the following is made to make contact with the individual 14 and 14). The IC contactor faces the body 11 of the QFPIC 10, and the positional relationship between the IC contactor and the IC is such that the upper half of the body 11 of the IC can enter the positioning pieces 5, 5, 5, 5 of the positioning body 4. Is adjusted, and the body 11 of the IC is directly vacuum-sucked by the vacuum suction tool 8. Then, the IC 10 is positioned on the body 11 by the positioning pieces 5, 5, 5, 5.

By the way, the lead escape preventing pieces 2, 2, 2, 2 of the IC contactor are lightly touched by the leads 12, 12, ... Of the positioned IC 10, or between the leads 12, 12 ,. For example, a gap 15 of several tens to several hundreds of μm is formed. In the drawing, the lead escape prevention pieces 2, 2, 2, 2 do not press the leads 12, 12, ... On the pins 14, 14 ,. In this way, it is necessary to lightly touch the lead escape preventing pieces 2, 2, 2, 2 with the leads 12, 12, ... Or to make a small gap 15 between the leads 12, 12 ,. This is to prevent the leads 12, 12, ... from being bent when they are positioned by an IC contactor and sucked by vacuum.

Then, after the IC is positioned by the IC contactor and sucked by vacuum, the IC contactor is exposed to the socket 13. Next, when the positions of the sockets 13 of the IC contactor are aligned, specifically, the leads 12, 12, ... Of the IC 10 are aligned with the pins 14, 14 ,. After that, the IC contactor is brought close to the IC socket 13. Then, the leads 12, 12, ... Of the IC come into contact with the pins 14, 14 ,. If the IC contactor is brought a little closer to the contact, the elasticity of the pins 14, 14, ... causes the leads 12, 12, ... to come into contact with the pins 14, 14, ... with a certain degree of strength, and the state becomes measurable. It Therefore, electrical specific measurement is performed in this state.

According to the present IC contactor, when the leads 12, 12, ... Of the IC come into contact with the pins 14, 14, ... And then the IC contactor is moved a little closer, the elastic force of the pins 14, 14 ,. There is no fear that the leads 12, 12, ... Are bent to the left side in FIG. This is because the lead escape preventing pieces 5, 5, 5, 5 prevent the leads 12, 12, ... From being bent to the left side in FIG. If the position of the IC contactor with respect to the IC socket 12 can be accurately controlled, there is no fear that the leads 12, 12, ... Bend to the left side in FIG. 1, so the lead escape prevention piece is not essential. ..

The present IC contactor positions the IC without touching the leads of the IC at all, and does not press the leads 12, 12, ... With a part of the IC contactor, but rather the pin of the IC socket 13. Since the pins 14, 14, ... Are brought into contact with each other by the elastic force of 14, 14, ..., Electrical characteristics can be measured without causing lead bending.

FIG. 2 is a sectional view showing a modification of the IC contactor of FIG. In this modification, the lead escape prevention pieces 2, 2, 2 and 2 have a shorter projecting length than that of FIG. 1 so that the QFPIC 10a of the type in which the leads 12, 12, ... Are bent upward can be measured. It's been hidden.

FIG. 3 is a sectional view showing another embodiment of the IC contactor of the present invention. In the present embodiment, the IC contactor main body 1, the positioning body 4 and the vacuum suction tool 8 which are separate bodies in the IC contactors shown in FIGS. 1 and 2, are formed integrally as a matter of course. 6, there is no stopper 7. The present invention can also be implemented in the mode shown in FIG.

If implemented in this manner, the number of parts of the IC contactor is reduced, and the manufacturing cost of the IC contactor can be reduced. However, on the other hand, when the positional accuracy between the tip end surface of the vacuum suction tool 8, the positioning pieces 5, 5, 5, 5 and the positioning pieces 2, 2, 2, 2 is completely fixed, the position accuracy is poor. Has a drawback that it is difficult to use for a multi-pin IC with a small lead pitch. For ICs with a pitch considerably smaller than 0.5 mm, the IC contactor as shown in Fig. 1 seems to be more practical. However, due to the remarkable progress in processing technology, there is a possibility that the IC contactor as shown in FIG. 3 can be used even for an IC having a considerably small lead pitch.

FIG. 4 is a sectional view showing a modification of the IC contactor of FIG. In this modification, the lead escape prevention pieces 2, 2, 2 and 2 have a shorter protruding length than that of FIG. 3 so that the QFPIC 10a of the type in which the leads 12, 12, ... It was done.

[0022]

[Effect of the device]

 The IC contactor of the present invention is an IC contactor for electrically connecting an IC to an IC socket, and a positioning means for positioning the IC with respect to the IC socket by receiving a body of the IC contactor and a positioning means positioned by the positioning means. And a suction means for suctioning the body of I C. Therefore, according to the IC contactor of the present invention, the IC is positioned by guiding the body by the positioning means and the body of the IC is sucked by the suction means, so that the IC leads can be positioned without touching the leads. Then, by contacting the leads of the IC whose body is attracted and positioned by the IC contactor to the terminals such as pins of the IC socket, it is possible to make contact without bending the leads.

[Brief description of drawings]

FIG. 1 is a sectional view showing one embodiment of an IC contactor of the present invention.

FIG. 2 is a cross-sectional view showing a modified example of the IC contactor of FIG.

FIG. 3 is a sectional view showing another embodiment of the IC contactor of the present invention.

4 is a cross-sectional view showing a modified example of the IC contactor of FIG.

5A and 5B show a conventional example, and FIG.
Is a perspective view, and (B) is an enlarged sectional view showing a lead guide portion.

FIG. 6A to FIG. 6C are diagrams showing different examples of lead bending, which are problems in the related art.

[Explanation of symbols]

 4 positioning means (positioning body) 5 positioning means (positioning piece) 8 suction means (vacuum suction tool) 10 IC 11 body 12 lead 13 IC socket 14 pin (terminal)

Claims (1)

[Scope of utility model registration request] 1. An IC contactor for electrically connecting an IC to an IC socket, comprising: positioning means for positioning the IC with respect to the IC socket by receiving the body of the IC; and IC in a state of being positioned by the positioning means. An IC contactor comprising: a suction means for sucking a body;