JP2002110750A - Method for manufacturing electronic component, and its connection structure - Google Patents
Method for manufacturing electronic component, and its connection structureInfo
- Publication number
- JP2002110750A JP2002110750A JP2000298349A JP2000298349A JP2002110750A JP 2002110750 A JP2002110750 A JP 2002110750A JP 2000298349 A JP2000298349 A JP 2000298349A JP 2000298349 A JP2000298349 A JP 2000298349A JP 2002110750 A JP2002110750 A JP 2002110750A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- oxide layer
- conductive paste
- surface oxide
- connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L24/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/36—Structure, shape, material or disposition of the strap connectors prior to the connecting process
- H01L2224/37—Structure, shape, material or disposition of the strap connectors prior to the connecting process of an individual strap connector
- H01L2224/37001—Core members of the connector
- H01L2224/3701—Shape
- H01L2224/37011—Shape comprising apertures or cavities
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73221—Strap and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/84—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a strap connector
- H01L2224/8434—Bonding interfaces of the connector
- H01L2224/84345—Shape, e.g. interlocking features
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01047—Silver [Ag]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1305—Bipolar Junction Transistor [BJT]
- H01L2924/13055—Insulated gate bipolar transistor [IGBT]
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、電子部品の製造
方法並びに接続構造に関するものであり、特に複数の電
極間を導電性接着層を介して電気的に接続する構造を有
する電子部品の製造方法並びに接続構造に関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an electronic component and a connection structure, and more particularly, to a method for manufacturing an electronic component having a structure for electrically connecting a plurality of electrodes via a conductive adhesive layer. And a connection structure.
【０００２】[0002]
【従来の技術】インバータ回路やＩＧＢＴ（Insulated
Gate Bipolar Transistor）が組み込まれたパワーモジ
ュールにおいて、半導体チップの端子と周辺回路の電極
を接続する方法として従来ワイアボンディング法を用い
て行われていたが、パターンの微細化や生産性を向上す
るという要求を満足するために、電極間を導電性接着層
を介して一括して接続する方法が用いられている。一
方、電極を接続する接続部の面積が小さくなるにつれ
て、電極接続部での電極間の導通抵抗を益々小さくする
ことが要求されてきている。しかしながら、ワイアボン
ディング法は電極表面に形成された高抵抗な表面酸化層
を機械的に除去しながら接続する方法であるのに対し、
導電性接着層を介して接続する場合は、電極の表面酸化
層がほとんど除去されない。このため、導電性接着層を
介して接続する場合は、電極間の導通抵抗が大きくなる
という問題が生じるので、電極接続前に電極の表面に表
面酸化層がない状態にしておく必要がある。特に、半導
体装置などの電子部品において配線材料として多く用い
られているＡｌは、その表面に緻密な表面酸化層が形成
されやすい材料であり、その表面酸化層を機械的な方
法、あるいはエッチングによって除去したとしても、酸
素を含む大気に曝されることにより、瞬間的に自然酸化
層が形成される。2. Description of the Related Art Inverter circuits and IGBTs (Insulated
In a power module with a built-in Gate Bipolar Transistor), wire bonding was used to connect the terminals of the semiconductor chip to the electrodes of the peripheral circuit. In order to satisfy the demand, a method of collectively connecting the electrodes via a conductive adhesive layer has been used. On the other hand, as the area of the connecting part connecting the electrodes becomes smaller, it is required to further reduce the conduction resistance between the electrodes at the electrode connecting part. However, the wire bonding method is a method of connecting while mechanically removing a high resistance surface oxide layer formed on the electrode surface,
When the connection is made via the conductive adhesive layer, the surface oxide layer of the electrode is hardly removed. For this reason, when the connection is made via the conductive adhesive layer, there is a problem that the conduction resistance between the electrodes becomes large. Therefore, it is necessary that the surface of the electrode has no surface oxide layer before the connection of the electrode. In particular, Al, which is frequently used as a wiring material in electronic components such as semiconductor devices, is a material on which a dense surface oxide layer is easily formed, and the surface oxide layer is removed by a mechanical method or etching. Even so, a natural oxide layer is instantaneously formed by exposure to the atmosphere containing oxygen.
【０００３】図９は従来の電子部品の製造方法を説明す
る図であり、電極接続部の断面説明図である。図９に従
って、従来の電子部品の製造方法について説明する。ま
ず、図９（ａ）のようにＡｌやＮｉ等の表面に緻密な表
面酸化層が形成されやすい材料からなる第１の電極１の
表面に形成された表面酸化層２をスクレーパー３を用い
て摩擦処理に付すことにより除去（以下これを摩擦除去
という）し、第１の電極１の酸化層非形成面４を露出さ
せる。この酸化層非形成面４は図９（ｂ）のように瞬時
に再酸化されて再酸化層５が形成される。次に図９
（ｃ）のように第１の電極１上に導電性ペースト６を形
成する。さらに図９（ｄ）のように導電性ペースト６上
にＣｕ，Ａｇなどのような酸化層が形成されにくい材料
からなる第２の電極７を貼着し、導電性ペースト６を加
熱することにより、導電性ペースト６が硬化した導電性
接着層８を介して第１の電極１と第２の電極７を接続す
る。FIG. 9 is a view for explaining a conventional method of manufacturing an electronic component, and is a cross-sectional view of an electrode connecting portion. A conventional method for manufacturing an electronic component will be described with reference to FIG. First, as shown in FIG. 9A, a surface oxide layer 2 formed on a surface of a first electrode 1 made of a material such as Al or Ni on which a dense surface oxide layer is likely to be formed is formed using a scraper 3. The first electrode 1 is removed by applying a friction treatment (hereinafter, referred to as friction removal) to expose the surface 4 on which the oxide layer is not formed. This oxide layer non-formed surface 4 is instantaneously reoxidized as shown in FIG. 9B, and a reoxidized layer 5 is formed. Next, FIG.
A conductive paste 6 is formed on the first electrode 1 as shown in FIG. Further, as shown in FIG. 9D, a second electrode 7 made of a material such as Cu, Ag or the like, on which an oxide layer is unlikely to be formed, is adhered onto the conductive paste 6 and the conductive paste 6 is heated. Then, the first electrode 1 and the second electrode 7 are connected via the conductive adhesive layer 8 in which the conductive paste 6 has hardened.
【０００４】このように、従来の電子部品の製造方法に
おいては、スクレーパー３によって、第１の電極１の表
面酸化層２の一部を摩擦除去し、酸化層非形成面４を露
出させた後にその表面に導電性ペースト６を供給し、第
２の電極７を貼着して第１の電極１と第２の電極７を導
電性接着層８を介して接続を行っていた。このため、第
１の電極１と導電性接着層８の間には再酸化した再酸化
層５が介在していた。また、上記のようなスクレーパー
を用いる方法以外の他の機械的な方法、あるいはエッチ
ング法によって表面酸化層を除去した場合においても同
様に第１の電極１と導電性接着層８の間には再酸化した
再酸化層が介在していた。As described above, in the conventional method of manufacturing an electronic component, the scraper 3 removes a part of the surface oxide layer 2 of the first electrode 1 by friction, and after exposing the surface 4 on which the oxide layer is not formed. The conductive paste 6 was supplied to the surface, the second electrode 7 was attached, and the first electrode 1 and the second electrode 7 were connected via the conductive adhesive layer 8. For this reason, the reoxidized reoxidized layer 5 was interposed between the first electrode 1 and the conductive adhesive layer 8. In addition, even when the surface oxide layer is removed by a mechanical method other than the above-described method using a scraper or by an etching method, the gap between the first electrode 1 and the conductive adhesive layer 8 is similarly reduced. An oxidized reoxidized layer was interposed.
