JPH03137119A - Epoxy resin composition and semiconductor device sealed with the composition - Google Patents

Abstract

PURPOSE:To provide the subject composition composed of a polyfunctional epoxy resin composition, a specific epoxy resin hardener and a flexibilizing agent, having excellent moldability and capable of giving a sealed semiconductor device having excellent moisture-resistant reliability, heat aging characteristics, reflow resistance, etc. CONSTITUTION:The objective composition having excellent adhesivity, electrical properties, heat-resistance, high-temperature mechanical strength and flame- retardancy is composed of (A) preferably 50-90 wt.% a >=2-functional epoxy resin composition, (B) preferably 10-50 wt.% of an epoxy resin hardener consisting of a combination of a novolak phenolic resin and a resol phenolic resin and (C) preferably 2-20 wt.% of a flexibilizing agent (preferably a silicone compound).

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention provides an epoxy resin composition with excellent moldability, adhesiveness, electrical properties, heat resistance, high-temperature mechanical strength, and flame retardancy, and the resin composition. The present invention relates to a resin-sealed semiconductor device sealed with a material.

[Conventional technology]

As a semiconductor encapsulation material, a composition in which a curing accelerator is blended with a novolak type phenolic resin as an epoxy resin curing agent is known. This is because novolak type phenolic resins have better moisture absorption properties and moldability than those cured with acid anhydride.

However, with the increase in the degree of integration of semiconductors in recent years, changes in package size, package shape, mounting method, etc.
Improvements in reliability, including heat resistance, moisture resistance, and low stress, are desired. For example, with the shift in package mounting methods from the bottle insertion type to the surface mount type, the package has come to be exposed to high temperatures of 200°C or more during mounting, so if the sealed product is subjected to thermal stress, Large thermal stress occurs due to differences in thermal expansion coefficients of the sealing resin, chip, frame, etc. As a result, cracks may occur in the package or chip or the passivation film formed on the chip surface, and wiring on the chip surface may be cut, short-circuited, or misaligned, resulting in variations in device characteristics and reduced reliability. ing. Furthermore, in order to impart flame retardancy to conventional epoxy resins, bromine compounds such as brominated epoxy resins are added.

However, if a resin-encapsulated semiconductor is left at a high temperature of 200°C or higher for a long time, the bromine contained in the epoxy resin composition will partially decompose and release at a distance of 1 m, promoting corrosion of the gold and aluminum joint and causing poor connection. It is the cause. Therefore, it is desired to reduce the amount of this bromine compound blended as much as possible, but the flame retardance of the sealed product decreases and the standards cannot be met.

Conventionally, methods for increasing the heat resistance of epoxy resins include making the epoxy resin multifunctional, increasing the molecular weight of novolac type phenol resin, and making acid anhydride multifunctional. In addition, regarding improving the flame retardancy of epoxy resin, Japanese Patent Application Publication No. This was proposed in Publication No. 1983 269555. Furthermore, as another method for improving the reliability of epoxy resin sealants, we have proposed
As described in No. 443 and Japanese Unexamined Patent Publication No. 59-200/144, a method using a resol type phenol resin as an epoxy resin curing agent has been carried out.

Furthermore, a method of using a resol type phenolic resin and a novolac type phenolic resin in combination with an epoxy resin is disclosed in Japanese Patent Application Laid-open No. 5 (Sho 5) (No.
However, since these are used as adhesives or paints, there is no need to consider whether flexibility or purity of the resin is insufficient.

[Problem to be solved by the invention]

However, when polyfunctionalizing epoxy resins or converting phenolic resins used as curing agents into polymers, the glass transition temperature of the cured resin composition increases, but the adhesion and moisture resistance are slightly inferior to conventional methods. Therefore, it could not be put to practical use as a material for electronic components. Furthermore, if only the particle size of antimony trioxide contained in the epoxy resin composition is specified,
It has been extremely difficult to significantly reduce the amount of bromine compounds that cause corrosion of gold-aluminum joints. On the other hand, when resol type phenolic resin is used as a curing agent for Evo; Since it is slightly inferior, if an amount (equivalent) sufficient to completely advance the curing of the epoxy resin is added, the electrical properties and heat resistance will be significantly reduced.

