JPH03116050U - - Google Patents

Info

Publication number
JPH03116050U
JPH03116050U JP2478190U JP2478190U JPH03116050U JP H03116050 U JPH03116050 U JP H03116050U JP 2478190 U JP2478190 U JP 2478190U JP 2478190 U JP2478190 U JP 2478190U JP H03116050 U JPH03116050 U JP H03116050U
Authority
JP
Japan
Prior art keywords
lead
jig
circuit package
leads
twisting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2478190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP2478190U priority Critical patent/JPH03116050U/ja
Publication of JPH03116050U publication Critical patent/JPH03116050U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の回路パツケージの実施例、第
2図は本考案の治具の側面図、第3図は下側治具
の一部拡大斜視図、第4図は治具の突起側からみ
た平面図、第5図は従来の回路パツケージを示す
図である。 図中、1……回路パツケージ、2……リード、
3……パツド、4……プリント板、5,7……突
起、7a……急斜面、7b……緩斜面、7c……
溝である。
Figure 1 is an embodiment of the circuit package of the present invention, Figure 2 is a side view of the jig of the present invention, Figure 3 is a partially enlarged perspective view of the lower jig, and Figure 4 is the protrusion side of the jig. FIG. 5 is a plan view of a conventional circuit package. In the figure, 1... circuit package, 2... lead,
3... Padded, 4... Printed board, 5, 7... Protrusion, 7a... Steep slope, 7b... Gentle slope, 7c...
It's a groove.

Claims (1)

【実用新案登録請求の範囲】 (1) 複数のリードを具備する回路パツケージ1
において、、厚み部分がパツドに接触する様に該
複数のリード2を捩じつた形状とすることを特徴
とする回路パツケージ。 (2) 請求項1記載の回路パツケージのリードを
捻るための治具であつて、先端部に、一方の面は
急斜面7aとし、他方の面は緩斜面7bとした突
起を所定の幅の溝7cを該リードと対向する位置
に形成するように、複数個所定の間隔をもつて配
置したことを特徴とするリード捻り治具。
[Claims for Utility Model Registration] (1) Circuit package 1 having multiple leads
A circuit package characterized in that the plurality of leads 2 have a twisted shape so that a thick portion contacts a pad. (2) A jig for twisting the leads of a circuit package according to claim 1, wherein a protrusion having a steep slope 7a on one side and a gentle slope 7b on the other side is provided at the tip with a groove of a predetermined width. A lead twisting jig characterized in that a plurality of lead twisting jig are arranged at a predetermined interval so that the lead twisting jig is formed at a position facing the lead.
JP2478190U 1990-03-12 1990-03-12 Pending JPH03116050U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2478190U JPH03116050U (en) 1990-03-12 1990-03-12

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2478190U JPH03116050U (en) 1990-03-12 1990-03-12

Publications (1)

Publication Number Publication Date
JPH03116050U true JPH03116050U (en) 1991-12-02

Family

ID=31527732

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2478190U Pending JPH03116050U (en) 1990-03-12 1990-03-12

Country Status (1)

Country Link
JP (1) JPH03116050U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012001843A1 (en) * 2010-06-28 2012-01-05 株式会社エス・ケー・ジー Illumination device
JP2018110143A (en) * 2016-12-28 2018-07-12 三菱電機株式会社 Semiconductor device, power converter, lead frame, and manufacturing method of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012001843A1 (en) * 2010-06-28 2012-01-05 株式会社エス・ケー・ジー Illumination device
JP2018110143A (en) * 2016-12-28 2018-07-12 三菱電機株式会社 Semiconductor device, power converter, lead frame, and manufacturing method of semiconductor device

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