【０００５】[0005]
【発明が解決しようとする課題】このように従来の半導
体装置の製造方法では、表面酸化層２を除去して露出す
る酸化層非形成面４が、その表面に導電性ペーストを形
成するまでの間、大気に曝されるので、酸化層非形成面
４が再度酸化されて、再酸化層５が形成される。このた
め、第１の電極１と第２の電極７との間に、高抵抗の再
酸化層５が介在されるため、導通抵抗の増大や、接続強
度の低下という問題点があった。このため表面酸化層２
の除去後に再酸化層５が形成されることを防ぐために、
真空中もしくは低酸素濃度雰囲気中で表面酸化層２の除
去を行うことが必須であり、製造コストの上昇や生産性
の低下が不可避であるという問題があった。As described above, in the conventional method of manufacturing a semiconductor device, the surface 4 where the oxide layer is not formed and which is exposed by removing the surface oxide layer 2 is formed until the conductive paste is formed on the surface. During the exposure, the surface 4 on which the oxide layer is not formed is oxidized again to form the reoxidized layer 5. For this reason, since the high-resistance reoxidation layer 5 is interposed between the first electrode 1 and the second electrode 7, there is a problem that the conduction resistance increases and the connection strength decreases. Therefore, the surface oxide layer 2
To prevent the re-oxidized layer 5 from being formed after the removal of
It is necessary to remove the surface oxide layer 2 in a vacuum or in a low oxygen concentration atmosphere, and there is a problem that an increase in manufacturing cost and a decrease in productivity are inevitable.
【０００６】この発明は、上記のような問題点を解決す
るためになされたものであり、製造コスト上昇や生産性
低下することなく、一対の電極間の導通抵抗が小さく、
且つ接続強度が大きい電子部品の製造方法並びに接続構
造を得ることを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and has a small conduction resistance between a pair of electrodes without increasing the manufacturing cost or reducing the productivity.
Another object of the present invention is to provide a method of manufacturing an electronic component having a high connection strength and a connection structure.
【０００７】[0007]
【課題を解決するための手段】この発明に係る電子部品
の製造方法は、一対の電極の少なくとも一方の電極の表
面を導電性ペーストで被覆する工程と、この導電性ペー
ストで被覆された電極表面の少なくとも一部を、当該導
電性ペーストで覆われた状態下で、摩擦処理に付す工程
と、少なくとも一方の電極と他の電極とを、導電性ペー
ストを介して貼着する工程と、導電性ペーストを硬化処
理に付すことにより、少なくとも一方の電極と他の電極
とが電気的に接続された接続構造を得る工程と、を備え
たものである。According to a method of manufacturing an electronic component according to the present invention, a step of coating at least one surface of a pair of electrodes with a conductive paste and a step of coating the surface of the electrode coated with the conductive paste are performed. Subjecting at least a portion thereof to a friction treatment under a state covered with the conductive paste, a step of attaching at least one electrode and another electrode via a conductive paste, Subjecting the paste to a curing treatment to obtain a connection structure in which at least one electrode and another electrode are electrically connected.
【０００８】また、貼着する工程が、摩擦処理に付す工
程より後に行われるものである。Further, the step of sticking is performed after the step of subjecting to a friction treatment.
【０００９】また、貼着する工程が、摩擦処理に付す工
程より前に行われるものである。Further, the step of sticking is performed before the step of subjecting to a friction treatment.
【００１０】また、他の電極が、粘着面側に突起部を有
しており、摩擦処理が、少なくとも一方の電極との粘着
時又は粘着後に、この突起部を移動することにより行わ
れるものである。Further, the other electrode has a projection on the adhesive surface side, and the friction treatment is performed by moving the projection during or after adhesion to at least one of the electrodes. is there.
【００１１】また、導電性ペーストの被覆が、導電性ペ
ーストの塗布器具で行われ、摩擦処理がこの塗布器具の
先端の移動により導電性ペーストの被覆と並行して行わ
れるものである。In addition, the coating of the conductive paste is performed by a conductive paste application device, and the friction treatment is performed in parallel with the coating of the conductive paste by moving the tip of the application device.
【００１２】また、一対の電極の少なくとも一方の電極
の表面の一部に、表面酸化層を除去しながら当該少なく
とも一方の電極の材料よりも難酸化性の材料からなる接
続電極を密着形成する工程と、この接続電極が形成され
た少なくとも一方の電極の表面を導電性ペーストで被覆
する工程と、少なくとも一方の電極と他の電極とを、導
電性ペーストを介して貼着する工程と、導電性ペースト
を硬化処理に付すことにより、少なくとも一方の電極と
他の電極とが電気的に接続された接続構造を得る工程
と、を備えたものである。A step of forming a contact electrode made of a material that is more resistant to oxidation than the material of the at least one electrode while removing a surface oxide layer on a part of the surface of at least one of the pair of electrodes; And a step of coating the surface of at least one electrode on which the connection electrode is formed with a conductive paste, a step of attaching at least one electrode and another electrode via a conductive paste, Subjecting the paste to a curing treatment to obtain a connection structure in which at least one electrode and another electrode are electrically connected.
【００１３】この発明に係る電子部品の接続構造は、表
面酸化層を有する電極と他の電極とが電気的に接続され
た構造であって、この表面酸化層を有する電極は、表面
酸化層が部分的に除去された部位と表面酸化層が残存す
る部位とからなる不均一接続領域を備え、この不均一接
続領域上に形成された導電性接着層を介して、当該表面
酸化層を有する電極と他の電極とが電気的に接続された
ものである。A connection structure for an electronic component according to the present invention is a structure in which an electrode having a surface oxide layer is electrically connected to another electrode, and the electrode having the surface oxide layer has a surface oxide layer. An electrode having a non-uniform connection region consisting of a part that is partially removed and a part where a surface oxide layer remains, and an electrode having the surface oxide layer via a conductive adhesive layer formed on the non-uniform connection region And other electrodes are electrically connected.
【００１４】また、表面酸化層を有する電極と他の電極
とが電気的に接続された構造であって、この表面酸化層
を有する電極は、表面酸化層が部分的に除去された部
位、表面酸化層が残存する部位及び上記表面酸化層が除
去された部位上に形成された難酸化性の材料からなる接
続電極を備えた不均一接続領域を備え、この不均一接続
領域上に形成された導電性接着層を介して、当該表面酸
化層を有する電極と他の電極とが電気的に接続されたも
のである。Further, the electrode having the surface oxide layer is electrically connected to another electrode, and the electrode having the surface oxide layer has a structure in which the surface oxide layer is partially removed, A non-uniform connection region including a connection electrode made of a hardly oxidizable material formed on a portion where the oxide layer remains and a portion where the surface oxide layer has been removed, and formed on the non-uniform connection region. The electrode having the surface oxide layer is electrically connected to another electrode via the conductive adhesive layer.
【００１５】[0015]
【発明の実施の形態】実施の形態１．図１はこの発明の
実施の形態１の電子部品の製造方法を説明する図であ
り、電極接続部の断面説明図である。尚、この電極接続
部は、半導体チップの端子部において、半導体チップの
端子部に設けられた電極と周辺回路の電極とを接続する
金属配線との接続部であってもよく、また、周辺回路の
電極において、周辺回路の電極と半導体チップの端子部
に設けられた電極を接続する金属配線との接続部であっ
てもよい。また、半導体装置に限らずプリント基板など
の種々の電子部品の電極接続部であってもよい。DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 is a diagram for explaining a method for manufacturing an electronic component according to a first embodiment of the present invention, and is a cross-sectional explanatory diagram of an electrode connecting portion. The electrode connection portion may be a connection portion of a terminal portion of the semiconductor chip and a metal wiring connecting an electrode provided on the terminal portion of the semiconductor chip and an electrode of a peripheral circuit. The electrode may be a connection portion between a metal electrode provided in a terminal portion of the semiconductor chip and an electrode of a peripheral circuit. The present invention is not limited to the semiconductor device, and may be an electrode connection portion of various electronic components such as a printed circuit board.
【００１６】図１において、１はＡｌやＮｉ等の表面に
緻密な表面酸化層が形成されやすい材料からなる第１の
電極、２は第１の電極１の表面に形成される表面酸化
層、３は第１の電極１の表面を摩擦処理に付すスクレー
パー、４は表面酸化層が除去された第１の電極１の酸化
層非形成面、６は導電性ペースト、７は第１の電極１と
接続するＣｕやＡｇ等からなるその表面に酸化層が形成
されにくい材料からなる第２の電極、８は導電性ペース
ト６が硬化した導電性接着層である。In FIG. 1, 1 is a first electrode made of a material such as Al or Ni on which a dense surface oxide layer is easily formed on the surface, 2 is a surface oxide layer formed on the surface of the first electrode 1, Reference numeral 3 denotes a scraper for subjecting the surface of the first electrode 1 to a friction treatment, 4 denotes a surface of the first electrode 1 on which a surface oxide layer has not been removed, 6 denotes a conductive paste, and 7 denotes a first electrode 1 A second electrode 8 made of a material such as Cu or Ag that is hardly formed with an oxide layer on the surface thereof is connected to the conductive paste 6 and is a conductive adhesive layer in which the conductive paste 6 is hardened.
