JPH03106643A - Object having insulating resin layer - Google Patents
Object having insulating resin layerInfo
- Publication number
- JPH03106643A JPH03106643A JP1243445A JP24344589A JPH03106643A JP H03106643 A JPH03106643 A JP H03106643A JP 1243445 A JP1243445 A JP 1243445A JP 24344589 A JP24344589 A JP 24344589A JP H03106643 A JPH03106643 A JP H03106643A
- Authority
- JP
- Japan
- Prior art keywords
- insulating resin
- metal
- resin layer
- layer
- metal material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 71
- 229920005989 resin Polymers 0.000 title claims abstract description 71
- 239000007769 metal material Substances 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 31
- 229910052751 metal Inorganic materials 0.000 claims abstract description 31
- 239000000853 adhesive Substances 0.000 claims abstract description 21
- 230000001070 adhesive effect Effects 0.000 claims abstract description 18
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 14
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 abstract description 79
- 229910000881 Cu alloy Inorganic materials 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 3
- 229920001721 polyimide Polymers 0.000 abstract description 3
- 239000009719 polyimide resin Substances 0.000 abstract description 3
- 239000012790 adhesive layer Substances 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 238000000926 separation method Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野〕
本発明は，たとえば導電性のコンタクト等の金属素材に
絶縁樹脂層を設けた，物体．即ち，絶縁樹脂層付物体に
関する。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an object, such as a conductive contact, in which an insulating resin layer is provided on a metal material. That is, it relates to an object with an insulating resin layer.
［従来の技術］
従来，第５図の試料Ａとして示すように．金属索材１の
表面に絶縁樹脂層３を形成した物体がある。ここで金属
索材１としては銅合金の薄い板が用いられている。絶縁
樹脂層３はポリイミド樹脂よりなる絶縁樹脂接着剤を金
属素材１に約１０μ鵬程度の厚みに塗着することで作ら
れている。[Prior Art] Conventionally, as shown as sample A in Fig. 5. There is an object in which an insulating resin layer 3 is formed on the surface of a metal rope material 1. Here, as the metal cable material 1, a thin plate of copper alloy is used. The insulating resin layer 3 is made by applying an insulating resin adhesive made of polyimide resin to the metal material 1 to a thickness of about 10 μm.
この絶縁樹脂層付物体は，たとえば．導電性のコンクト
として用いられ得る。実際にコンタクトを作るには．第
６図及び第７図に示すように，薄い帯状の金属素材１を
洗浄して汚れを落した後に，この金属素材１の表面に絶
縁樹脂接着剤を塗着して絶縁樹脂層３を形成する。次に
金属素材１を長手方向の一例に送りつつプレス機によっ
てコンタクトの展開形状を打抜く。そして，展開形状の
コンタクトを曲げ加工を施して所定形状のコンタクトを
得る。This object with an insulating resin layer is, for example. Can be used as a conductive conduit. To actually make contact. As shown in FIGS. 6 and 7, after cleaning a thin strip-shaped metal material 1 to remove dirt, an insulating resin adhesive is applied to the surface of the metal material 1 to form an insulating resin layer 3. do. Next, while feeding the metal material 1 in the longitudinal direction, the developed shape of the contact is punched out using a press machine. Then, the developed contacts are bent to obtain contacts of a predetermined shape.
これによれば．コンタクトの所定部分に絶縁樹脂層３を
形成できる。According to this. An insulating resin layer 3 can be formed on a predetermined portion of the contact.
しかしながら．絶縁樹脂層３は金属素材１に直接塗着さ
れているため．接着力が弱く、金属素材１に曲げ加工な
どを施したとき、絶縁樹脂層３が比較的簡単に剥離して
しまうという問題がある。however. This is because the insulating resin layer 3 is directly applied to the metal material 1. There is a problem in that the adhesive strength is weak, and when the metal material 1 is subjected to bending or the like, the insulating resin layer 3 peels off relatively easily.
即ち，第５図に示す試料Ａを用いて絶縁樹脂層３の剥離
性について，第８図に示す剥離試験を実施すると，接着
力が弱いために剥離することがある。具体的には，金属
素材１に１８０＠の密着曲げを施し，その曲り部９にテ
ープを貼り付けた後にテープを剥すと絶縁樹脂層３に剥
離部１１ができる。That is, when the peeling test shown in FIG. 8 is carried out to check the peelability of the insulating resin layer 3 using sample A shown in FIG. 5, peeling may occur due to the weak adhesive force. Specifically, a peeled part 11 is formed in the insulating resin layer 3 when the metal material 1 is bent by 180@, a tape is pasted on the bent part 9, and then the tape is peeled off.
