JPH031386B2 - - Google Patents
Info
- Publication number
- JPH031386B2 JPH031386B2 JP58110313A JP11031383A JPH031386B2 JP H031386 B2 JPH031386 B2 JP H031386B2 JP 58110313 A JP58110313 A JP 58110313A JP 11031383 A JP11031383 A JP 11031383A JP H031386 B2 JPH031386 B2 JP H031386B2
- Authority
- JP
- Japan
- Prior art keywords
- copper
- rust preventive
- solution
- alcohol
- rust
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 claims description 26
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 24
- 239000010949 copper Substances 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 20
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 15
- 230000003449 preventive effect Effects 0.000 claims description 15
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 13
- 239000002904 solvent Substances 0.000 claims description 13
- 239000011259 mixed solution Substances 0.000 claims description 11
- 239000000243 solution Substances 0.000 claims description 10
- 238000009835 boiling Methods 0.000 claims description 8
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- BOSAWIQFTJIYIS-UHFFFAOYSA-N 1,1,1-trichloro-2,2,2-trifluoroethane Chemical compound FC(F)(F)C(Cl)(Cl)Cl BOSAWIQFTJIYIS-UHFFFAOYSA-N 0.000 claims description 6
- 125000003354 benzotriazolyl group Chemical class N1N=NC2=C1C=CC=C2* 0.000 claims description 5
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims description 4
- 239000012964 benzotriazole Substances 0.000 claims description 4
- 238000013020 steam cleaning Methods 0.000 claims description 3
- 238000011282 treatment Methods 0.000 description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 230000002265 prevention Effects 0.000 description 10
- 239000000919 ceramic Substances 0.000 description 6
- 230000003647 oxidation Effects 0.000 description 6
- 238000007254 oxidation reaction Methods 0.000 description 6
- 238000000576 coating method Methods 0.000 description 5
- 239000011248 coating agent Substances 0.000 description 4
- 239000012046 mixed solvent Substances 0.000 description 4
- 238000007772 electroless plating Methods 0.000 description 3
- 238000007602 hot air drying Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000010186 staining Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
- C23F11/14—Nitrogen-containing compounds
- C23F11/149—Heterocyclic compounds containing nitrogen as hetero atom
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Preventing Corrosion Or Incrustation Of Metals (AREA)
- Ceramic Capacitors (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58110313A JPS602681A (ja) | 1983-06-16 | 1983-06-16 | 銅または銅合金の防錆処理方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58110313A JPS602681A (ja) | 1983-06-16 | 1983-06-16 | 銅または銅合金の防錆処理方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS602681A JPS602681A (ja) | 1985-01-08 |
| JPH031386B2 true JPH031386B2 (enrdf_load_stackoverflow) | 1991-01-10 |
Family
ID=14532540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58110313A Granted JPS602681A (ja) | 1983-06-16 | 1983-06-16 | 銅または銅合金の防錆処理方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS602681A (enrdf_load_stackoverflow) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287155A (ja) * | 1985-06-14 | 1986-12-17 | Hitachi Ltd | 半導体装置及び半導体装置の製造方法 |
| JPH0878281A (ja) * | 1994-09-05 | 1996-03-22 | Matsushita Electric Ind Co Ltd | 電子部品の製造方法 |
| US7264740B2 (en) * | 2003-03-28 | 2007-09-04 | David Hughes Horne | Process for increasing strength, flexibility and fatigue life of metals |
| CN102064020B (zh) * | 2010-10-28 | 2012-04-25 | 吴浩 | 微波高频电容器端电极的制作方法 |
| JP6848243B2 (ja) * | 2016-07-25 | 2021-03-24 | 住友金属鉱山株式会社 | 導電性基板の製造方法 |
-
1983
- 1983-06-16 JP JP58110313A patent/JPS602681A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS602681A (ja) | 1985-01-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CA1172525A (en) | Copper-containing articles with a corrosion inhibitor coating and method of producing the coating | |
| KR100556679B1 (ko) | 구리 기판의 선택적 침착방법 | |
| US2544139A (en) | Process for enameling aluminumrich alloys | |
| US2535794A (en) | Method of preparing ferrous metal objects for the application of synthetic resins | |
| JPH031386B2 (enrdf_load_stackoverflow) | ||
| JPS58501113A (ja) | 銅のハンダづけ能力の保護法 | |
| US2923608A (en) | Method of improving the bonding properties of steel surfaces | |
| JPS62140675A (ja) | 電気機械および機械部品の含浸法 | |
| EP0021602B1 (en) | Treatment of tin plate surfaces against sulphide staining | |
| US3197345A (en) | Process and composition for phosphatizing metals | |
| US4861374A (en) | Non-abrasive polish or cleaning composition and process for its preparation | |
| JPS5852474A (ja) | 被覆された鋼基材および被覆方法 | |
| DE4039271A1 (de) | Verfahren zum schutz von kupfer- und kupferlegierungsoberlfaechen vor korrosion | |
| JPH0144033B2 (enrdf_load_stackoverflow) | ||
| US3971628A (en) | Method for inhibiting rust formation on iron-containing articles | |
| US2940867A (en) | Immersion tin plating and composition therefore | |
| US3827919A (en) | Beryllium surface treatment | |
| JP2001357722A (ja) | 電線被覆用銅条及びその製造方法 | |
| KR20240098278A (ko) | 구리의 내열 코팅 조성물 및 이를 이용한 내열 코팅 방법 | |
| US3261710A (en) | Method for removing coating of epoxyphenolic resin and polytetrafluoroethylene from metal cases | |
| JPS5946312B2 (ja) | 熱処理された銅被膜の酸化防止法 | |
| RU2041836C1 (ru) | Способ нанесения декоративных покрытий на изделия | |
| JP4556312B2 (ja) | セラミック積層電子部品およびその製造方法 | |
| JPH0130911B2 (enrdf_load_stackoverflow) | ||
| JPS54142160A (en) | Solder coating formation |