【００１７】次に図１に従って、この発明の実施の形態
１の電子部品の製造方法を説明する。まず図１（ａ）に
示すように、表面酸化層２が自然酸化層として存在する
第１の電極１の表面に、導電性ペースト６を形成する。
導電性ペースト６としては、Ａｇペースト等の導電性樹
脂ペーストが用いられ、後述するスクレーパー３で表面
酸化層２を摩擦除去時に、酸化層非形成面４が大気に曝
され再酸化されるのを防ぐことができる程度に流動性が
大きいもの、例えば粘度が１×１０2Ｐａ・ｓ程度以下
の低粘度のものを用いることができる。導電性ペースト
６を形成する方法としては、ディスペンサーを用いる方
法、印刷法、転写法などを用いることができる。Next, a method for manufacturing an electronic component according to the first embodiment of the present invention will be described with reference to FIG. First, as shown in FIG. 1A, a conductive paste 6 is formed on the surface of the first electrode 1 where the surface oxide layer 2 exists as a natural oxide layer.
As the conductive paste 6, a conductive resin paste such as an Ag paste is used. When the scraper 3 described later removes the surface oxide layer 2 by friction, the surface 4 on which the oxide layer is not formed is exposed to the atmosphere and reoxidized. It is possible to use a material having high fluidity to the extent that it can be prevented, for example, a material having a low viscosity of about 1 × 10 2 Pa · s or less. As a method for forming the conductive paste 6, a method using a dispenser, a printing method, a transfer method, or the like can be used.
【００１８】次に図１（ｂ）のように、導電性ペースト
６中に例えばＳＵＳ４３０製のスクレーパー３を通し
て、第１の電極１の表面の少なくとも一部を摩擦処理に
付すことによって表面酸化層２を除去し、第１の電極１
の酸化層非形成面４を生成する。これによって第１の電
極１と導電性ペースト６を酸化層非形成面４において直
接接続することができる。尚、摩擦処理に付すことによ
って表面酸化物２は完全に除去されることが望ましい
が、一対の電極間の導通抵抗が十分小さくなる程度に除
去されていればよい。Next, as shown in FIG. 1B, at least a part of the surface of the first electrode 1 is subjected to a friction treatment through a scraper 3 made of, for example, SUS430 into the conductive paste 6 so that the surface oxide layer 2 is formed. To remove the first electrode 1
The oxide layer non-formed surface 4 is generated. Thus, the first electrode 1 and the conductive paste 6 can be directly connected on the surface 4 where the oxide layer is not formed. It is desirable that the surface oxide 2 be completely removed by subjecting it to a friction treatment, but it is sufficient that the surface oxide 2 be removed to such an extent that the conduction resistance between the pair of electrodes becomes sufficiently small.
【００１９】次に図１（ｃ）のように、Ｃｕ，Ａｇなど
のような酸化層が形成されにくい材料からなる第２の電
極７を導電性ペースト６を挟むようにして貼着し、これ
らをホットプレートにて加熱することにより、導電性ペ
ースト６がキュアされて得られる導電性接着層８を介し
て第１の電極１と第２の電極７とが接続される。Next, as shown in FIG. 1C, a second electrode 7 made of a material such as Cu, Ag, etc., on which an oxide layer is unlikely to be formed, is adhered with the conductive paste 6 interposed therebetween. By heating with a plate, the first electrode 1 and the second electrode 7 are connected via a conductive adhesive layer 8 obtained by curing the conductive paste 6.
【００２０】このような方法で、一対の電極を接続する
ことによって、真空中もしくは低酸素濃度雰囲気中での
作業をしなくても表面酸化層２の非介在部を有するよう
に第１の電極１と第２の電極７とを接続できるので、製
造コスト上昇や生産性低下することなく、一対の電極間
の導通抵抗が小さく、且つ接続強度が大きい電子部品を
得ることができる。By connecting a pair of electrodes in such a manner, the first electrode can be formed so as to have a non-intervening portion of the surface oxide layer 2 without working in a vacuum or in a low oxygen concentration atmosphere. Since the first and second electrodes 7 can be connected, an electronic component having a low conduction resistance between the pair of electrodes and a high connection strength can be obtained without increasing the manufacturing cost or lowering the productivity.
【００２１】尚、上記説明では導電性ペースト６として
Ａｇペースト等からなる導電性樹脂ペーストを用いた場
合について説明したが、導電性ペースト６としてＳｎ−
Ｐｂ等のはんだペーストを用いてもよい。尚、スクレー
パー３を用いて表面酸化層２を摩擦除去する時に超音波
を印加することによって、表面酸化層２の摩擦除去の効
率を高めることが可能である。また、導電性ペースト６
の粘度が十分小さくなるように導電性ペースト６の温度
を調整した状態でスクレーパー３を用いて表面酸化層２
を摩擦除去してもよい。また、表面酸化層２を摩擦除去
するスクレーパー３は、表面酸化層２の硬度より高い材
質のものを用いてもよいが、低い材質のものを用いても
よい。表面酸化層２の硬度より低い材質のものを用いる
ことにより、表面酸化層２の下地の電極に与えるダメー
ジを、より小さくすることができる。In the above description, the case where a conductive resin paste made of Ag paste or the like is used as the conductive paste 6 has been described.
A solder paste such as Pb may be used. It is possible to increase the efficiency of removing the friction of the surface oxidized layer 2 by applying ultrasonic waves when the surface oxidized layer 2 is removed by friction using the scraper 3. In addition, the conductive paste 6
In a state where the temperature of the conductive paste 6 is adjusted so that the viscosity of the
May be removed by friction. The scraper 3 that frictionally removes the surface oxide layer 2 may be made of a material having a hardness higher than the hardness of the surface oxide layer 2 or a material having a lower hardness. By using a material having a hardness lower than that of the surface oxide layer 2, damage to the underlying electrode of the surface oxide layer 2 can be further reduced.
【００２２】実施の形態２．実施の形態１においては、
第２の電極が、酸化しにくい材料からなる電極である場
合について示したが、実施の形態２では、第２の電極も
第１の電極と同様に酸化しやすい材料からなる電極の場
合について示す。第２の電極も第１の電極と同様に酸化
しやすい材料からなる電極の場合には、第２の電極に
も、実施の形態１の第１の電極の場合と同様に、その表
面に導電性ペーストを形成し、スクレーパーを用いて第
１の電極の表面を摩擦除去したものを用い、導電性ペー
ストを挟むようにして、第１の電極と第２の電極とを貼
着し、加熱して導電性ペーストを硬化処理する。このよ
うな方法によって、第１の電極と第２の電極の両方が、
酸化されやすい材料からなるものであっても、実施の形
態１と同様の効果を得ることができる。Embodiment 2 FIG. In the first embodiment,
Although the case where the second electrode is an electrode made of a material which is hardly oxidized has been described, Embodiment 2 shows a case where the second electrode is also made of a material which is easily oxidized like the first electrode. . In the case where the second electrode is also made of a material which is easily oxidized similarly to the first electrode, the surface of the second electrode is electrically conductive similarly to the case of the first electrode of the first embodiment. A conductive paste is formed, and the first electrode and the second electrode are adhered to each other with the conductive paste interposed therebetween by using a material obtained by frictionally removing the surface of the first electrode using a scraper. The conductive paste is cured. By such a method, both the first electrode and the second electrode
The same effect as in the first embodiment can be obtained even with a material that is easily oxidized.
