JPH03106734U - - Google Patents
Info
- Publication number
- JPH03106734U JPH03106734U JP1509390U JP1509390U JPH03106734U JP H03106734 U JPH03106734 U JP H03106734U JP 1509390 U JP1509390 U JP 1509390U JP 1509390 U JP1509390 U JP 1509390U JP H03106734 U JPH03106734 U JP H03106734U
- Authority
- JP
- Japan
- Prior art keywords
- ring
- wafer
- cathode electrode
- pressed against
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims 4
- 238000001020 plasma etching Methods 0.000 claims 2
- 239000012495 reaction gas Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1509390U JPH03106734U (cs) | 1990-02-17 | 1990-02-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1509390U JPH03106734U (cs) | 1990-02-17 | 1990-02-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106734U true JPH03106734U (cs) | 1991-11-05 |
Family
ID=31518418
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1509390U Pending JPH03106734U (cs) | 1990-02-17 | 1990-02-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106734U (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012099829A (ja) * | 2005-06-20 | 2012-05-24 | Lam Research Corporation | ポリマーの堆積を低減するためのｒｆ吸収材料を含むプラズマ閉じ込めリング |
-
1990
- 1990-02-17 JP JP1509390U patent/JPH03106734U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012099829A (ja) * | 2005-06-20 | 2012-05-24 | Lam Research Corporation | ポリマーの堆積を低減するためのｒｆ吸収材料を含むプラズマ閉じ込めリング |
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