JPS63136378U - - Google Patents
Info
- Publication number
- JPS63136378U JPS63136378U JP2857287U JP2857287U JPS63136378U JP S63136378 U JPS63136378 U JP S63136378U JP 2857287 U JP2857287 U JP 2857287U JP 2857287 U JP2857287 U JP 2857287U JP S63136378 U JPS63136378 U JP S63136378U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- component mounting
- semiconductor substrate
- lead terminal
- lands
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例の斜視図である。
１１……Ａｌ２Ｏ３基板、１２……電子部品搭
載ランド、１３……リード端子ランド、１４ａ，
１４ｂ……溝。
載ランド、１３……リード端子ランド、１４ａ，
１４ｂ……溝。
Claims (1)
- 絶縁性の半導体基板と、該半導体基板上に形成
された電子部品搭載ランドとリード端子ランドと
、少くとも前記電子部品搭載ランド間と前記リー
ド端子ランド間に設けた溝とを有することを特徴
とする混成集積回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2857287U JPS63136378U (ja) | 1987-02-26 | 1987-02-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2857287U JPS63136378U (ja) | 1987-02-26 | 1987-02-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63136378U true JPS63136378U (ja) | 1988-09-07 |
Family
ID=30831659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2857287U Pending JPS63136378U (ja) | 1987-02-26 | 1987-02-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63136378U (ja) |
-
1987
- 1987-02-26 JP JP2857287U patent/JPS63136378U/ja active Pending