JPH0312453B2 - - Google Patents
Info
- Publication number
- JPH0312453B2 JPH0312453B2 JP2381982A JP2381982A JPH0312453B2 JP H0312453 B2 JPH0312453 B2 JP H0312453B2 JP 2381982 A JP2381982 A JP 2381982A JP 2381982 A JP2381982 A JP 2381982A JP H0312453 B2 JPH0312453 B2 JP H0312453B2
- Authority
- JP
- Japan
- Prior art keywords
- etching
- chamber pressure
- pressure
- etching chamber
- end point
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005530 etching Methods 0.000 claims description 85
- 238000000034 method Methods 0.000 claims description 13
- 238000001312 dry etching Methods 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000004949 mass spectrometry Methods 0.000 description 3
- 238000004611 spectroscopical analysis Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000009530 blood pressure measurement Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57023819A JPS58140123A (ja) | 1982-02-16 | 1982-02-16 | ドライエツチング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57023819A JPS58140123A (ja) | 1982-02-16 | 1982-02-16 | ドライエツチング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58140123A JPS58140123A (ja) | 1983-08-19 |
| JPH0312453B2 true JPH0312453B2 (enExample) | 1991-02-20 |
Family
ID=12120958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57023819A Granted JPS58140123A (ja) | 1982-02-16 | 1982-02-16 | ドライエツチング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58140123A (enExample) |
-
1982
- 1982-02-16 JP JP57023819A patent/JPS58140123A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58140123A (ja) | 1983-08-19 |
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