The present invention was made in view of the above situation, and its purpose is to provide a material with good moldability, adhesiveness, electrical properties, and heat resistance, and with a lower amount of bromine compound than before. An object of the present invention is to provide an epoxy resin composition that can impart flame retardancy and a resin-sealed electronic device using the same.

[Failure to solve the problem]

In order to achieve the above object, the present invention provides (a) an epoxy resin composition having two or more functional functions; The flexible north side is an epoxy resin composition characterized by comprising:
It is preferable to mix up to 20% of the double side, and it is preferable to use a silicone compound for the north side of the sign. Further, when the above-mentioned epoxy resin composition is heated with 10 times the amount of hot water at 120°C for 100 hours or more, the electrical conductivity of the extract is 100 μs/
cm or less, 111] is 3 to 7, and the amount of halogen ions is 20
ppI! ! It is better if it is below.

In addition, in order to achieve the above object, in the present invention, the resin components include 50 to 90% by weight of an epoxy resin having two or more functions, and 10 to 50% by weight of an epoxy resin curing agent using a combination of a novolak type phenolic resin and a resol type phenolic resin. % by weight, and when heated and extracted with 10 times the amount of hot water at 120°C for 100 hours or more, the electrical conductivity of the extract is 100 μs.
/cm or less, pH is 3-7, amount of halogen ions is 2op
pm or less, and the resin composition described in "2" preferably contains 55 to 80% by volume of a filler made of inorganic fine particles based on the total composition. (As a filler, the average particle size is 1 to 30 μm.
At least one kind of inorganic particle selected from fused silica, crystalline silica, and alumina is used.

Furthermore, in order to achieve the other objects mentioned above, in the present invention,
A resin-sealed electronic device or a resin-sealed semiconductor device is sealed with the epoxy resin composition.

The present inventors have conducted various studies on epoxy resin curing agents that perfect the curability of epoxy resins and improve the heat resistance, electrical properties, adhesiveness, and moisture resistance of cured resin products. As a result, we not only used a resol-type phenolic resin as an epoxy resin curing agent, which has a phenolic hydroxyl group that reacts with epoxy groups and which hardens itself, but also required the necessary amount to react all the epoxy groups. It has been found that when a novolac type phenolic resin having a hydroxyl group is also used, the heat resistance and high-temperature mechanical properties of the cured epoxy resin can be improved without impairing adhesiveness or moisture resistance.

It has also been found that when a resol-type phenolic resin is blended as part of the curing agent, flame retardancy of UL Standard-0 can be achieved even if the amount of flame retardant, especially bromine compound, is reduced.

Furthermore, the novolac type phenolic resin used in combination with the resol type phenolic resin is used to make the moldability and electrical properties of the epoxy resin composition equal to or higher than those of conventional epoxy resins.

Resol type phenol type I II? used in the present invention? As such, a condensation product obtained by reacting a phenol such as phenol, cresol, xylenol, or bisphenol Δ with formaldehyde in the presence of a catalyst is used. Catalysts that can be used for these synthesis include ammonia, hexamine, amines, alkali metal oxides or hydroxides, organic metal salts, or these 2M1
The above can be used together.

Among the above-mentioned resins, those that contain few ionic impurities and do not easily hydrolyze in 120° C. hot water and do not emit ionic impurities are particularly useful for semiconductor encapsulation. Basically, it is preferable to have a chemistry 411 blue structure represented by the following formula (I)t or (1), but when producing resol type phenolic resin, the reaction time is It is desirable that the molecular weight is appropriately large, from 400 to 3.000, in view of the curability and fluidity of the resin.

l (11 (+ means any group, which may be the same or different, m and n are integers of 1 or more.) Also, unreacted raw materials and ionic impurities are removed. In order to
After neutralizing the reaction product with an acid, it is washed with water or subjected to steam distillation, dried under reduced pressure, etc., or, if necessary, is manufactured into fIi using an ion exchange resin, an ion exchanger, or the like.

The novolac type phenolic resin used in the present invention is obtained by reacting phenols such as phenol, cresol, and xylenol with formaldehyde under an acidic catalyst such as paratoluenesulfonic acid, hydrochloric acid, sulfuric acid, persalt acid, and oxalic acid. A condensation product is used, which basically has a chemical structure represented by the general formula (Ill).

