JPH03116066U - - Google Patents
Info
- Publication number
- JPH03116066U JPH03116066U JP2567490U JP2567490U JPH03116066U JP H03116066 U JPH03116066 U JP H03116066U JP 2567490 U JP2567490 U JP 2567490U JP 2567490 U JP2567490 U JP 2567490U JP H03116066 U JPH03116066 U JP H03116066U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- hole
- opening
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 239000003779 heat-resistant material Substances 0.000 claims 1
Description
第１図は本考案の一実施例を示す要部断面図、
第２図は同他の実施例を示す要部断面図、第３図
は従来の多層プリント配線基板の要部断面図であ
る。
図中、１……半田付用ランド、２……プリント
配線基板、３……配線用通電パターン、４……貫
通孔、５……フレキシブルプリント配線基板、６
……半田付、７……開孔、８……電極脚である。
FIG. 1 is a cross-sectional view of essential parts showing an embodiment of the present invention;
FIG. 2 is a sectional view of a main part showing another embodiment, and FIG. 3 is a sectional view of a main part of a conventional multilayer printed wiring board. In the figure, 1...Soldering land, 2...Printed wiring board, 3...Wiring conduction pattern, 4...Through hole, 5...Flexible printed wiring board, 6
...Soldering, 7...Open hole, 8...Electrode leg.
Claims (1)
なる半田付用ランドを備え、同半田付用ランドを
貫通する貫通孔を形成したプリント配線基板と、
配線用通電パターンを内包し、絶縁性膜で被覆さ
れ、前記半田付用ランドに対応する所に開孔を備
えたフレキシブルプリント配線基板とでなり、前
記プリント配線基板の一面にフレキシブルプリン
ト配線基板を重ね合わせ、前記貫通孔と開孔、ま
たは前記貫通孔と開孔とに電気部品の電極脚を嵌
挿し、前記貫通孔と開孔、または前記貫通孔と開
孔と電極脚とを各々半田付にて接続して成る多層
プリント配線基板。 (2) 前記フレキシブルプリント配線基板の両面
に前記プリント配線基板を重ね合わせ半田付して
成る請求項(1)記載の多層プリント配線基板。 (3) 前記フレキシブルプリント配線基板が耐熱
材料にして成る請求項(1)または(2)記載の多層プ
リント配線基板。[Scope of Claim for Utility Model Registration] (1) A printed wiring board that is provided with a soldering land connected to a conductive pattern for wiring on at least one surface, and a through hole that penetrates the soldering land,
A flexible printed wiring board that includes a conductive pattern for wiring, is covered with an insulating film, and has an opening at a location corresponding to the soldering land, and the flexible printed wiring board is provided on one surface of the printed wiring board. overlapping, inserting an electrode leg of an electrical component into the through hole and the opening, or the through hole and the opening, and soldering the through hole and the opening, or the through hole and the opening, and the electrode leg, respectively. A multilayer printed wiring board connected by . (2) The multilayer printed wiring board according to claim 1, wherein the printed wiring board is stacked and soldered on both sides of the flexible printed wiring board. (3) The multilayer printed wiring board according to claim (1) or (2), wherein the flexible printed wiring board is made of a heat-resistant material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2567490U JPH03116066U (en) | 1990-03-14 | 1990-03-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2567490U JPH03116066U (en) | 1990-03-14 | 1990-03-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03116066U true JPH03116066U (en) | 1991-12-02 |
Family
ID=31528596
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2567490U Pending JPH03116066U (en) | 1990-03-14 | 1990-03-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03116066U (en) |
-
1990
- 1990-03-14 JP JP2567490U patent/JPH03116066U/ja active Pending