【００２３】実施の形態３．図２はこの発明の実施の形
態３の電子部品の製造方法を説明する図であり、電極接
続部の断面説明図である。図２において、１７はＣｕ，
Ａｇなどのような酸化層が形成されにくい材料からなる
第２の電極、１８は第２の電極１７の貼着面側に形成さ
れたスクレーパー（突起部）である。図１で示した符号
と同じものは、同じまたは相当品を示す。実施の形態３
が実施の形態１と異なる点は、スクレーパー１８が第２
の電極１７に一体形成され、第２の電極１７の貼着時又
は貼着後に第２の電極１７に一体形成されたスクレーパ
ー１８を移動することにより第１の電極１の表面に形成
された表面酸化層２を摩擦除去する点である。スクレー
パー１８としては、例えば直径０．２ｍｍ、高さ１ｍｍ
の形状のものを用いる。このようなアスペクト比（高さ
／直径）が大きいものを用いることにより、容易に塑性
変形するため貼着後に応力が残留しない。スクレーパー
１８と第２の電極１７とは同じ材質のものであってもよ
いし、異なる材質のものであってもよい。尚、第２の電
極１７を形成時に超音波を印加することによって、表面
酸化層２の摩擦除去の効率を高めることが可能である。
本実施の形態のように、第２の電極が貼着面側に突起部
を有する場合においても実施の形態１と同様の効果が得
られ、さらに、製造工程を簡略化することができる。Embodiment 3 FIG. FIG. 2 is a diagram for explaining a method for manufacturing an electronic component according to Embodiment 3 of the present invention, and is a cross-sectional explanatory view of an electrode connection portion. In FIG. 2, reference numeral 17 denotes Cu,
A second electrode 18 made of a material, such as Ag, on which an oxide layer is unlikely to be formed is a scraper (projection) formed on the side of the second electrode 17 to which the second electrode 17 is adhered. The same reference numerals as those shown in FIG. 1 indicate the same or equivalent products. Embodiment 3
Is different from the first embodiment in that the scraper 18 is
The surface formed on the surface of the first electrode 1 by moving the scraper 18 integrally formed on the second electrode 17 during or after the second electrode 17 is attached to the first electrode 1 The point is that the oxide layer 2 is removed by friction. As the scraper 18, for example, a diameter of 0.2 mm and a height of 1 mm
Use the shape of By using such a material having a large aspect ratio (height / diameter), it is easily plastically deformed, so that no stress remains after bonding. The scraper 18 and the second electrode 17 may be made of the same material or different materials. By applying ultrasonic waves when forming the second electrode 17, it is possible to increase the efficiency of friction removal of the surface oxide layer 2.
Even in the case where the second electrode has a protrusion on the sticking surface side as in the present embodiment, the same effect as in Embodiment 1 can be obtained, and the manufacturing process can be further simplified.
【００２４】また、実施の形態２と同様に、第１の電極
と第２の電極の両方が酸化されやすい材料からなる電極
である場合には、実施の形態２と同様に第２の電極に導
電性ペーストを形成後スクレーパーで第２の電極の表面
酸化層を摩擦除去したものを用いてもよく、本実施の形
態の第２の電極と同様の第１の電極を用い、第１の電極
に一体化されたスクレーパーで第２の電極表面の表面酸
化層を摩擦除去してもよい。Further, as in the second embodiment, when both the first electrode and the second electrode are electrodes made of a material which is easily oxidized, the second electrode is connected to the second electrode as in the second embodiment. After forming the conductive paste, a material obtained by frictionally removing the surface oxide layer of the second electrode with a scraper may be used, and a first electrode similar to the second electrode of the present embodiment may be used. The surface oxide layer on the surface of the second electrode may be removed by friction with a scraper integrated with the above.
【００２５】実施の形態４．図３はこの発明の実施の形
態４の電子部品の製造方法を説明する図であり、その
（ａ）は第２の電極を貼着した状態の電極接続部の斜視
説明図、その（ｂ）は第２の電極を貼着した状態の他の
構成を示す電極接続部の斜視説明図、その（ｃ）は
（ａ）及び（ｂ）のＡ−Ａ方向の断面に相当する図であ
り、スクレーパーで表面酸化層を摩擦除去中の状態を示
す図である。図３において、２７，２９は第２の電極、
２８，３０はそれぞれ第２の電極２７，２９に設けられ
た開口部である。図１乃至図２で示した符号と同じもの
は、同じまたは相当品を示す。この実施の形態４が実施
の形態１と異なる点は、実施の形態１ではスクレーパー
を用いて表面酸化層２を摩擦除去してから第２の電極を
貼着するのに対し、第２の電極を貼着した後に、スクレ
ーパーを用いて表面酸化層２を摩擦除去する点である。
第２の電極としては、図３（ａ）のような開口部２８
（例えば一辺５ｍｍの正方形）を有する第２の電極２７
でもよく、図３（ｂ）のようにスリット状開口部３０
（例えば５ｍｍ幅）を有する第２の電極２９でもよい。
この場合には、図３（ｃ）のように、導電性ペースト６
を供給した第１の電極１上に第２の電極２７，２９を貼
着した後、開口部２８，３０から導電性ペースト６を貫
通するようにスクレーパー３を通して、スクレーパー３
で表面酸化層２を摩擦除去し、酸化層非形成面４を形成
する。Embodiment 4 3A and 3B are views for explaining a method of manufacturing an electronic component according to a fourth embodiment of the present invention. FIG. 3A is a perspective explanatory view of an electrode connecting portion with a second electrode attached thereto, and FIG. FIG. 4 is a perspective explanatory view of an electrode connecting portion showing another configuration in a state where the second electrode is adhered, and FIG. 4C is a diagram corresponding to a cross section in the AA direction of FIGS. It is a figure which shows the state in which a surface oxide layer is being friction-removed with a scraper. In FIG. 3, 27 and 29 are second electrodes,
Reference numerals 28 and 30 denote openings provided in the second electrodes 27 and 29, respectively. The same reference numerals as those shown in FIGS. 1 and 2 indicate the same or equivalent products. The fourth embodiment is different from the first embodiment in that the second electrode is adhered after the surface oxide layer 2 is removed by friction using a scraper in the first embodiment. Is that the surface oxide layer 2 is friction-removed using a scraper after the adhesive is adhered.
As the second electrode, an opening 28 as shown in FIG.
Second electrode 27 having a square shape (for example, a square having a side of 5 mm)
Alternatively, as shown in FIG.
The second electrode 29 (for example, having a width of 5 mm) may be used.
In this case, as shown in FIG.
After the second electrodes 27 and 29 are adhered on the first electrode 1 to which the conductive paste 6 has been supplied, the scraper 3 is passed through the conductive paste 6 through the openings 28 and 30.
Then, the surface oxide layer 2 is removed by friction to form the oxide layer non-formed surface 4.
【００２６】本実施の形態のように、第２の電極を貼着
した後に表面酸化層を摩擦除去する場合においても実施
の形態１と同様の効果が得られ、さらに第２の電極の貼
着し時に電極間に加える力によって導電性ペーストが広
がるので、より広い面積にわたって表面酸化層を除去で
き、導通抵抗を、より小さくすることができる。特に転
写法を用いて導電性ペーストを形成する場合には、狭い
領域に導電性ペーストが形成されるので、この効果は大
きい。In the case where the surface oxide layer is removed by friction after the second electrode is adhered as in the present embodiment, the same effect as in the first embodiment can be obtained. Since the conductive paste is spread by the force applied between the electrodes at the time, the surface oxide layer can be removed over a larger area, and the conduction resistance can be further reduced. In particular, when the conductive paste is formed by using the transfer method, the conductive paste is formed in a narrow region, and thus the effect is large.
【００２７】尚、上記の説明では、第２の電極の内部に
開口部を有する第２の電極を用いる場合について説明し
たが、内部に開口部を有さない第２の電極を用いて、第
２の電極を貼りあわせ後に第２の電極の周囲にスクレー
パー３を通し第１の電極１の表面酸化層２を摩擦除去し
てもよく、この場合にも同様の効果が得られる。In the above description, the case where the second electrode having an opening inside the second electrode is used has been described. However, the second electrode having no opening inside the second electrode is used. After bonding the two electrodes, the surface oxide layer 2 of the first electrode 1 may be frictionally removed by passing the scraper 3 around the second electrode, and the same effect can be obtained in this case.
