JPH03104779U - - Google Patents
Info
- Publication number
- JPH03104779U JPH03104779U JP1348290U JP1348290U JPH03104779U JP H03104779 U JPH03104779 U JP H03104779U JP 1348290 U JP1348290 U JP 1348290U JP 1348290 U JP1348290 U JP 1348290U JP H03104779 U JPH03104779 U JP H03104779U
- Authority
- JP
- Japan
- Prior art keywords
- conductive foil
- foil circuit
- soldering part
- soldering
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図は本考案のプリント基板装置の概要を説
明するための一部省略一部断面側面図、第２図は
同一部省略一部断面裏面図、第３図は従来例を示
す一部省略一部断面側面図である。
１……電気部品、２……プリント基板、１１…
…端子、２１……導電箔回路、２２……透孔、２
３……第１のハンダ付部、２４……保護皮膜、２
５……第２のハンダ付部。
Fig. 1 is a partially omitted partially sectional side view for explaining the outline of the printed circuit board device of the present invention, Fig. 2 is a partially omitted partially sectional rear view of the same partially omitted, and Fig. 3 is a partially omitted part showing a conventional example. FIG. 3 is a partially sectional side view. 1...Electrical component, 2...Printed circuit board, 11...
...Terminal, 21...Conductive foil circuit, 22...Through hole, 2
3...First soldering part, 24...Protective film, 2
5...Second soldering part.
Claims (1)
箔回路に接する透孔とを備えたプリント基板と、
同導電箔回路用の保護皮膜と、同導電箔回路にそ
れぞれ形成した複数のハンダ付部とから成り、前
記導電箔回路が少なくとも前記電気部品の直下ま
たは同直下に近設して形成され、前記ハンダ付部
が前記導電箔回路と前記端子とを介在する第１の
ハンダ付部と、同第１のハンダ付部に近設し、前
記保護皮膜により周囲を隔離した第２のハンダ付
部とから成ることを特徴とするプリント基板装置
。 an electrical component having a terminal; a printed circuit board having a conductive foil circuit; and a through hole in contact with the conductive foil circuit;
The conductive foil circuit comprises a protective film for the conductive foil circuit and a plurality of soldering parts formed on the conductive foil circuit, and the conductive foil circuit is formed at least directly under or adjacent to the electric component, and a first soldering part in which the soldering part interposes the conductive foil circuit and the terminal; and a second soldering part located close to the first soldering part and isolated from the periphery by the protective film. A printed circuit board device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1348290U JPH03104779U (en) | 1990-02-14 | 1990-02-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1348290U JPH03104779U (en) | 1990-02-14 | 1990-02-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03104779U true JPH03104779U (en) | 1991-10-30 |
Family
ID=31516897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1348290U Pending JPH03104779U (en) | 1990-02-14 | 1990-02-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03104779U (en) |
-
1990
- 1990-02-14 JP JP1348290U patent/JPH03104779U/ja active Pending