3 (Here, R3 means either group I-1 or -CI+3, and n means an integer of 1 or more.) The method for adjusting the molecular weight of the obtained novolac type phenolic resin is to Although the molecular weight can be controlled by changing the molar ratio of formaldehyde to formaldehyde and the type and amount of catalyst used, the molecular weight should be 400-3.
000 is desirable. In addition, in order to use it for semiconductor encapsulation, it is preferable to use a product with as little ionic impurities or unreacted raw materials as possible, and for this purpose, the reaction product should be thoroughly washed with water or steam distilled and dried under reduced pressure, or as necessary. It is also possible to purify using an ion exchange resin, an ion exchanger, etc.

In the present invention, the blending ratio of the epoxy resin curing agent is 5 to 95% by weight of novolak type phenolic resin and 5 to 95% by weight of resol type phenolic resin based on the total amount of curing agent.
Preferably it is 95% by weight. When the novolak type phenolic resin is 5% by weight or less, the resol type phenolic resin as a curing agent is 95% by weight or more, and water and formaldehyde, which are condensation by-products generated during the curing reaction of the resin composition, affect the physical properties of the cured product. It will have a big impact on. For example, microvoids are likely to be formed inside or at the interface of the cured product, the cured product becomes brittle, and adhesiveness and moisture resistance are reduced.

On the other hand, if the novolac-type phenolic resin is 95% by weight or more and the resol-type phenolic resin is 5% by weight or less, there is little effect on improving the heat resistance and high-temperature mechanical strength of the cured resin, and there is also no improvement in flame retardancy. The contribution of resol-type phenolic resins to this cannot be expected either.

The epoxy resin used in the present invention refers to all epoxy resins containing two or more epoxy groups in one molecule, such as bisphenol-based resins obtained by reacting bisphenol A or phenol novolak resin with shrimp chlorohydrin. Epoxy resins, novolak-type epoxy resins, or their brominated epoxy resins, epoxy resins obtained from alicyclic compounds such as cyclohexene, cyclopentadiene, and dicyclopentadiene, epoxy resins obtained from vinyl polymers, glyze, phosphorus, etc. These include epoxy resins obtained from polyhydric alcohols such as
Seeds are used. Here, the brominated epoxy resin is used to impart flame retardancy, but the amount is determined according to the UV regulations.
As long as it satisfies 0, the less the better. Furthermore, these epoxy resins must be sufficiently free of unreacted raw materials and ionic impurities. It is preferable to mix 0.5 to 1.5 equivalents of the curing agent made of novolak type or resol type phenolic resin to these epoxy resins, and the amount of each is 50% of the epoxy resin.
It is desirable that the curing agent be 10 to 50% by weight. Evo; 1-When the resin is less than 50% by weight,
Even after the resin is cured, a large amount of hydroxyl groups possessed by the phenol resin remain, resulting in poor electrical properties and moisture resistance. On the other hand, if the amount of epoxy resin added exceeds 90% by weight, the epoxy resin will not be completely cured, resulting in poor heat resistance and electrical properties of the cured product. Furthermore, in order to use these epoxy resins and their curing agents for semiconductor applications, ionic impurities must be sufficiently removed. When extracted, the object of the present invention can be fully achieved if the electric conductivity of the extract is 100 μs/am2 or less, g]11 is 3 to 7, and the amount of halogen ions is 20 ppm or less.

The epoxy resin composition of the present invention contains an inorganic filler in an amount of 55 to 80% by volume based on the total composition, if necessary. Inorganic fillers are added for the purpose of improving the coefficient of thermal expansion, thermal conductivity, modulus of elasticity, etc. of the cured product, and if the amount added is less than 55% by volume, these properties cannot be sufficiently improved. This is because if the content exceeds 80% by volume, the viscosity of the material will increase significantly and the fluidity will decrease.

Various compounds can be used as inorganic fillers, but it is important to use thermochemically stable fillers for electronic component materials. IMI inorganic particles are preferred. Note that the average particle size of these fillers is preferably in the range of 1 to 30 μm. This is because if the average particle size is less than lA1m, the viscosity of the resin composition will increase and the fluidity will drop significantly, and if it exceeds 30μm, the resin component and filler will likely separate during molding and harden. This is because the product becomes non-uniform, resulting in variations in the physical properties of the cured product, and the ability to fill narrow gaps becomes poor.