【００２８】実施の形態５．図４はこの発明の実施の形
態５電子部品の製造方法を説明する図であり、電極接続
部の断面説明図である。図４において、３１はディスペ
ンサのニードル、３２はニードル３１の先端に一体形成
されたスクレーパーであり、図１乃至図３で示した符号
と同じものは、同じまたは相当品を示す。実施の形態５
が実施の形態１と異なる点は、導電性ペーストの塗布器
具であるディスペンサーのニードル３１の先端に一体形
成されたスクレーパー３２の移動により、導電性ペース
トの被覆と並行して表面酸化層２を摩擦除去する点であ
る。第１の電極１上にディスペンサを用いて導電性ペー
スト６を供給し被覆する時に、ニードル３１の先端に形
成されたスクレーパー３２によって表面酸化層２が摩擦
除去されて酸化層非形成面４が生成される。尚、導電性
ペースト６を供給する時に超音波を印加することによっ
て、表面酸化層２の摩擦除去の効率を高めることが可能
である。本実施の形態のように、スクレーパーが導電性
ペーストを形成する塗布器具の先端に一体形成された場
合においても実施の形態１と同様の効果が得られ、さら
に、摩擦処理を導電性ペーストの被覆と並行して行うこ
とにより、工程数が少なくなり、生産性の向上を図るこ
とができる。ここでは、導電性ペースト６の塗布器具に
ディスペンサを用いたが、塗布器具として印刷マスクや
転写ピンを用いてもよい。印刷によって供給する場合に
は印刷マスクの裏面側（第１の電極側）にスクレーパー
となる突起を形成し、転写法を用いる場合には、転写ピ
ンの先端にスクレーパーとなる突起を形成しておく。こ
れらを用いた場合にも上記と同様の効果が得られる。Embodiment 5 FIG. 4 is a diagram illustrating a method for manufacturing an electronic component according to a fifth embodiment of the present invention, and is a cross-sectional view illustrating an electrode connecting portion. In FIG. 4, reference numeral 31 denotes a needle of the dispenser, 32 denotes a scraper integrally formed at the tip of the needle 31, and the same reference numerals as those shown in FIGS. 1 to 3 denote the same or equivalent parts. Embodiment 5
The difference from Embodiment 1 is that the scraper 32 integrally formed at the tip of the needle 31 of the dispenser, which is a conductive paste application device, rubs the surface oxide layer 2 in parallel with the coating of the conductive paste. The point is to remove it. When the conductive paste 6 is supplied and coated on the first electrode 1 using a dispenser, the surface oxide layer 2 is frictionally removed by the scraper 32 formed at the tip of the needle 31 to form the oxide layer non-formed surface 4. Is done. By applying ultrasonic waves when supplying the conductive paste 6, it is possible to increase the efficiency of removing friction of the surface oxide layer 2. Even when the scraper is integrally formed at the tip of the applicator that forms the conductive paste as in the present embodiment, the same effect as in the first embodiment can be obtained. In parallel, the number of steps is reduced, and productivity can be improved. Here, a dispenser is used as a device for applying the conductive paste 6, but a printing mask or a transfer pin may be used as the device for applying. When supplying by printing, a projection serving as a scraper is formed on the back side (first electrode side) of the print mask, and when using a transfer method, a projection serving as a scraper is formed at the tip of a transfer pin. . When these are used, the same effects as above can be obtained.
【００２９】実施の形態６．図５はこの発明の実施の形
態６の電子部品の製造方法を説明する図であり、電極接
続部の断面説明図である。図５において、４０はワイア
ボンディング装置のキャピラリ、４１はキャピラリ４０
の内部に充填されたワイア、４２はキャピラリ４０の先
端部における溶融したボール状ワイア、４３は第１の電
極上に形成された接続電極、４４は第１の電極１と接続
する第２の電極、４５は第２の電極４４に設けられた開
口部である。尚、図１乃至図４で示した符号と同じもの
は、同じまたは相当品を示す。Embodiment 6 FIG. FIG. 5 is a diagram illustrating a method for manufacturing an electronic component according to a sixth embodiment of the present invention, and is a cross-sectional view illustrating an electrode connecting portion. In FIG. 5, reference numeral 40 denotes a capillary of the wire bonding apparatus, and 41 denotes a capillary 40.
, 42 is a molten ball-shaped wire at the tip of the capillary 40, 43 is a connection electrode formed on the first electrode, and 44 is a second electrode connected to the first electrode 1. , 45 are openings provided in the second electrode 44. 1 to 4 indicate the same or equivalent parts.
【００３０】図５に従って、実施の形態６の電子部品の
製造方法について説明する。まず、図５（ａ）のよう
に、ワイアボンディング装置のキャピラリ４０の内部に
Ａｕ等の第１の電極１よりも酸化されにくい（難酸化性
の）材料からなるワイア４１を充填し、キャピラリ４０
の先端部のワイアを溶融し、ボール状ワイア４２を形成
する。次に図５（ｂ）のように、キャピラリ４０と第１
の電極１とを近づけ、ボール状ワイア４２を第１の電極
１上に載せる。このときキャピラリ４０には超音波を印
加しながら行うため、第１の電極１の表面酸化層２が除
去され、ボール状ワイア４２と第１の電極１との間に表
面酸化層２を介さずに密着して接続される。このため、
第１の電極１と接続電極４３との間の導通抵抗は無視で
きるほど小さい。次に図５（ｃ）のように、キャピラリ
４０を第１の電極１から遠ざけることにより、ボール状
ワイア４２がワイア４１と分離して、第１の電極１上に
接続電極４３が残る。このような接続電極４３として、
例えば直径８０μｍのＡｕが形成される。次に図５
（ｄ）のように、接続電極４３が形成された第１の電極
１の表面を導電性ペースト６で被覆する。次に図５
（ｅ）のように、第２の電極４４に設けられた直径０．
５ｍｍの開口部４５を接続電極４３に対向するように位
置合わせし、第２の電極４４を貼着する。最後にこれら
をホットプレートにて加熱することにより、導電性ペー
スト６がキュアされることにより得られる導電性接着層
８を介して第１の電極１と第２の電極４４とが接続され
る。Referring to FIG. 5, a method for manufacturing an electronic component according to the sixth embodiment will be described. First, as shown in FIG. 5A, the inside of the capillary 40 of the wire bonding apparatus is filled with a wire 41 made of a material that is less oxidized (harder to oxidize) than the first electrode 1 such as Au.
Is melted to form a ball-shaped wire 42. Next, as shown in FIG. 5B, the capillary 40 and the first
And the ball-shaped wire 42 is placed on the first electrode 1. At this time, since the operation is performed while applying ultrasonic waves to the capillary 40, the surface oxide layer 2 of the first electrode 1 is removed, and the surface oxide layer 2 is not interposed between the ball-shaped wire 42 and the first electrode 1. Is connected closely. For this reason,
The conduction resistance between the first electrode 1 and the connection electrode 43 is negligibly small. Next, as shown in FIG. 5C, by moving the capillary 40 away from the first electrode 1, the ball-shaped wire 42 is separated from the wire 41, and the connection electrode 43 remains on the first electrode 1. As such a connection electrode 43,
For example, Au having a diameter of 80 μm is formed. Next, FIG.
As shown in (d), the surface of the first electrode 1 on which the connection electrode 43 is formed is covered with the conductive paste 6. Next, FIG.
As shown in (e), the second electrode 44 has a diameter of 0.1 mm.
The 5 mm opening 45 is positioned so as to face the connection electrode 43, and the second electrode 44 is attached. Finally, by heating these with a hot plate, the first electrode 1 and the second electrode 44 are connected via the conductive adhesive layer 8 obtained by curing the conductive paste 6.
【００３１】このような方法で、一対の電極を接続する
ことによって、真空中もしくは低酸素濃度雰囲気中での
作業をしなくても表面酸化層２の非介在部を有するよう
に第１の電極と第２の電極とを接続できるので、製造コ
ストの上昇や生産性が低下せずに、一対の電極間の導通
抵抗を小さくし、且つ接続強度を大きくすることができ
る。接続電極に対向して開口部を有する第２の電極を用
いることにより、接続電極が第２の電極につっかえない
ので、第１及び第２の電極間に十分な圧力を加えること
ができ、接続電極に対向して開口部を有さない第２の電
極を用いる場合に生じる導通抵抗の増大や接続強度不足
といった不具合を解消することができる。By connecting a pair of electrodes by such a method, the first electrode can be formed so as to have a non-intervening portion of the surface oxide layer 2 without working in a vacuum or in a low oxygen concentration atmosphere. And the second electrode, the conduction resistance between the pair of electrodes can be reduced and the connection strength can be increased without increasing the manufacturing cost or reducing the productivity. By using the second electrode having an opening facing the connection electrode, the connection electrode does not stick to the second electrode, so that a sufficient pressure can be applied between the first and second electrodes, It is possible to eliminate problems such as an increase in conduction resistance and a shortage of connection strength that occur when a second electrode having no opening is used opposite to the electrode.
【００３２】ここでは、接続電極に対向して開口部を有
する第２の電極について示したが、第２の電極が接続電
極につっかえないような形状であればよい。図６及び７
はこの発明の実施の形態６の電子部品の製造方法に用い
る第２の電極の変形例を示す図であり、第２の電極の断
面説明図である。例えば、図６のような凹部５０を有す
る第２の電極４９、あるいは図７のような凹部５２を有
する第２の電極５１を用いることができ、凹部５０、５
２が接続電極４３に対向するように貼着する。これらの
場合にも同様の効果が得られる。但し、導電性ペースト
の厚みに対して接続電極の厚みが十分に小さく、接続電
極が第２の電極につっかえる恐れがない場合には、開口
部がない第２の電極を用いてもよい。尚、実施の形態２
と同様に第２の電極として酸化しやすい材料からなるも
のを用い、導電性ペーストで被覆後、スクレーパーで第
２の電極の表面酸化層を摩擦除去したものを用いてもよ
く、また本実施の形態と同様に、第２の電極の表面に接
続電極を形成することにより表面酸化層を除去した後
に、導電性ペーストを被覆したものを用いてもよい。Although the second electrode having the opening facing the connection electrode has been described, any shape may be used as long as the second electrode does not stick to the connection electrode. 6 and 7
FIG. 21 is a view showing a modification of the second electrode used in the method for manufacturing an electronic component according to the sixth embodiment of the present invention, and is an explanatory sectional view of the second electrode. For example, a second electrode 49 having a concave portion 50 as shown in FIG. 6 or a second electrode 51 having a concave portion 52 as shown in FIG.
2 is attached so as to face the connection electrode 43. Similar effects can be obtained in these cases. However, in the case where the thickness of the connection electrode is sufficiently small with respect to the thickness of the conductive paste and there is no possibility that the connection electrode is stuck to the second electrode, a second electrode having no opening may be used. Embodiment 2
Similarly, the second electrode may be made of a material that is easily oxidized, coated with a conductive paste, and then a scraped surface oxide layer of the second electrode may be removed with a scraper. Similar to the embodiment, a conductive electrode may be used after the surface oxide layer is removed by forming a connection electrode on the surface of the second electrode.
【００３３】実施の形態１に記載した方法により一対の
電極を接続したときの効果を検証した結果を実施例１及
び比較例１に示す。 実施例１ まず図１（ａ）のように、表面酸化層２が自然酸化層と
して存在する第１の電極１（Ａｌ：３０ｍｍ×２０ｍ
ｍ、厚さ１ｍｍ）の表面に、導電性ペースト６（Ａｇペ
ースト：Ｄｉｍａｔ社製、ＤＭ４１３１ＨＴ、粘度３５
Ｐａ・ｓ）をディスペンサより供給した。次に図１
（ｂ）のように、スクレーパー３（ＳＵＳ４３０製）を
用いて、所定の回数第１の電極の表面を摩擦処理を付す
ことによって表面酸化層２を除去し、Ａｌの酸化層非形
成面４を生成した。尚、ここでは１回当たり４０点の摩
擦処理が可能なスクレーパーを用いた。次に図１（ｃ）
のように、導電性ペースト６の表面に第２の電極７（Ｃ
ｕ：３０ｍｍ×２０ｍｍ、厚さ１ｍｍ）を貼着し、ホッ
トプレートにて８５℃で３０分、１７５℃で１５分加熱
し導電性ペースト６をキュアすることにより得られる導
電性接着層８を介して、第１の電極１と第２の電極７を
接続した。このような方法で、スクレーパーで第１の電
極を摩擦処理する回数を変えた試料を作製し、摩擦処理
回数と導通抵抗の関係を調べた。また、比較試料とし
て、表面酸化層が形成されにくいＣｕ同志を、上記と同
様の方法で接続した試料を作製し、同様に導通抵抗の評
価を行った。図８はこの発明の実施例１及び比較例１の
電子部品の製造方法の効果を比較するための図であり、
摩擦処理回数と導通抵抗の関係を測定した結果を示す図
である。実施例１の方法を用いて作製した試料は、摩擦
処理回数を増やすとともに導通抵抗値は小さくなり、Ｃ
ｕ同志を接続した場合と同等の導通抵抗を示すことが分
かった。The results of verifying the effect of connecting a pair of electrodes by the method described in Embodiment 1 are shown in Example 1 and Comparative Example 1. Example 1 First, as shown in FIG. 1A, a first electrode 1 (Al: 30 mm × 20 m) in which a surface oxide layer 2 exists as a natural oxide layer
m, thickness of 1 mm), a conductive paste 6 (Ag paste: manufactured by Dimat, DM4131HT, viscosity 35)
Pa · s) was supplied from a dispenser. Next, FIG.
As shown in (b), the surface oxide layer 2 is removed by applying a friction treatment to the surface of the first electrode a predetermined number of times using a scraper 3 (made of SUS430), and the surface 4 on which the Al oxide layer is not formed is formed. Generated. Here, a scraper capable of performing a friction treatment at 40 points per time was used. Next, FIG.
As shown in FIG. 2, the second electrode 7 (C
u: 30 mm × 20 mm, thickness 1 mm), and heated on a hot plate at 85 ° C. for 30 minutes and at 175 ° C. for 15 minutes to cure the conductive paste 6 via the conductive adhesive layer 8. Thus, the first electrode 1 and the second electrode 7 were connected. In this way, samples were prepared in which the number of times the first electrode was rubbed with the scraper was changed, and the relationship between the number of times of rubbing and the conduction resistance was examined. In addition, as a comparative sample, a sample was prepared in which Cu was connected to each other on which a surface oxide layer was difficult to be formed in the same manner as described above, and the conduction resistance was evaluated in the same manner. FIG. 8 is a diagram for comparing the effects of the electronic component manufacturing methods of Example 1 of the present invention and Comparative Example 1.
It is a figure showing the result of having measured the relation between the number of times of friction processing and conduction resistance. In the sample manufactured using the method of Example 1, the number of times of the friction treatment was increased and the conduction resistance was reduced.
It has been found that the same conduction resistance as in the case where u and u are connected is exhibited.
【００３４】比較例１ 比較例１として、従来のように表面酸化層を除去してか
ら導電性ペーストを形成した試料を作製し、導通抵抗を
測定した。比較例１の試料の作製方法が、実施例１と異
なるのは、スクレーパー３で表面酸化層２を摩擦除去し
てから導電性ペースト６を被覆する点であり、その他の
条件は、実施例１と同じである。比較例１で作製した試
料の導通抵抗は、図８に示されるように、摩擦処理回数
に関わらず大きく、且つばらつきが大きかった。Comparative Example 1 As Comparative Example 1, a sample was prepared in which a conductive paste was formed after removing the surface oxide layer as in the prior art, and the conduction resistance was measured. The method of preparing the sample of Comparative Example 1 is different from that of Example 1 in that the scraping of the surface oxide layer 2 by the scraper 3 is followed by the coating of the conductive paste 6. Is the same as As shown in FIG. 8, the conduction resistance of the sample manufactured in Comparative Example 1 was large and varied greatly regardless of the number of times of the friction treatment.
【００３５】以上のように、実施例１と比較例１の導通
抵抗の測定結果の比較より、本発明の導通抵抗を小さく
できるという効果を検証できた。As described above, from the comparison of the measurement results of the conduction resistance of Example 1 and Comparative Example 1, the effect of the present invention that the conduction resistance can be reduced can be verified.