これは、銅合金などの金属素材では、その表面に自然生
成される金属酸化物が脆くて剥離し易いということに原
因があると考えられる。すなわち絶縁材料３は、実際に
は、金属素材１の上に直接形威されるわけではなく、そ
の表面に自然生成された金属酸化物の上に形成される。This is thought to be due to the fact that metal oxides naturally generated on the surface of metal materials such as copper alloys are brittle and easily peel off. That is, the insulating material 3 is not actually formed directly on the metal material 1, but on the metal oxide naturally generated on its surface.
その場合に、絶縁樹脂接着剤は金属酸化物に対して接着
性はよいのであるが銅合金の上に自然生成される金属酸
化物は上述のように脆くて剥離し易いため、金属素材１
に曲げ加工などを施すとその部分の金属酸化物が剥離し
、絶縁樹脂層３が剥離してしまう。In that case, the insulating resin adhesive has good adhesion to metal oxides, but the metal oxides that are naturally formed on the copper alloy are brittle and easily peel off, so the metal material 1
If a bending process or the like is performed on the metal oxide, the metal oxide in that part will peel off, and the insulating resin layer 3 will peel off.
それ故に本発明の課題は，金属素材と絶縁樹脂接着層と
の接着性を向上した絶縁樹脂層付物体を提供することに
ある。Therefore, an object of the present invention is to provide an object with an insulating resin layer that has improved adhesiveness between a metal material and an insulating resin adhesive layer.
［課題を解決するための手段］
本発明によれば，金属素材上に密着性のよい金属酸化物
を生成する金属層を形成し，該金属層の上に絶縁樹脂接
着剤を塗着したことを特徴とする絶縁樹脂層付物体が得
られる。[Means for Solving the Problems] According to the present invention, a metal layer that generates a metal oxide with good adhesion is formed on a metal material, and an insulating resin adhesive is applied on the metal layer. An object with an insulating resin layer characterized by the following is obtained.
［実施例］
第１図は本発明の一実施例による絶縁樹脂層付物体を試
料Ｂとして示す。この絶縁樹脂層付物体において，第５
図と同じ部分には同じ符号を付して説明を省略する。[Example] FIG. 1 shows, as sample B, an object with an insulating resin layer according to an example of the present invention. In this object with an insulating resin layer, the fifth
The same parts as in the figures are given the same reference numerals, and the explanation will be omitted.
第１図を参照して，この絶縁樹脂層付物体は，金属素材
１の一側に形成されている金属層５を含んでいる。金属
層５の上には絶縁樹脂層３が形成されている。金属素材
１としては銅合金の薄い板が用いられている。金属層５
の材料は表面に密着性のよい金属酸化物を生成するＮｉ
を用いる。金属層５の厚みは約０，ｌμ−程度である。Referring to FIG. 1, this object with an insulating resin layer includes a metal layer 5 formed on one side of a metal material 1. As shown in FIG. An insulating resin layer 3 is formed on the metal layer 5. As the metal material 1, a thin plate of copper alloy is used. metal layer 5
The material is Ni, which forms a metal oxide with good adhesion on the surface.
Use. The thickness of the metal layer 5 is approximately 0.1μ.
絶縁樹脂層３はポリイミド樹脂系接着剤が用いられてい
る。The insulating resin layer 3 is made of polyimide resin adhesive.
絶縁樹脂層３の厚みは約１０μ層程度である。The thickness of the insulating resin layer 3 is approximately 10 μm.
この絶縁樹脂層付物体は、一例として第２図に示す製造
工程によって作る。This object with an insulating resin layer is manufactured by the manufacturing process shown in FIG. 2 as an example.
まず，第２図（１〉に示す金属素材１の全面を洗浄して
汚れを落した後に，その金属素材１の全面に第２図〈２
）に示すＮｉメッキ処理を施して金属層５を形成する。First, after washing the entire surface of the metal material 1 shown in FIG. 2 (1) to remove dirt, the entire surface of the metal material 1 shown in FIG.
) is performed to form the metal layer 5.
