JPH03115664U - - Google Patents
Info
- Publication number
- JPH03115664U JPH03115664U JP2302390U JP2302390U JPH03115664U JP H03115664 U JPH03115664 U JP H03115664U JP 2302390 U JP2302390 U JP 2302390U JP 2302390 U JP2302390 U JP 2302390U JP H03115664 U JPH03115664 U JP H03115664U
- Authority
- JP
- Japan
- Prior art keywords
- lamp
- case
- processing
- hood
- reflector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000001816 cooling Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 1
- 238000001020 plasma etching Methods 0.000 claims 1
Description
第１図は本考案の一実施例を示す部分立断面図
、第２図は平面図、第３図は第１図のＡ部拡大図
、第４図は従来例の正面図、第５図は同前平面図
、第６図は該従来例に於ける処理ユニツトの１例
を示す立断面図、第７図は同前ランプ加熱ユニツ
トの一部を破断した立面図である。
１は真空容器、９はカソード電極、９は小室、
３８は筒壁、４１はランプ本体、４２はランプユ
ニツト、４４はケース、５５はスクリーン、５８
は反射鏡、５９はフード、６０はフアン、１２１
はプラズマ加熱ユニツト、１３１はランプ加熱ユ
ニツトを示す。
Figure 1 is a partial elevational sectional view showing one embodiment of the present invention, Figure 2 is a plan view, Figure 3 is an enlarged view of section A in Figure 1, Figure 4 is a front view of the conventional example, and Figure 5. 6 is an elevational sectional view showing one example of the processing unit in the conventional example, and FIG. 7 is an elevational view with a part of the lamp heating unit cut away. 1 is a vacuum container, 9 is a cathode electrode, 9 is a small chamber,
38 is a cylinder wall, 41 is a lamp body, 42 is a lamp unit, 44 is a case, 55 is a screen, 58
is a reflector, 59 is a hood, 60 is a fan, 121
131 represents a plasma heating unit, and 131 represents a lamp heating unit.
Claims (1)
、これら処理ステーシヨンでプラズマエツチング
、ランプ加熱、プラズマ処理等を行う様にした半
導体デバイスの処理装置に於いて、前記ランプ加
熱を行うランプユニツトを気密に構成したケース
にランプ本体を収納せしめ、該ケースを真空容器
内に独立気密な小室を画成する筒壁内部に取付け
構成したことを特徴とする半導体デバイスの処理
装置。 ２ ランプ本体に冷却用フアンを設けると共にラ
ンプの反射鏡の周りにフードを取付け、該冷却用
フアンにより反射鏡とフードとの間隙に空気を流
通せしめる様構成した請求項第１項記載の半導体
デバイスの処理装置。 ３ ランプ本体を収納するケースに真空容器内に
露出する金属製多孔のスクリーンを設け、該スク
リーンと真空容器側に設けた電極との間で高周波
放電を行う様構成した請求項第１項記載の半導体
デバイスの処理装置。[Claims for Utility Model Registration] 1. In a semiconductor device processing apparatus having a plurality of processing stations in a vacuum container, in which plasma etching, lamp heating, plasma processing, etc. are performed, A processing apparatus for semiconductor devices, characterized in that a lamp unit for heating is housed in an airtight case, and the case is attached inside a cylindrical wall defining an independent airtight chamber in a vacuum container. . 2. The semiconductor device according to claim 1, wherein a cooling fan is provided in the lamp body and a hood is attached around the reflector of the lamp, and the cooling fan allows air to flow through the gap between the reflector and the hood. processing equipment. 3. The lamp according to claim 1, wherein the case for storing the lamp body is provided with a metal porous screen exposed inside the vacuum vessel, and the high-frequency discharge is generated between the screen and an electrode provided on the vacuum vessel side. Processing equipment for semiconductor devices.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2302390U JPH03115664U (en) | 1990-03-07 | 1990-03-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2302390U JPH03115664U (en) | 1990-03-07 | 1990-03-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03115664U true JPH03115664U (en) | 1991-11-29 |
Family
ID=31526026
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2302390U Pending JPH03115664U (en) | 1990-03-07 | 1990-03-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03115664U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000024047A1 (en) * | 1998-10-22 | 2000-04-27 | Kabushiki Kaisha Ultraclean Technology Research Institute | Semiconductor manufacturing apparatus |
| JP2007169977A (en) * | 2005-12-20 | 2007-07-05 | Nippon Comsys Corp | Road sign |
-
1990
- 1990-03-07 JP JP2302390U patent/JPH03115664U/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000024047A1 (en) * | 1998-10-22 | 2000-04-27 | Kabushiki Kaisha Ultraclean Technology Research Institute | Semiconductor manufacturing apparatus |
| EP1065709A1 (en) * | 1998-10-22 | 2001-01-03 | Kabushiki Kaisha Ultraclean Technology Research Institute | Semiconductor manufacturing apparatus |
| EP1065709A4 (en) * | 1998-10-22 | 2007-10-31 | Ultraclean Technology Res Inst | Semiconductor manufacturing apparatus |
| JP2007169977A (en) * | 2005-12-20 | 2007-07-05 | Nippon Comsys Corp | Road sign |
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