【００３６】[0036]
【発明の効果】この発明に係る電子部品の製造方法は、
一対の電極の少なくとも一方の電極の表面を導電性ペー
ストで被覆し、導電性ペーストで被覆された電極表面の
少なくとも一部を、導電性ペーストで覆われた状態下で
摩擦処理を付すため、表面酸化層が除去された部分が大
気に曝されて再酸化することを防止できる。このため一
対の電極を接続するとき、表面酸化層が部分的に除去さ
れた部位を有するので、一対の電極間の導通抵抗を小さ
くすることができ、且つ接続強度を大きくすることがで
きる。According to the method for manufacturing an electronic component according to the present invention,
The surface of at least one electrode of the pair of electrodes is coated with a conductive paste, and at least a part of the electrode surface coated with the conductive paste is subjected to a friction treatment under a state covered with the conductive paste. The portion from which the oxide layer has been removed can be prevented from being exposed to the atmosphere and reoxidized. For this reason, when the pair of electrodes are connected, since the surface oxide layer has a portion that is partially removed, conduction resistance between the pair of electrodes can be reduced, and the connection strength can be increased.
【００３７】また、貼着する工程が、摩擦処理に付す工
程より後に行われるので、第２の電極に邪魔されること
なしに導電性ペーストが形成されたすべての領域にわた
って表面酸化層の除去が可能である。Further, since the attaching step is performed after the step of subjecting to a friction treatment, the removal of the surface oxide layer can be performed over all the regions where the conductive paste has been formed without disturbing the second electrode. It is possible.
【００３８】また、貼着する工程が、摩擦処理に付す工
程より前に行われるので、第２の電極を貼着時に導電性
ペーストが広がるため、より広い範囲にわたって表面酸
化層の除去が可能である。Further, since the step of attaching is performed before the step of subjecting to friction treatment, the conductive paste spreads when attaching the second electrode, so that the surface oxide layer can be removed over a wider range. is there.
【００３９】また、少なくとも一方の電極と他の電極と
を導電性ペーストを介して粘着するときに、他の電極が
粘着面側に突起部を有しており、摩擦処理が、粘着時又
は粘着後にこの突起部を移動することにより行われるた
め、工程数が少なくなり、生産性の向上を図ることがで
きる。When at least one electrode and the other electrode are adhered to each other via the conductive paste, the other electrode has a projection on the adhesive surface side, and the friction treatment is performed when the adhesive is applied or when the adhesive is applied. Since the projection is performed later by moving the projection, the number of steps is reduced, and productivity can be improved.
【００４０】また、導電性ペーストの被覆が、導電性ペ
ーストの塗布器具で行われ、摩擦処理がこの塗布器具の
先端の移動により導電性ペーストの被覆と並行して行わ
れるため、工程数が少なくなり、生産性の向上を図るこ
とができる。Further, since the coating of the conductive paste is performed by a conductive paste coating device, and the frictional treatment is performed in parallel with the conductive paste coating by moving the tip of the coating device, the number of steps is small. Thus, productivity can be improved.
【００４１】また、一対の電極の少なくとも一方の電極
の表面の一部に、表面酸化層を除去しながら当該少なく
とも一方の電極の材料よりも難酸化性の材料からなる接
続電極を密着形成するので、表面酸化層が部分的に除去
された部位を有するように一対の電極を接続することが
でき、一対の電極間の導通抵抗を小さくすることがで
き、且つ接続強度を大きくすることができる。Further, a connection electrode made of a material that is more resistant to oxidation than the material of the at least one electrode is formed in close contact with a part of the surface of at least one of the pair of electrodes while removing the surface oxide layer. In addition, the pair of electrodes can be connected so as to have a portion where the surface oxide layer is partially removed, the conduction resistance between the pair of electrodes can be reduced, and the connection strength can be increased.
【００４２】この発明に係る電子部品の接続構造は、表
面酸化層を有する電極と他の電極とが電気的に接続され
た構造であって、この表面酸化層を有する電極は、表面
酸化層が部分的に除去された部位と表面酸化層が残存す
る部位とからなる不均一接続領域を備え、この不均一接
続領域上に形成された導電性接着層を介して、当該表面
酸化層を有する電極と他の電極とが電気的に接続されて
いるので、一対の電極間の導通抵抗が小さく、且つ接続
強度が大きい。The connection structure for electronic parts according to the present invention is a structure in which an electrode having a surface oxide layer is electrically connected to another electrode. An electrode having a non-uniform connection region consisting of a part that is partially removed and a part where a surface oxide layer remains, and an electrode having the surface oxide layer via a conductive adhesive layer formed on the non-uniform connection region And the other electrode are electrically connected, so that the conduction resistance between the pair of electrodes is small and the connection strength is large.
【００４３】また、表面酸化層を有する電極は、表面酸
化層が部分的に除去された部位、表面酸化層が残存する
部位及び上記表面酸化層が除去された部位上に形成され
た難酸化性の材料からなる接続電極を備えた不均一接続
領域を備え、この不均一接続領域上に形成された導電性
接着層を介して、当該表面酸化層を有する電極と他の電
極とが電気的に接続されているので、一対の電極間の導
通抵抗が小さく、且つ接続強度が大きい。Further, the electrode having the surface oxide layer has a portion where the surface oxide layer is partially removed, a portion where the surface oxide layer remains, and a hardly oxidizable layer formed on the portion where the surface oxide layer is removed. A non-uniform connection region provided with a connection electrode made of a material of the type described above, and an electrode having the surface oxide layer and another electrode are electrically connected via a conductive adhesive layer formed on the non-uniform connection region. Since they are connected, conduction resistance between the pair of electrodes is small and connection strength is large.
【図１】 この発明の実施の形態１の電子部品の製造方
法を説明する図であり、電極接続部の断面説明図であ
る。FIG. 1 is a diagram for explaining a method for manufacturing an electronic component according to a first embodiment of the present invention, and is a cross-sectional explanatory diagram of an electrode connecting portion.
【図２】 この発明の実施の形態３の電子部品の製造方
法を説明する図であり、電極接続部の断面説明図であ
る。FIG. 2 is a diagram illustrating a method for manufacturing an electronic component according to a third embodiment of the present invention, and is a cross-sectional explanatory diagram of an electrode connection portion.
【図３】 この発明の実施の形態４の電子部品の製造方
法を説明する図であり、その（ａ）は第２の電極を貼着
した状態の電極接続部の斜視説明図、その（ｂ）は第２
の電極を貼着した状態の他の構成を示す電極接続部の斜
視説明図、その（ｃ）は（ａ）及び（ｂ）のＡ−Ａ方向
の断面に相当する図であり、スクレーパーで表面酸化物
を摩擦除去中の状態を示す図である。3A and 3B are diagrams illustrating a method for manufacturing an electronic component according to a fourth embodiment of the present invention, in which FIG. 3A is a perspective explanatory view of an electrode connection portion with a second electrode attached, and FIG. ) Is the second
FIG. 3C is a perspective explanatory view of an electrode connecting portion showing another configuration in which the electrodes are adhered, and FIG. 4C is a diagram corresponding to a cross section in the AA direction of FIGS. It is a figure which shows the state during the friction removal of an oxide.
【図４】 この発明の実施の形態５の電子部品の製造方
法を説明する図であり、電極接続部の断面説明図であ
る。FIG. 4 is a diagram illustrating a method for manufacturing an electronic component according to a fifth embodiment of the present invention, and is a cross-sectional explanatory view of an electrode connecting portion.
【図５】 この発明の実施の形態６の電子部品の製造方
法を説明する図であり、電極接続部の断面説明図であ
る。FIG. 5 is a diagram illustrating a method for manufacturing an electronic component according to a sixth embodiment of the present invention, and is a cross-sectional explanatory view of an electrode connection portion.
【図６】 この発明の実施の形態６の電子部品の製造方
法に用いる第２の電極の変形例を示す図であり、第２の
電極の断面説明図である。FIG. 6 is a view showing a modification of the second electrode used in the method for manufacturing an electronic component according to the sixth embodiment of the present invention, and is an explanatory cross-sectional view of the second electrode.