次に金属層５の上には第２図（３）に示すように絶縁を
必要とする部分に絶縁樹脂接着剤を塗着する。絶縁樹脂
接着剤の金属層５への塗着は，絶縁樹脂接着剤を塗布し
たローラあるいは絶縁樹脂接着剤を噴出するノズルなど
を用いて行なわれる。金属層５に塗着した絶縁樹脂接着
剤は乾燥すると固まり，絶縁樹脂層３となる。その後に
，第２図（４）に示すように．絶縁樹脂層３を塗着した
部分を残して金属層５を剥離する。さらに．金属層５を
剥離した部分の金属素材１を洗浄して絶縁樹脂層付物体
を作る。得られた絶縁樹脂層付物体（試料Ｂ）を第５図
の試料Ａと同じ条件により剥離試験を行った結果は下記
の通りである。Next, on the metal layer 5, as shown in FIG. 2(3), an insulating resin adhesive is applied to the parts requiring insulation. The insulating resin adhesive is applied to the metal layer 5 using a roller coated with the insulating resin adhesive or a nozzle that sprays the insulating resin adhesive. When the insulating resin adhesive applied to the metal layer 5 dries, it hardens and becomes the insulating resin layer 3 . After that, as shown in Figure 2 (4). The metal layer 5 is peeled off leaving the part to which the insulating resin layer 3 is applied. moreover. The part of the metal material 1 from which the metal layer 5 has been peeled off is cleaned to produce an object with an insulating resin layer. The obtained object with an insulating resin layer (Sample B) was subjected to a peel test under the same conditions as Sample A in FIG. 5, and the results are as follows.
まず，金属素材１に、第３図に示すように１８０＠の密
着曲げを施して．その曲げ部９の剥離状態を確認してみ
たところ剥離が起らない。次に，曲げ部９にテープを貼
り付けた後に，そのテープを剥して剥離状態を確認した
ところ．剥離は全くない。このため，第５図に示した試
料Ａに比べて絶縁樹脂層３の接着性は向上していること
が確認できた。First, the metal material 1 is bent by 180@ as shown in Fig. 3. When checking the peeling state of the bent portion 9, no peeling occurred. Next, after applying tape to the bent portion 9, the tape was peeled off to check the peeling condition. There is no peeling at all. Therefore, it was confirmed that the adhesiveness of the insulating resin layer 3 was improved compared to sample A shown in FIG.
このように、本実施例では、金属素材１の上に密着性の
よい金属酸化物を生成する金属層５を形成し、その上に
絶縁樹脂接着剤を塗着して絶縁樹脂層３を形成するよう
にしたので、金属素材１と絶縁樹脂層３との接着性が向
上し、金属素材１に曲げ加工などを施しても、従来のよ
うに絶縁樹脂層３が剥離してしまうということはない。As described above, in this embodiment, the metal layer 5 that generates a metal oxide with good adhesion is formed on the metal material 1, and the insulating resin layer 3 is formed by applying an insulating resin adhesive thereon. As a result, the adhesion between the metal material 1 and the insulating resin layer 3 is improved, and even if the metal material 1 is bent, the insulating resin layer 3 does not peel off as in the past. do not have.
なお、Ｎｉに代えて、Ｃｒ，ｋｌなどを用いることがで
きる。Note that Cr, kl, etc. can be used instead of Ni.
次に，この絶縁樹脂層付物体を導電性のコンタクトに応
用した例について述べる。Next, we will discuss an example of applying this object with an insulating resin layer to a conductive contact.
第４図（１）に示すように．薄い帯板状の金属素材１の
表面及び裏面には，長手方向にのびた帯状の金属層（図
示せず）の上に金属樹脂層３が形成されている。金属素
材１を長手方向の一側に送りつつ，プレス機によって打
ち抜くことで，第４図（２〉に示す展開形状のコンタク
ト１３を得ることができる。各コンタクト１３の一端は
連結部１５に接続されている。各コンタクト１３には絶
縁樹脂層３が所定の位置に形成されている。As shown in Figure 4 (1). On the front and back surfaces of the thin strip-shaped metal material 1, a metal resin layer 3 is formed on a strip-shaped metal layer (not shown) extending in the longitudinal direction. By punching the metal material 1 with a press while feeding it to one side in the longitudinal direction, the contacts 13 in the developed shape shown in FIG. An insulating resin layer 3 is formed on each contact 13 at a predetermined position.
