JPH03136254A - Die bonding - Google Patents

Die bonding

Info

Publication number
JPH03136254A
JPH03136254A JP27410589A JP27410589A JPH03136254A JP H03136254 A JPH03136254 A JP H03136254A JP 27410589 A JP27410589 A JP 27410589A JP 27410589 A JP27410589 A JP 27410589A JP H03136254 A JPH03136254 A JP H03136254A
Authority
JP
Japan
Prior art keywords
chip
heat sink
molten solder
collet
dripped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP27410589A
Other languages
Japanese (ja)
Other versions
JP2738070B2 (en
Inventor
Masato Hirano
Yutaka Makino
Yoshifumi Kitayama
Akihiro Yamamoto
Original Assignee
Matsushita Electric Ind Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd filed Critical Matsushita Electric Ind Co Ltd
Priority to JP27410589A priority Critical patent/JP2738070B2/en
Publication of JPH03136254A publication Critical patent/JPH03136254A/en
Application granted granted Critical
Publication of JP2738070B2 publication Critical patent/JP2738070B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75Apparatus for connecting with bump connectors or layer connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525Means for applying energy, e.g. heating means
    • H01L2224/753Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/75301Bonding head
    • H01L2224/75302Shape
    • H01L2224/75303Shape of the pressing surface
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319Arrangement of the layer connectors prior to mounting
    • H01L2224/83192Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body

Abstract

PURPOSE: To enable solder to spread over all the rear of a chip and to stably bond the chip to a heat sink without containing bubbles by a method wherein the chip sucked by a collet is bonded to the heat sink with molten solder dripped on the heat sink as the chip is rotated.
CONSTITUTION: When a semiconductor chip 1 or the like is bonded onto a heat sink 4, the chip 1 sucked by a collet 2 is bonded to the heat sink 4 as the chip 1 is rotated on a molten solder 3 dripped on the heat sink 4. For instance, after the molten solder 3 is dripped on the heat sink 4, the chip 1 is made to descend to the heat sink 4 as sucked by the collet 2. Then, the collect 2 is rotated keeping the chip 1 in the contact with the molten solder 3, whereby the molten solder 3 is made to spread over all the rear side of the chip 1 to bond enough. These processes are carried out in a reducing atmosphere.
COPYRIGHT: (C)1991,JPO&Japio
JP27410589A 1989-10-20 1989-10-20 Die bonding method Expired - Fee Related JP2738070B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27410589A JP2738070B2 (en) 1989-10-20 1989-10-20 Die bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27410589A JP2738070B2 (en) 1989-10-20 1989-10-20 Die bonding method

Publications (2)

Publication Number Publication Date
JPH03136254A true JPH03136254A (en) 1991-06-11
JP2738070B2 JP2738070B2 (en) 1998-04-08

Family

ID=17537074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27410589A Expired - Fee Related JP2738070B2 (en) 1989-10-20 1989-10-20 Die bonding method

Country Status (1)

Country Link
JP (1) JP2738070B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5770468A (en) * 1993-01-12 1998-06-23 Mitsubishi Denki Kabushiki Kaisha Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5770468A (en) * 1993-01-12 1998-06-23 Mitsubishi Denki Kabushiki Kaisha Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere

Also Published As

Publication number Publication date
JP2738070B2 (en) 1998-04-08

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees