JPH031422U - - Google Patents
Info
- Publication number
- JPH031422U JPH031422U JP5991989U JP5991989U JPH031422U JP H031422 U JPH031422 U JP H031422U JP 5991989 U JP5991989 U JP 5991989U JP 5991989 U JP5991989 U JP 5991989U JP H031422 U JPH031422 U JP H031422U
- Authority
- JP
- Japan
- Prior art keywords
- terminals
- rows
- wiring board
- arrangement
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案によるＱＦＰ形ＩＣの端子形状
の一実施の斜視図、第２図は同ＳＯＰ形ＩＣの端
子形状の一実施例の斜視図、第３図は従来のＳＯ
Ｐ形ＩＣの端子形状の斜視図である。
図中、１は接続端子、２は面積を広げた接続端
子、３，４，５はそれぞれＩＣ本体である。
Fig. 1 is a perspective view of an embodiment of the terminal shape of the QFP type IC according to the present invention, Fig. 2 is a perspective view of an embodiment of the terminal shape of the same SOP type IC, and Fig. 3 is a perspective view of an embodiment of the terminal shape of the QFP type IC according to the present invention.
FIG. 2 is a perspective view of a terminal shape of a P-type IC. In the figure, 1 is a connection terminal, 2 is a connection terminal with an expanded area, and 3, 4, and 5 are IC bodies, respectively.
Claims (1)
端子を一列若しくは複数列に配列してなる部品に
おいて、各配列の両端の端子を、両端以外の端子
より広い半田付け面積を有する端子により構成し
たことを特徴とする部品の端子形状。 In a component that is surface-mounted on a printed wiring board and has a plurality of connection terminals arranged in one or more rows, the terminals at both ends of each arrangement are configured with terminals having a larger soldering area than the terminals at the other ends. Characteristic terminal shapes of parts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5991989U JPH031422U (en) | 1989-05-24 | 1989-05-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5991989U JPH031422U (en) | 1989-05-24 | 1989-05-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031422U true JPH031422U (en) | 1991-01-09 |
Family
ID=31586843
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5991989U Pending JPH031422U (en) | 1989-05-24 | 1989-05-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031422U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260582A (en) * | 1993-03-09 | 1994-09-16 | Hitachi Ltd | Semiconductor device |
-
1989
- 1989-05-24 JP JP5991989U patent/JPH031422U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06260582A (en) * | 1993-03-09 | 1994-09-16 | Hitachi Ltd | Semiconductor device |