【図７】 この発明の実施の形態６の電子部品の製造方
法に用いる第２の電極の別の変形例を示す図であり、第
２の電極の断面説明図である。FIG. 7 is a view showing another modification of the second electrode used in the method for manufacturing an electronic component according to the sixth embodiment of the present invention, and is a cross-sectional explanatory view of the second electrode.
【図８】 この発明の実施例１及び比較例１の電子部品
の製造方法の効果を比較するための図であり、摩擦処理
回数と導通抵抗の関係を測定した結果を示す図である。FIG. 8 is a diagram for comparing the effects of the electronic component manufacturing methods of Example 1 and Comparative Example 1 of the present invention, and is a diagram illustrating a result of measuring a relationship between the number of times of friction processing and conduction resistance.
【図９】 従来の電子部品の製造方法を説明する図であ
り、電極接続部の断面説明図である。FIG. 9 is a diagram illustrating a conventional method for manufacturing an electronic component, and is a cross-sectional view illustrating an electrode connection portion.
１ 第１の電極 ２ 表面酸化層 ３，１８，３２ スクレーパー ６ 導電性ペースト ７，１７，２７，２９，４４，４９，５１ 第２の電極 ８ 導電性接着層 ４３ 接続電極 REFERENCE SIGNS LIST 1 first electrode 2 surface oxide layer 3, 18, 32 scraper 6 conductive paste 7, 17, 27, 29, 44, 49, 51 second electrode 8 conductive adhesive layer 43 connection electrode
───────────────────────────────────────────────────── フロントページの続き (72)発明者 加柴 良裕 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 (72)発明者 村上 英信 東京都千代田区丸の内二丁目２番３号 三 菱電機株式会社内 Ｆターム(参考） 5E023 AA16 AA29 BB18 BB22 FF05 HH08 HH11 HH28 5F044 LL07 RR02 5F067 AA13 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshihiro Kashiba 2-3-2 Marunouchi, Chiyoda-ku, Tokyo Inside Mitsubishi Electric Corporation (72) Inventor Hidenobu Murakami 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F term (reference) in Mitsubishi Electric Corporation 5E023 AA16 AA29 BB18 BB22 FF05 HH08 HH11 HH28 5F044 LL07 RR02 5F067 AA13
Claims (8)
面を導電性ペーストで被覆する工程と、 上記導電性ペーストで被覆された電極表面の少なくとも
一部を、当該導電性ペーストで覆われた状態下で、摩擦
処理に付す工程と、 上記少なくとも一方の電極と他の電極とを、上記導電性
ペーストを介して貼着する工程と、 上記導電性ペーストを硬化処理に付すことにより、上記
少なくとも一方の電極と他の電極とが電気的に接続され
た接続構造を得る工程と、を備えてなる電子部品の製造
方法。A step of coating a surface of at least one electrode of the pair of electrodes with a conductive paste, and a state in which at least a part of the electrode surface coated with the conductive paste is covered with the conductive paste. Below, a step of subjecting to a friction treatment, a step of attaching the at least one electrode and the other electrode via the conductive paste, and a step of subjecting the conductive paste to a curing treatment, whereby at least one of the Obtaining a connection structure in which the electrode and another electrode are electrically connected to each other.
り後に行われる請求項１記載の電子部品の製造方法。2. The method for manufacturing an electronic component according to claim 1, wherein the step of attaching is performed after the step of subjecting to a friction treatment.
り前に行われる請求項１記載の電子部品の製造方法。3. The method for producing an electronic component according to claim 1, wherein the attaching step is performed before the step of subjecting to a friction treatment.
おり、摩擦処理が、上記少なくとも一方の電極との粘着
時又は粘着後に、この突起部を移動することにより行わ
れる請求項１記載の電子部品の製造方法。4. The method according to claim 1, wherein the other electrode has a protrusion on the adhesive surface side, and the frictional treatment is performed by moving the protrusion at the time of adhesion to the at least one electrode or after the adhesion. Item 7. A method for manufacturing an electronic component according to Item 1.
トの塗布器具で行われ、摩擦処理がこの塗布器具の先端
の移動により導電性ペーストの被覆と並行して行われる
請求項１記載の電子部品の製造方法。5. The electronic device according to claim 1, wherein the coating of the conductive paste is performed with a conductive paste application device, and the frictional treatment is performed in parallel with the coating of the conductive paste by moving a tip of the application device. The method of manufacturing the part.
面の一部に、表面酸化層を除去しながら当該少なくとも
一方の電極の材料よりも難酸化性の材料からなる接続電
極を密着形成する工程と、 上記接続電極が形成された少なくとも一方の電極の表面
を導電性ペーストで被覆する工程と、 上記少なくとも一方の電極と他の電極とを、上記導電性
ペーストを介して貼着する工程と、 上記導電性ペーストを硬化処理に付すことにより、上記
少なくとも一方の電極と他の電極とが電気的に接続され
た接続構造を得る工程と、を備えてなる電子部品の製造
方法。6. A step of forming, on a part of the surface of at least one of the pair of electrodes, a connection electrode made of a material that is more resistant to oxidation than the material of the at least one electrode while removing a surface oxide layer. And a step of coating the surface of at least one electrode on which the connection electrode is formed with a conductive paste, and a step of attaching the at least one electrode and another electrode via the conductive paste, Subjecting the conductive paste to a curing treatment to obtain a connection structure in which the at least one electrode and the other electrode are electrically connected to each other.
電気的に接続された構造であって、この表面酸化層を有
する電極は、表面酸化層が部分的に除去された部位と表
面酸化層が残存する部位とからなる不均一接続領域を備
え、この不均一接続領域上に形成された導電性接着層を
介して、当該表面酸化層を有する電極と他の電極とが電
気的に接続されてなる電子部品の接続構造。7. A structure in which an electrode having a surface oxide layer is electrically connected to another electrode, and the electrode having the surface oxide layer has a structure in which a portion where the surface oxide layer is partially removed and a surface are provided. An electrode having a surface oxide layer and another electrode are electrically connected to each other through a conductive adhesive layer formed on the uneven connection region including a region where the oxide layer remains. Connection structure of connected electronic components.
電気的に接続された構造であって、この表面酸化層を有
する電極は、表面酸化層が部分的に除去された部位、表
面酸化層が残存する部位及び上記表面酸化層が除去され
た部位上に形成された難酸化性の材料からなる接続電極
を備えた不均一接続領域を備え、この不均一接続領域上
に形成された導電性接着層を介して、当該表面酸化層を
有する電極と他の電極とが電気的に接続されてなる電子
部品の接続構造。8. A structure in which an electrode having a surface oxide layer is electrically connected to another electrode, and the electrode having the surface oxide layer has a structure in which the surface oxide layer is partially removed, A non-uniform connection region including a connection electrode made of a hardly oxidizable material formed on a portion where the oxide layer remains and a portion where the surface oxide layer has been removed, and formed on the non-uniform connection region. A connection structure of an electronic component in which an electrode having the surface oxide layer and another electrode are electrically connected via a conductive adhesive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000298349A JP2002110750A (en) | 2000-09-29 | 2000-09-29 | Method for manufacturing electronic component, and its connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000298349A JP2002110750A (en) | 2000-09-29 | 2000-09-29 | Method for manufacturing electronic component, and its connection structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2002110750A true JP2002110750A (en) | 2002-04-12 |
Family
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000298349A Pending JP2002110750A (en) | 2000-09-29 | 2000-09-29 | Method for manufacturing electronic component, and its connection structure |
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| Country | Link |
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| JP (1) | JP2002110750A (en) |
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| CN103503132A (en) * | 2011-06-09 | 2014-01-08 | 三菱电机株式会社 | Semiconductor device |
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| EP2693474B1 (en) * | 2012-07-31 | 2020-11-25 | Littelfuse, Inc. | Method of manufacturing a semiconductor die assembly with a clip bonded to an aluminium pad coated by a sintered silver structure and with a wire bonded to an uncoated aluminium pad |
| WO2017187998A1 (en) * | 2016-04-26 | 2017-11-02 | 三菱電機株式会社 | Semiconductor device |
| CN109168320A (en) * | 2016-04-26 | 2019-01-08 | 三菱电机株式会社 | Semiconductor device |
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