JPH0313746U - - Google Patents
Info
- Publication number
- JPH0313746U JPH0313746U JP1989073583U JP7358389U JPH0313746U JP H0313746 U JPH0313746 U JP H0313746U JP 1989073583 U JP1989073583 U JP 1989073583U JP 7358389 U JP7358389 U JP 7358389U JP H0313746 U JPH0313746 U JP H0313746U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- base
- wiring pattern
- component element
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/851—Dispositions of multiple connectors or interconnections
- H10W72/874—On different surfaces
- H10W72/884—Die-attach connectors and bond wires
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073583U JP2502612Y2 (ja) | 1989-06-26 | 1989-06-26 | 電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073583U JP2502612Y2 (ja) | 1989-06-26 | 1989-06-26 | 電子部品 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0313746U true JPH0313746U (enExample) | 1991-02-12 |
| JP2502612Y2 JP2502612Y2 (ja) | 1996-06-26 |
Family
ID=31612525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989073583U Expired - Lifetime JP2502612Y2 (ja) | 1989-06-26 | 1989-06-26 | 電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2502612Y2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0227586U (enExample) * | 1989-07-26 | 1990-02-22 | ||
| JPH11251488A (ja) * | 1998-03-05 | 1999-09-17 | Sumitomo Metal Electronics Devices Inc | セラミックパッケージ |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49123271A (enExample) * | 1973-03-28 | 1974-11-26 | ||
| JPS5899839U (ja) * | 1981-12-28 | 1983-07-07 | 三菱電機株式会社 | 半導体装置用実装基板 |
| JPS6083353A (ja) * | 1983-10-14 | 1985-05-11 | Oki Electric Ind Co Ltd | チツプキヤリア基板 |
| JPS61182098U (enExample) * | 1985-04-30 | 1986-11-13 | ||
| JPS6393136A (ja) * | 1986-10-07 | 1988-04-23 | Mitsubishi Electric Corp | トランジスタ装置 |
| JPH01125959A (ja) * | 1987-11-11 | 1989-05-18 | Matsushita Electric Ind Co Ltd | 高周波用パッケージ |
-
1989
- 1989-06-26 JP JP1989073583U patent/JP2502612Y2/ja not_active Expired - Lifetime
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS49123271A (enExample) * | 1973-03-28 | 1974-11-26 | ||
| JPS5899839U (ja) * | 1981-12-28 | 1983-07-07 | 三菱電機株式会社 | 半導体装置用実装基板 |
| JPS6083353A (ja) * | 1983-10-14 | 1985-05-11 | Oki Electric Ind Co Ltd | チツプキヤリア基板 |
| JPS61182098U (enExample) * | 1985-04-30 | 1986-11-13 | ||
| JPS6393136A (ja) * | 1986-10-07 | 1988-04-23 | Mitsubishi Electric Corp | トランジスタ装置 |
| JPH01125959A (ja) * | 1987-11-11 | 1989-05-18 | Matsushita Electric Ind Co Ltd | 高周波用パッケージ |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0227586U (enExample) * | 1989-07-26 | 1990-02-22 | ||
| JPH11251488A (ja) * | 1998-03-05 | 1999-09-17 | Sumitomo Metal Electronics Devices Inc | セラミックパッケージ |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2502612Y2 (ja) | 1996-06-26 |