Furthermore, in the composition of the present invention, a flexibilizing agent may be used to strengthen the cured product and lower the modulus of elasticity, if necessary. The amount of the softening agent blended is preferably 2 to 20% by weight based on the total resin composition. This is because if the blending amount of the softening agent is less than 2% by weight, it will have almost no effect on toughening the cured product or lowering the elastic modulus, and if it is more than 20% by weight, the spiral flow will become extremely short. As the softening agent rises to the surface of the cured resin,
This is because the mold becomes noticeably dirty. As a plasticizing agent, one that is incompatible with the epoxy resin composition can lower the elastic modulus of the 1α compound without lowering the glass transition temperature. Butadiene yarn stiffening agents such as mino- and carboxyl-modified copolymers and acrylonitrile-butadiene-styrene copolymers, terminal or side chain amine groups, hydroxyl groups, epoxy groups, carboxyl groups, and modified silicone resin-based softening agents Silicone thread-threading agents are particularly useful from the viewpoint of water resistance and high purity.

In addition, the composition of the present invention may optionally contain a curing catalyst to accelerate the curing reaction of the resin, a coupling agent to improve the adhesion between the resin component and the filler, and a dye or pigment for coloring. Various additives such as a mold release agent for improving the mold releasability of the cured product from the mold can be used within the range that does not impair the purpose of the invention. As curing catalysts, phosphorus-containing organic basic compounds such as triphenylphosphine and tetraphenylphosium tetraphenylborate, tetra-substituted boron salts thereof, tertiary amines such as benzyldimethylamine, and 1,8-diazabicyclo (5 , 4,0)-undecene, imidazole, etc., and at least one coupling agent such as epoxysilane, aminosilane, oran, etc. is preferably used.

If fillers, flexibilizers, and their respective additives contain large amounts of ionic impurities, like resin components, they will significantly reduce the reliability of various products. Therefore, for each of these additives, the electrical conductivity of the extract is 100 μs/cm when extracted with 10 times the amount of 120°C hot water (1 hour or more).
Below, pl+ is 3 to 7, halogen ion extraction amount is 201
]I'llll or less.

[For production]

The heat resistance and high-temperature mechanical strength of the epoxy resin composition of the present invention are superior to conventional molding resins because part of the epoxy resin curing agent is a resol-type phenolic resin that hardens itself. Furthermore, this resin also plays a major role in improving flame retardancy. In addition, the novolac type phenolic resin used together as a curing agent is used to completely cure the epoxy resin, and prevents the novolac type phenolic resin from reducing the adhesiveness and moisture resistance of the cured resin. It works like this.

〔Example〕

EXAMPLES Hereinafter, the present invention will be specifically explained according to Examples, but the present invention is not limited thereto.

Production Example 1 [Synthesis of resol type phenolic resin 1] 500 g of phenol, 550 g of 30% formalin, and 5 g of zinc acetate were added to a flask No. 51, and gradually heated while stirring.
The mixture was heated at 90° C. for 2 hours under reflux. Thereafter, the pressure inside the flask was reduced to 20 mm and 11 g to remove condensed water and unreacted water. Next, add 300g of this reaction product to
of acetone was added to dissolve the reaction compound, and further ion-exchanged water 31 was added and vigorously stirred at 50° C. for 30 minutes. After cooling, the upper aqueous layer was removed, and the reaction product was dissolved again in 300 g of acetone, and ion-exchanged water 31 was added to this solution.
The mixture was vigorously stirred at 0° C. for 30 minutes, and after cooling, the upper aqueous layer was removed. After repeating this operation five times, the reaction product was dried and smoked at 40° C. for 48 hours under reduced pressure to obtain the desired resol type phenol resin (A).

The number average molecular weight of the resol type phenolic resin (A>) thus obtained was 710, the softening temperature was 75°C, the free phenol content was 0.3% by weight, and the gelation time at 180°C (J
I S-ni-5ri0! 1, by hot plate method) was 45 seconds. In addition, we added 50 g of ion-exchanged water to 5 g of resol-type phenolic resin, heated it at 120°C for 120 hours, and investigated the characteristics of the extract. As a result, the pH of the extract was 3.8, the electrical conductivity was 55 μs/m, and the ionicity of the extract was 3.8. Impurity CI ion is 2
．． 51111m, mouth r ion, N11. ion is ipp
m or less.

