JPH0312448U - - Google Patents
Info
- Publication number
- JPH0312448U JPH0312448U JP1989073760U JP7376089U JPH0312448U JP H0312448 U JPH0312448 U JP H0312448U JP 1989073760 U JP1989073760 U JP 1989073760U JP 7376089 U JP7376089 U JP 7376089U JP H0312448 U JPH0312448 U JP H0312448U
- Authority
- JP
- Japan
- Prior art keywords
- island
- semiconductor chip
- lead frame
- fixed
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W90/756—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073760U JPH0312448U (enExample) | 1989-06-22 | 1989-06-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989073760U JPH0312448U (enExample) | 1989-06-22 | 1989-06-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0312448U true JPH0312448U (enExample) | 1991-02-07 |
Family
ID=31612851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989073760U Pending JPH0312448U (enExample) | 1989-06-22 | 1989-06-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0312448U (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196615A (ja) * | 2005-01-12 | 2006-07-27 | Sumitomo Metal Electronics Devices Inc | 半導体素子搭載用基板 |
| JP2009049072A (ja) * | 2007-08-15 | 2009-03-05 | Panasonic Corp | リードフレーム、半導体装置、リードフレームの製造方法、および半導体装置の製造方法 |
| JP2023108665A (ja) * | 2022-01-26 | 2023-08-07 | エイブリック株式会社 | リードフレーム及びそれを用いた半導体装置 |
-
1989
- 1989-06-22 JP JP1989073760U patent/JPH0312448U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006196615A (ja) * | 2005-01-12 | 2006-07-27 | Sumitomo Metal Electronics Devices Inc | 半導体素子搭載用基板 |
| JP2009049072A (ja) * | 2007-08-15 | 2009-03-05 | Panasonic Corp | リードフレーム、半導体装置、リードフレームの製造方法、および半導体装置の製造方法 |
| JP2023108665A (ja) * | 2022-01-26 | 2023-08-07 | エイブリック株式会社 | リードフレーム及びそれを用いた半導体装置 |