JPH0312446B2 - - Google Patents
Info
- Publication number
- JPH0312446B2 JPH0312446B2 JP57161275A JP16127582A JPH0312446B2 JP H0312446 B2 JPH0312446 B2 JP H0312446B2 JP 57161275 A JP57161275 A JP 57161275A JP 16127582 A JP16127582 A JP 16127582A JP H0312446 B2 JPH0312446 B2 JP H0312446B2
- Authority
- JP
- Japan
- Prior art keywords
- chip
- electrode material
- electronic component
- shaped electronic
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007772 electrode material Substances 0.000 claims description 27
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 238000004519 manufacturing process Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011521 glass Substances 0.000 claims description 8
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 2
- 239000000956 alloy Substances 0.000 claims description 2
- 239000004020 conductor Substances 0.000 description 8
- 239000000758 substrate Substances 0.000 description 6
- 239000000919 ceramic Substances 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Manufacturing Of Electric Cables (AREA)
- Details Of Resistors (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57161275A JPS5950596A (ja) | 1982-09-16 | 1982-09-16 | チツプ状電子部品およびその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57161275A JPS5950596A (ja) | 1982-09-16 | 1982-09-16 | チツプ状電子部品およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5950596A JPS5950596A (ja) | 1984-03-23 |
| JPH0312446B2 true JPH0312446B2 (US20070244113A1-20071018-C00087.png) | 1991-02-20 |
Family
ID=15732003
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57161275A Granted JPS5950596A (ja) | 1982-09-16 | 1982-09-16 | チツプ状電子部品およびその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5950596A (US20070244113A1-20071018-C00087.png) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235080A (ja) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | チップ型コイル部品 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61291391A (ja) * | 1985-06-18 | 1986-12-22 | 山陽海運株式会社 | パレツト荷役用吊具装置 |
| JPS63190273U (US20070244113A1-20071018-C00087.png) * | 1987-05-26 | 1988-12-07 | ||
| JP2539900B2 (ja) * | 1988-12-02 | 1996-10-02 | 新日本製鐵株式会社 | 自動玉掛け吊り具 |
| US6498561B2 (en) | 2001-01-26 | 2002-12-24 | Cornerstone Sensors, Inc. | Thermistor and method of manufacture |
-
1982
- 1982-09-16 JP JP57161275A patent/JPS5950596A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012235080A (ja) * | 2011-04-29 | 2012-11-29 | Samsung Electro-Mechanics Co Ltd | チップ型コイル部品 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5950596A (ja) | 1984-03-23 |
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