JPH0312468B2 - - Google Patents

Info

Publication number
JPH0312468B2
JPH0312468B2 JP58122655A JP12265583A JPH0312468B2 JP H0312468 B2 JPH0312468 B2 JP H0312468B2 JP 58122655 A JP58122655 A JP 58122655A JP 12265583 A JP12265583 A JP 12265583A JP H0312468 B2 JPH0312468 B2 JP H0312468B2
Authority
JP
Japan
Prior art keywords
electrode
organic resin
semiconductor pellet
soldering
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58122655A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6014469A (ja
Inventor
Michio Oogami
Takayuki Wakui
Komei Yatsuno
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP58122655A priority Critical patent/JPS6014469A/ja
Publication of JPS6014469A publication Critical patent/JPS6014469A/ja
Publication of JPH0312468B2 publication Critical patent/JPH0312468B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W76/47—
    • H10W72/884—
    • H10W90/734—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
JP58122655A 1983-07-06 1983-07-06 半導体装置 Granted JPS6014469A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58122655A JPS6014469A (ja) 1983-07-06 1983-07-06 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58122655A JPS6014469A (ja) 1983-07-06 1983-07-06 半導体装置

Publications (2)

Publication Number Publication Date
JPS6014469A JPS6014469A (ja) 1985-01-25
JPH0312468B2 true JPH0312468B2 (OSRAM) 1991-02-20

Family

ID=14841346

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58122655A Granted JPS6014469A (ja) 1983-07-06 1983-07-06 半導体装置

Country Status (1)

Country Link
JP (1) JPS6014469A (OSRAM)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2712618B2 (ja) * 1989-09-08 1998-02-16 三菱電機株式会社 樹脂封止型半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58161347A (ja) * 1982-03-19 1983-09-24 Hitachi Ltd 半導体装置

Also Published As

Publication number Publication date
JPS6014469A (ja) 1985-01-25

Similar Documents

Publication Publication Date Title
JP3256636B2 (ja) 圧接型半導体装置
JPS61241959A (ja) 半導体モジユ−ル
JPH07240497A (ja) パワー半導体モジュールおよびそれに使用する絶縁金属基板
WO2018194090A1 (ja) 半導体装置
JP3022178B2 (ja) パワーデバイスチップの実装構造
WO2020241239A1 (ja) 半導体装置
JP3601529B2 (ja) 半導体装置
JP3216305B2 (ja) 半導体装置
JP4409064B2 (ja) パワー素子を含む半導体装置
KR102371636B1 (ko) 양면 기판 반도체 제조 방법
JPH0312468B2 (OSRAM)
JP7625097B2 (ja) 半導体装置及び半導体装置の製造方法
KR100244826B1 (ko) 반도체장치 및 그 제조방법
JPH07176664A (ja) 半導体装置およびその製造方法
JPS62173749A (ja) 半導体装置
JPS60157243A (ja) 半導体装置
JP4861200B2 (ja) パワーモジュール
KR102378171B1 (ko) 커플드 반도체 패키지
JPH05160304A (ja) 半導体装置
KR102228938B1 (ko) 커플드 반도체 패키지
JPS586307B2 (ja) 半導体装置
JP3372169B2 (ja) 半導体パッケージ
JPS5999752A (ja) 混成集積回路装置
JPS615535A (ja) 半導体装置
WO2024128062A1 (ja) 半導体装置