その後に．コンタクト１３を連結部１５から切り離して
，曲げ加工を施すと，第４図（３）に示すコンタクト１
３が得られる。コンタクト１３は保持部１７と，この保
持１ｓ１７の両端から同じ向きに曲げられた端子部１９
及び接触部２ｌとを有している。After that. When the contact 13 is separated from the connecting portion 15 and bent, the contact 1 shown in FIG. 4 (3) is obtained.
3 is obtained. The contact 13 includes a holding part 17 and a terminal part 19 bent in the same direction from both ends of the holding part 1s17.
and a contact portion 2l.
さらに，各コンタクト１３を基板２３の回路に端子部１
９を当接した状態にして基板２３に実装する。そして端
子部１９と回路とを第４図（４〉に示すようにハンダ２
５により接続する。この場合，絶縁樹脂層３が保持部ｌ
７に設けられているため，端子部１つのハンダ２５が上
昇して接触ＩＭ２１に接触するのを阻止できる。このた
め，必要量のハンダ２５が端子部１３と基板２３とに付
くため．コンタクト１３と基板２３との実装状態が安定
する。Furthermore, each contact 13 is connected to the terminal portion 1 of the circuit on the board 23.
9 is in contact with each other and mounted on the board 23. Then, connect the terminal portion 19 and the circuit with solder 2 as shown in FIG. 4 (4).
Connect by 5. In this case, the insulating resin layer 3
7, it is possible to prevent the solder 25 of one terminal portion from rising and contacting the contact IM 21. Therefore, the necessary amount of solder 25 is attached to the terminal portion 13 and the board 23. The mounting state between the contacts 13 and the substrate 23 is stabilized.
さらに各コンタクトの接触部２１には第４図（５）に示
すようにＬＳＩ基板などの相手側基板２７が搭載される
。これによって．基板２３とし相手側の基板２７とは互
いに電気的に接続される。Furthermore, a mating board 27 such as an LSI board is mounted on the contact portion 21 of each contact, as shown in FIG. 4(5). by this. The substrate 23 and the mating substrate 27 are electrically connected to each other.
［発明の効果】
以上実施例により説明したように本発明の絶縁樹脂層付
物体によれば，金属素材に密着性のよい金属酸化物を生
成する金属層を形成し．その上に絶縁樹脂接着剤を塗着
して絶縁樹脂層を形或してあるため，金属素材と絶縁樹
脂層との接着性が向上する。[Effects of the Invention] As explained above using the examples, according to the article with an insulating resin layer of the present invention, a metal layer that generates a metal oxide with good adhesion to a metal material is formed. Since the insulating resin layer is formed by applying an insulating resin adhesive thereon, the adhesion between the metal material and the insulating resin layer is improved.
第１図は本発明の一実施例による絶縁樹脂層付物体の断
面図．第２図は本発明の一実施例による絶縁樹脂層付物
体の形成工程を示し，第２図（１）は金属素材の断面図
．第２図（２〉は金属素材に金属層を形成した状態を示
す断面図，第２図（３）は第２図（２〉の金属層上に絶
縁樹脂層を形成した状態を示す断面図，第２図（４〉は
金属層を剥離した状態を示す断面図，第３図は第１図の
絶縁樹脂層付物体に曲げ加工を施した状態の断面図，第
４図は本発明の一実施例による絶縁樹脂層付物体により
製造したコンタクトの成形工程及びそのコンタクトを基
板に実装した状態を示し，第４図（１）は金属素材に絶
縁樹脂層を形成した状態の平面図．第４図（２）は第４
図（１）の金属素材を打ち抜いた状態の平面図，第４図
（３〉は第４図（２〉のコンタクトを切断して曲げ加工
を施した状態の斜視図．第４図《４）は第４図（３〉の
コンタクトを基板に実装した状態の断面図．第４図（５
）は第４図（４〉のコンタクトの上に相手側基板を搭載
した状態を示す断面図，第５図は従来の絶縁樹脂層付物
体の断面図，第６図は従来の絶縁樹脂層付物体によりコ
ンタクトを製造する際の金属素材及び絶縁樹脂層の平面
図．第７図は第６図のｖｔ−ｖｔ断面図，第８図は第５
図の絶縁樹脂層付物体に曲げ加工を施した状態の断面図
である。
１；金属素材，３；絶縁樹脂層，５：金属層．９；曲げ
部．１３；コンタクト．２３；基板，２５；ハンダ。
箇
１
図
第４図
−２５４ 一
第５図
第６図
第７図FIG. 1 is a cross-sectional view of an object with an insulating resin layer according to an embodiment of the present invention. Figure 2 shows the process of forming an object with an insulating resin layer according to an embodiment of the present invention, and Figure 2 (1) is a cross-sectional view of the metal material. Figure 2 (2) is a cross-sectional view showing a state in which a metal layer is formed on a metal material, and Figure 2 (3) is a cross-sectional view showing a state in which an insulating resin layer is formed on the metal layer in Figure 2 (2). , Fig. 2 (4) is a cross-sectional view showing the state in which the metal layer has been peeled off, Fig. 3 is a cross-sectional view showing the state in which the object with the insulating resin layer of Fig. 1 is bent, and Fig. 4 is a cross-sectional view showing the state in which the object with the insulating resin layer of Fig. 1 is bent. FIG. 4(1) is a plan view of a state in which an insulating resin layer is formed on a metal material. Figure 4 (2) is the fourth