Production Example 2 [Synthesis of resol type phenolic resin 2] 570 g of bisphenol in 52 flasks 1 75 formaldehyde
g1 800g of formaldehyde and IOg of sodium hydroxide aqueous solution were added and gradually heated while stirring,
The mixture was heated at 90° C. for 4 hours under reflux. Ion exchange water 3
1 was added to stop the reaction, and after neutralization with acetic acid, the organic fraction and water were separated. This organic substance was dissolved in 150 g of acetone, and 0.71 g of ion-exchanged water was added to this solution, and the mixture was heated at 50°C for 30 min.
After stirring vigorously for 0 minutes and cooling, the upper aqueous layer was removed. After repeating this operation five times, the reaction product was dried at 4()° C. for 24 hours without reducing the pressure to obtain the desired resol type phenol resin (B).

The resol type phenolic resin (B) thus obtained had a number average molecular weight of 680, a softening temperature of 78°C, a free bisphenol A content of about 7% by weight, and a gelation time at 180°C of 25 seconds.

Further, the properties of the extract of this resol type phenol resin were determined in the same manner as in Production Example 1, and the result was that the extract had flI+ of 4.5 and electrical conductivity of 25 μs/cm.

The ionic impurity C1 ion was 2.8 ppm, and the amount of ions and N114 ions was 1 ppm or less.

[Examples 1 to 12] As resin components, 0-talesol novolac type epoxy resin (epoxy equivalent weight 195, softening temperature 75 to 80°C), odor-accumulating bisphenol A type epoxy resin (epoxy equivalent ff
1394, softening temperature 65°C), novolak type phenolic resin as curing agent (hydroxyl equivalent: 106, softening temperature 65°C)
) and the purified resol-type phenolic resin obtained in Production Example 1 or Production Example 2, a side chain epoxy-modified silicone resin (molecular weight 73, (ioo, epoxy equivalent weight 3.900) as a softening agent, Various compounds shown in Table 1, as fillers, 30/70 of prismatic fused silica with an average particle size of 6 μm and spherical fused silica with an average particle size of 30 μm
Using a mixed product, antimony trioxide powder as a flame retardant aid, epoxy silane as a coupling agent, montanic acid ester wax as a mold release agent, and carbon black as a coloring agent, a molding material was prepared at the mixing ratio shown in Table 1. did. For kneading each material, a twin-screw roll with a diameter of 20 inches is used.
Kneading was carried out for about 10 minutes at a U-ru surface temperature of about 65 to 80°C.

[Comparative Examples 1 to 9] In Comparative Example 1, an 0-talesol novolac type epoxy resin containing a large amount of ionic impurities was used as an epoxy resin (epoxy equivalent: 210, softening temperature: 73°C, pH in extract liquid characteristics at 120°C/20 hours). is 4.0, electrical conductivity is 10
5 us/cm.

A molding material was prepared in the same manner as above using the ionic impurities (CI ions at 42 ppm and R ions at 25 ppm), using the same materials as the other components as in the previous example, and using the compounding ratios shown in Table 1. In Comparative Examples 2 to 9, molding materials were produced using the same materials and under the same conditions as in the Examples.

[Examples 13 to 16] Molding materials were prepared using the same materials as in the above Examples, except that the plasticizing agent was removed from the resin component, and with the blending ratios shown in Table 2.

[Comparative Examples 10 to 12] In Comparative Example 1O, the same 0-cresol type epoxy resin as in Comparative Example 1 was used. For other comparative examples, a total of three yuzu molding materials were prepared in the same manner as above using the same materials as in the above-mentioned examples and at the compounding ratios shown in Table 2.

The moldability of each of the molding materials obtained in this way at 180°C and the molded products molded at a mold temperature of 180 t, molding pressure cuff kg/cm2, and molding time of 90 seconds, and then post-cured at 180°C for 6 hours. Various physical properties and molded products, 100 Mqs
50 g of ion-exchanged water was added to 5 g of each powder, heated at 120° C. for 120 hours, and the pH, electrical conductivity, and extracted ionic impurities of the subsequent water were compared. These results are summarized in Tables 1 and 2. All compounding ratios in Table 1 right and Table 2 are expressed in parts by weight. In addition, the curing catalyst indicated by the symbol in the table is DL3U: 1°8-diazabicyclo(5,4
,0'')-undecene, TPP-: tetraphenylphosphonium detraphenylborate, 2P4M
I-IZ: 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2P4BH2:2-7enyl-4-benzyl-5-hydroxymethylimidazole.

