JPH03106758U - - Google Patents

Info

Publication number
JPH03106758U
JPH03106758U JP1447490U JP1447490U JPH03106758U JP H03106758 U JPH03106758 U JP H03106758U JP 1447490 U JP1447490 U JP 1447490U JP 1447490 U JP1447490 U JP 1447490U JP H03106758 U JPH03106758 U JP H03106758U
Authority
JP
Japan
Prior art keywords
conductive layer
hole
substrate
resin
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1447490U
Other languages
English (en)
Other versions
JP2515647Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1447490U priority Critical patent/JP2515647Y2/ja
Publication of JPH03106758U publication Critical patent/JPH03106758U/ja
Application granted granted Critical
Publication of JP2515647Y2 publication Critical patent/JP2515647Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Multi-Conductor Connections (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第1図は本考案に係る半導体パツケージの端子
の一実施例を示す断面図である。 1……回路パターン、1a……端子パターン、
2……基板、3……電子部品、4……樹脂、4a
……スルーホール、5……半導体パツケージ、6
……表面導電層、7……導電層。

Claims (1)

    【実用新案登録請求の範囲】
  1. 所定の回路パターン1を形成した基板2に、各
    種電子部品3及び端子を実装し、樹脂4で封止し
    た半導体パツケージの端子において、封止した前
    記樹脂4は、前記基板2面に到達する略垂直方向
    のスルーホール4aを形成し、前記樹脂4の表面
    における前記スルーホール4aの周囲に表面導電
    層6を形成し、前記基板2上の回路パターン1と
    前記表面導電層6との間を導通する導電層7を、
    前記スルーホール4a内面に固定したことを特徴
    とする半導体パツケージの端子。
JP1447490U 1990-02-16 1990-02-16 半導体パッケージの端子 Expired - Lifetime JP2515647Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1447490U JP2515647Y2 (ja) 1990-02-16 1990-02-16 半導体パッケージの端子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1447490U JP2515647Y2 (ja) 1990-02-16 1990-02-16 半導体パッケージの端子

Publications (2)

Publication Number Publication Date
JPH03106758U true JPH03106758U (ja) 1991-11-05
JP2515647Y2 JP2515647Y2 (ja) 1996-10-30

Family

ID=31517838

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1447490U Expired - Lifetime JP2515647Y2 (ja) 1990-02-16 1990-02-16 半導体パッケージの端子

Country Status (1)

Country Link
JP (1) JP2515647Y2 (ja)

Also Published As

Publication number Publication date
JP2515647Y2 (ja) 1996-10-30

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