JPH03124639U - - Google Patents
Info
- Publication number
- JPH03124639U JPH03124639U JP1990032708U JP3270890U JPH03124639U JP H03124639 U JPH03124639 U JP H03124639U JP 1990032708 U JP1990032708 U JP 1990032708U JP 3270890 U JP3270890 U JP 3270890U JP H03124639 U JPH03124639 U JP H03124639U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- opening
- semiconductor device
- semiconductor
- cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/536—
-
- H10W72/5363—
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- H10W72/884—
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- H10W74/00—
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- H10W90/734—
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- H10W90/754—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990032708U JPH03124639U (enExample) | 1990-03-30 | 1990-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990032708U JPH03124639U (enExample) | 1990-03-30 | 1990-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03124639U true JPH03124639U (enExample) | 1991-12-17 |
Family
ID=31535845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990032708U Pending JPH03124639U (enExample) | 1990-03-30 | 1990-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03124639U (enExample) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136655A (ja) * | 1986-11-28 | 1988-06-08 | Nec Corp | チツプキヤリア |
| JPH01170027A (ja) * | 1987-12-25 | 1989-07-05 | Ricoh Co Ltd | 半導体実装方法 |
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1990
- 1990-03-30 JP JP1990032708U patent/JPH03124639U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63136655A (ja) * | 1986-11-28 | 1988-06-08 | Nec Corp | チツプキヤリア |
| JPH01170027A (ja) * | 1987-12-25 | 1989-07-05 | Ricoh Co Ltd | 半導体実装方法 |