As is clear from Table 1, the resin composition of the present invention uses a novolac type phenolic resin and a resol type phenolic resin together as a curing agent, so that the electrical properties and adhesive properties of the cured resin are superior to those of conventional epoxy resin molding materials. It can be seen that the heat resistance and high-temperature mechanical strength are improved while maintaining the same properties. Furthermore, when Example 2 and Comparative Example 4 are compared, the flame retardance is improved by blending the resol type phenol resin with the same blending amount of the brominated epoxy resin. In addition, regarding moldability, it is possible to mold under the same conditions as those for commonly used epoxy resin molding materials. In the resin composition containing the flexible north side of the present invention, if the amount of the flexible north side is less than 2% by weight, it will have little effect on lowering the elastic modulus of the resin, and if it is more than 20% by weight, it will cause mold stains and spiral flow. The decrease becomes significant. On the other hand, as is clear from Table 2, although the resin composition of the present invention that does not include the flexible north side has a slightly higher resin modulus, other properties show almost the same properties as in Table 1. I know that there is.

Next, using part of the above molding material, a silicon chip with aluminum zigzag wiring formed on the surface is mounted on a copper lead frame, and a gold wire (φ30 μm) is further connected between the aluminum electrode and the lead frame on the chip surface. The wire-bonded semiconductor devices were sealed and various reliability tests were conducted. The results are shown in Tables 3 and 4.

As is clear from Tables 3 and 4, the sealed products of the present invention are superior in moisture resistance reliability, high temperature storage characteristics, and package crack resistance during reflow, compared to the comparative examples. Furthermore, as is clear from Comparative Example 1 and the IO results, it can be seen that when the purity of the molding material is poor, various reliability of the package is significantly reduced. Therefore, the purity of the molding material is a very important factor for the reliability of the package.

〔Effect of the invention〕

A molding material made of an epoxy resin composition using a curing agent that combines a novolac type phenolic resin and a resol type phenolic resin of the present invention has good moldability similar to conventional epoxy resins, and can be sealed with this molding material. The developed semiconductor device has excellent reliability such as humidity resistance, high temperature storage characteristics, and reflow resistance. Therefore, the present invention provides epoxy and resin compositions that are useful not only as sealing materials for electronic and electrical equipment, but also as adhesives and insulating materials for electronic and electrical equipment that require high heat resistance and good neck attachment. It is clear that it can be provided.

Claims (1)

[Claims] 1. (a) an epoxy resin composition having two or more functionalities, (b) an epoxy resin curing agent using a combination of a novolak type phenolic resin and a resol type phenolic resin, (c) a flexibilizing agent, An epoxy resin composition comprising: 2. The blending amount of the softening agent is 2 to 2 with respect to the total resin composition.
The epoxy resin composition according to claim 1, which has a content of 0% by weight. 3. The epoxy resin composition according to claim 1 or 2, wherein the softening agent is a silicone compound. 4. When the epoxy resin composition according to claim 1 is heated with 10 times the amount of hot water at 120°C for 100 hours or more, the electric conductivity of the extract is 100 μs/cm or less, and the pH is 3 to 3.
7. An epoxy resin composition characterized in that the amount of halogen ions is 20 ppm or less. 5. Epoxy resin curing agent containing 50 to 90% by weight of an epoxy resin whose resin component is bifunctional or higher, and a combination of novolac type phenolic resin and resol type phenolic resin 10 to 50%
% by weight, and 100% with 10 times the amount of hot water at 120°C.
An epoxy resin composition characterized in that the electric conductivity of the extract is 100 μs/cm or less, the pH is 3 to 7, and the amount of halogen ions is 20 ppm or less when extracted by heating for a period of time or more. 6. The epoxy resin composition according to claim 5, wherein the filler made of inorganic fine particles is contained in an amount of 55 to 80% by volume based on the total composition. 7. In claim 6, the filler has an average particle size of 1 to 3.
An epoxy resin composition comprising at least one kind of inorganic particle selected from zero fused silica, crystalline silica, and alumina. 8. A resin-sealed electronic device, characterized in that it is sealed with the epoxy resin composition according to any one of claims 1 to 7. 9. The resin-sealed electronic device according to claim 8, wherein the electronic device is transfer molded using an epoxy resin composition. 10. A resin-sealed semiconductor device, characterized in that it is sealed with the epoxy resin composition according to any one of claims 1 to 7.