A plan view of the metal material in Figure (1) punched out, Figure 4 (3) is a perspective view of the contact in Figure 4 (2) cut and bent. Figure 4 (4) is a cross-sectional view of the contact shown in Figure 4 (3) mounted on the board. Figure 4 (5)
) is a cross-sectional view showing the mating board mounted on the contact in Figure 4 (4), Figure 5 is a cross-sectional view of a conventional object with an insulating resin layer, and Figure 6 is a cross-sectional view of a conventional object with an insulating resin layer. A plan view of a metal material and an insulating resin layer when manufacturing a contact using an object. Figure 7 is a vt-vt cross-sectional view of Figure 6, and Figure 8 is a cross-sectional view of Figure 5.
FIG. 3 is a cross-sectional view of the object with an insulating resin layer shown in the figure after being bent. 1: Metal material, 3: Insulating resin layer, 5: Metal layer. 9; Bending part. 13; Contact. 23; board, 25; solder. Section 1 Figure 4-254 - Figure 5 Figure 6 Figure 7
Claims (1)
属層を形成し、該金属層の上に絶縁樹脂接着剤を塗着し
たことを特徴とする絶縁樹脂層付物体。1. An object with an insulating resin layer, characterized in that a metal layer that produces a metal oxide with good adhesion is formed on a metal material, and an insulating resin adhesive is applied on the metal layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1243445A JPH03106643A (en) | 1989-09-21 | 1989-09-21 | Object having insulating resin layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1243445A JPH03106643A (en) | 1989-09-21 | 1989-09-21 | Object having insulating resin layer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03106643A true JPH03106643A (en) | 1991-05-07 |
Family
ID=17103984
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1243445A Pending JPH03106643A (en) | 1989-09-21 | 1989-09-21 | Object having insulating resin layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03106643A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029488A (en) * | 1983-07-29 | 1985-02-14 | Yamaha Motor Co Ltd | Surface treated structure for parts of exhaust system of internal combustion engine |
| JPS6184093A (en) * | 1984-10-01 | 1986-04-28 | 東洋アルミニウム株式会社 | Manufacture of base material for electric circuit |
| JPS6227557A (en) * | 1985-07-27 | 1987-02-05 | Kobe Steel Ltd | High-mn nonmagnetic steel for very low temperature use excellent in electron beam weldability |
| JPS63286580A (en) * | 1987-02-24 | 1988-11-24 | ポリオニクス・コーポレイション | Metal coated laminate product formed from polyimide film having surface pattern |
| JPS63302544A (en) * | 1987-06-02 | 1988-12-09 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
-
1989
- 1989-09-21 JP JP1243445A patent/JPH03106643A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029488A (en) * | 1983-07-29 | 1985-02-14 | Yamaha Motor Co Ltd | Surface treated structure for parts of exhaust system of internal combustion engine |
| JPS6184093A (en) * | 1984-10-01 | 1986-04-28 | 東洋アルミニウム株式会社 | Manufacture of base material for electric circuit |
| JPS6227557A (en) * | 1985-07-27 | 1987-02-05 | Kobe Steel Ltd | High-mn nonmagnetic steel for very low temperature use excellent in electron beam weldability |
| JPS63286580A (en) * | 1987-02-24 | 1988-11-24 | ポリオニクス・コーポレイション | Metal coated laminate product formed from polyimide film having surface pattern |
| JPS63302544A (en) * | 1987-06-02 | 1988-12-09 | Mitsubishi Electric Corp | Lead frame for semiconductor device |
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